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SEMICONDUCTOR PACKAGE
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Publication number 20240162184
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Publication date May 16, 2024
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Samsung Electronics Co., Ltd.
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Sang-Sick Park
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240079340
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Publication date Mar 7, 2024
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Samsung Electronics Co., Ltd.
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Hyunsoo CHUNG
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240055329
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Publication date Feb 15, 2024
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ROHM CO., LTD.
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Kentaro NASU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240055332
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Publication date Feb 15, 2024
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ROHM CO., LTD.
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Xiaopeng WU
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGE
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Publication number 20240047407
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Publication date Feb 8, 2024
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STMicroelectronics (Grenoble 2) SAS
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Younes BOUTALEB
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240047422
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Publication date Feb 8, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsien-Wei Chen
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H01 - BASIC ELECTRIC ELEMENTS
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Triple-Sided Module
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Publication number 20230343704
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Publication date Oct 26, 2023
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Avago Technologies International Sales Pte. Limited
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Dingyou Zhang
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H01 - BASIC ELECTRIC ELEMENTS
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LOW TEMPERATURE BONDED STRUCTURES
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Publication number 20230268307
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Publication date Aug 24, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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