of a plurality of wire connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/49of a plurality of wire connectors

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Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Contact with bronze material to mitigate undercut
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- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Switching device and electronic circuit

Light-emitting device

Temperature-stable composite of a stranded wire having a contact pad

Semiconductor package system and related methods

Package for power semiconductor devices

Semiconductor packages having photon integrated circuit (PIC) chips

Semiconductor package

Semiconductor package

Power module and process for manufacturing the same

Semiconductor packages and methods of forming same

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor device and method for manufacturing the same

Semiconductor device including re-distribution pads disposed at dif...

Semiconductor module with bond wire loop exposed from a molded body...

Semiconductor device and method for manufacturing the same

Semiconductor power module

Semiconductor element, apparatus, and chip

Package structure

Bond pad connection layout

Hermetic package for high CTE mismatch

Technologies for on-circuit board de-embedding

Semiconductor device

Semiconductor package with thermal relaxation block and manufacturi...

Wire bond wires for interference shielding

ESD protection for multi-die integrated circuits (ICs) including in...

Bonding wire, semiconductor package including the same, and wire bo...

Through stack bridge bonding devices and associated methods

Semiconductor package

Contact with bronze material to mitigate undercut

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

RELIABLE SEMICONDUCTORS PACKAGES

INTELLIGENT POWER MODULE ARRANGEMENT

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

WIREBOND MULTICHIP PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MO...

AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

DAM LAMINATE ISOLATION SUBSTRATE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE