of a plurality of layer connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/30of a plurality of layer connectors

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,009,349
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,804,464
- Issue date Oct 31, 2023
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for wavelength conversion using layers of different photo...
- Patent number 11,765,477
- Issue date Sep 19, 2023
- Sony Group Corporation
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with temperature sensors and shaped top...
- Patent number 11,728,251
- Issue date Aug 15, 2023
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DMOS FET chip scale package and method of making the same
- Patent number 11,699,627
- Issue date Jul 11, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a recurrent neural network computer
- Patent number 11,489,012
- Issue date Nov 1, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Elisa Vianello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, manufacturing method thereof, and display device
- Patent number 11,404,448
- Issue date Aug 2, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Bo Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20240371841
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240355724
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240304537
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
- Publication number 20240290741
- Publication date Aug 29, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER POWER MODULE
- Publication number 20240258196
- Publication date Aug 1, 2024
- AMOSENSE CO., LTD.
- Kyungwhan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243111
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame, Packaging Structure and Packaging Method
- Publication number 20240234259
- Publication date Jul 11, 2024
- DIODES INCORPORATED
- MeiDan Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203813
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THE...
- Publication number 20240079354
- Publication date Mar 7, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Yingwei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
- Publication number 20240079365
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055332
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20230412941
- Publication date Dec 21, 2023
- SONY GROUP CORPORATION
- Atsushi TODA
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with lead between a plurality of encapsulated...

Selectable monolithic or external scalable die-to-die interconnecti...

Semiconductor device and method for manufacturing semiconductor device

Display device including connection pad part and electronic compone...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Display panel, preparation method thereof, and display device

Semiconductor device having high yield strength intermediate plate

Vertical semiconductor package including horizontally stacked dies...

Semiconductor package and method of forming same

Structure and formation method of chip package with protective lid

Interconnect structure and forming method thereof

Package comprising spacers between integrated devices

Electronic device and manufacturing method of electronic device

Selectable monolithic or external scalable die-to-die interconnecti...

Lead between a plurality of encapsulated MOSFETs

Semiconductor device and manufacturing method thereof

Method for manufacturing display panel, display panel, and display...

Apparatus for wavelength conversion using layers of different photo...

Connection structure

Semiconductor power module with temperature sensors and shaped top...

DMOS FET chip scale package and method of making the same

Bump-on-trace design for enlarge bump-to-trace distance

Flip chip backside mechanical die grounding techniques

Power module comprising two substrates and method of manufacturing...

Method for producing structure, and structure

Chemical mechanical polishing for hybrid bonding

Method of producing a recurrent neural network computer

Micro LED display and manufacturing method with conductive film

Display substrate, manufacturing method thereof, and display device

Adhesive film, semiconductor apparatus using the same, and semicond...

Patents Applicationslast 30 patents

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

ELECTRONIC DEVICE

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

INVERTER POWER MODULE

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE

Lead Frame, Packaging Structure and Packaging Method

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THE...

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

SEMICONDUCTOR PACKAGE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...