of a plurality of layer connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33of a plurality of layer connectors

Industries

Patents Grantslast 30 patents

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of a plurality of layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Die attached leveling control by metal stopper bumps

Systems and methods for data recorder for inverter for electric veh...

Switching device and electronic circuit

Systems and methods for an interlocking feature on a power module

Window ball grid array (WBGA) package and method for manufacturing...

Packaging architecture for disaggregated integrated voltage regulators

Method for manufacturing display device and apparatus for manufactu...

Multi-chip package having stress relief structure

DBI to SI bonding for simplified handle wafer

Dual cool power module with stress buffer layer

Systems and methods for cooling system and power module for inverte...

Semiconductor package and method of fabricating same

Systems and methods for parameter drift correction for inverter for...

Shielding of packaged magnetic random access memory

Light emitting device and manufacturing method therefor

Stacking structure, package structure and method of fabricating the...

Three-dimensional device structure including substrate-embedded int...

Semiconductor structure and method of forming the same

Stacked die package including a multi-contact interconnect

Display device with piezoelectric actuator

Systems and methods for cooling system and power module for inverte...

Microelectronic structures including bridges

Display substrate, tiled display panel and display device

Semiconductor package

High power module package structures

Semiconductor package and related methods

Method for manufacturing semiconductor device and semiconductor device

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER

STACK CHIP PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES WITH CHIP STACK

SEMICONDUCTOR PACKAGE

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR PACKAGE

BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

SEMICONDUCTOR PACKAGE

RELIABLE SEMICONDUCTORS PACKAGES

SEMICONDUCTOR PACKAGE

Packaging electronic device with liquid thermal interface material

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...

CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...

SEMICONDUCTOR PACKAGE