of a plurality of connectors

Industry

CPC
H01L24/70

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/70of a plurality of connectors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Image sensor
- Patent number 12,142,626
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomomi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,943,842
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,580,710
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-adhesive die
- Patent number 10,312,212
- Issue date Jun 4, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Power semiconductor device and package
- Patent number 10,229,861
- Issue date Mar 12, 2019
- Sabin Lupan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quilt packaging system with mated metal interconnect nodules and voids
- Patent number 10,050,027
- Issue date Aug 14, 2018
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die to package and die to die interconnects suspended o...
- Patent number 9,837,372
- Issue date Dec 5, 2017
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quilt packaging system with interdigitated interconnecting nodules...
- Patent number 9,620,473
- Issue date Apr 11, 2017
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical bus in 3D integrated circuit stack
- Patent number 9,401,346
- Issue date Jul 26, 2016
- Chee Yee Kwok
- G02 - OPTICS
Information Patent Grant
Semiconductor device with an interlocking structure
- Patent number 9,142,528
- Issue date Sep 22, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Keat Chuan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 9,041,180
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Yong-Kwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an electrically conducting mechanical interconnec...
- Patent number 8,178,416
- Issue date May 15, 2012
- Centre National de la Recherche Scientifique
- Patrice Simon
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20250031477
- Publication date Jan 23, 2025
- Sony Semiconductor Solutions Corporation
- Tomomi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20200168517
- Publication date May 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20190067137
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...
- Publication number 20180294211
- Publication date Oct 11, 2018
- Georgia Tech Research Corporation
- MUHANNAD S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Package
- Publication number 20180294204
- Publication date Oct 11, 2018
- Sabin Lupan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150262957
- Publication date Sep 17, 2015
- Shinko Electric Industries Co., LTD.
- Yoshihiro Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN INTERLOCKING STRUCTURE
- Publication number 20150228611
- Publication date Aug 13, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Keat Chuan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS
- Publication number 20150214179
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Multiple Contact Clips
- Publication number 20150214189
- Publication date Jul 30, 2015
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK
- Publication number 20150206856
- Publication date Jul 23, 2015
- Chee Yee KWOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ADHESIVE DIE
- Publication number 20150171046
- Publication date Jun 18, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY CONNECTED INTEGRATED CIRCUITS
- Publication number 20150145136
- Publication date May 28, 2015
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OBTAINING THREE-DIMENSIONAL ACTIN STRUCTURES AND USES TH...
- Publication number 20150048513
- Publication date Feb 19, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATVIES
- Jean-Christophe Gabriel
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
- Publication number 20150035171
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140361442
- Publication date Dec 11, 2014
- Yong-Kwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK
- Publication number 20130108211
- Publication date May 2, 2013
- Chee Yee Kwok
- G02 - OPTICS
Information Patent Application
METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNEC...
- Publication number 20100308473
- Publication date Dec 9, 2010
- Centre Nat De La Recherche Scientifique
- Patrice Simon
- B82 - NANO-TECHNOLOGY

of a plurality of connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image sensor

Semiconductor device with a protection mechanism and associated sys...

Semiconductor device with a protection mechanism and associated sys...

Semiconductor device with a protection mechanism and associated sys...

Self-adhesive die

Power semiconductor device and package

Quilt packaging system with mated metal interconnect nodules and voids

Method for producing structured sintered connection layers, and sem...

Semiconductor device having multiple contact clips

Wafer-level die to package and die to die interconnects suspended o...

Quilt packaging system with interdigitated interconnecting nodules...

Segmented bond pads and methods of fabrication thereof

Optical bus in 3D integrated circuit stack

Semiconductor device with an interlocking structure

Method for obtaining three-dimensional actin structures and uses th...

Semiconductor package and method of manufacturing the semiconductor...

Method for making an electrically conducting mechanical interconnec...

Patents Applicationslast 30 patents

IMAGE SENSOR

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...

Power Semiconductor Device and Package

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH AN INTERLOCKING STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS

Semiconductor Device Having Multiple Contact Clips

OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK

SELF-ADHESIVE DIE

VERTICALLY CONNECTED INTEGRATED CIRCUITS

METHOD FOR OBTAINING THREE-DIMENSIONAL ACTIN STRUCTURES AND USES TH...

Segmented Bond Pads and Methods of Fabrication Thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Method for Producing Structured Sintered Connection Layers, and Sem...

OPTICAL BUS IN 3D INTEGRATED CIRCUIT STACK

METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNEC...