of a plurality of wire connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/49of a plurality of wire connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,961,807
- Issue date Apr 16, 2024
- Silicon Works Co., Ltd.
- Myoung Su Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,411
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact leadframe package
- Patent number 11,948,868
- Issue date Apr 2, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,948,919
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,942,449
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 11,935,602
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of floated singulation
- Patent number 11,935,789
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Chang-Yen Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,923,825
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,328
- Issue date Feb 13, 2024
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,901,340
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with an electrode-attached frame supported by a heat sink,...
- Patent number 11,901,268
- Issue date Feb 13, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 11,894,290
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power electronics
- Patent number 11,887,953
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction in susceptibility of analog integrated circuits and senso...
- Patent number 11,887,937
- Issue date Jan 30, 2024
- ams International AG
- Benjamin Joseph Sheahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,963
- Issue date Jan 30, 2024
- Kioxia Corporation
- Kazuma Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device lead frame and method of fabrication
- Patent number 11,881,445
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation
- Patent number 11,881,434
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Connie Alagadan Esteron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240136319
- Publication date Apr 25, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136347
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240136335
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRIPS
- Publication number 20240128094
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
- Publication number 20240112993
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CAPACITANCE ESD PROTECTION DEVICES
- Publication number 20240113098
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreeram Nasum Subramanyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGNITER AND ENGINE IGNITION DEVICE
- Publication number 20240102438
- Publication date Mar 28, 2024
- Rohm Co., Ltd.
- Hiroyuki TANIGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
- Publication number 20240105565
- Publication date Mar 28, 2024
- LAPIS SEMICONDUCTOR CO., LTD.
- Toshihisa SONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR POWER ELECTRONICS
- Publication number 20240105651
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20240096387
- Publication date Mar 21, 2024
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...
- Publication number 20240096767
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hank Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...
- Publication number 20240096761
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- BARRY JON MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20240096823
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240087995
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240088796
- Publication date Mar 14, 2024
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
- Publication number 20240088010
- Publication date Mar 14, 2024
- Sony Semiconductor Solutions Corporation
- SHINGO HAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079400
- Publication date Mar 7, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079370
- Publication date Mar 7, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071875
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Hiroyuki TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071997
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package

Devices and methods related to dual-sided radio-frequency package w...

Semiconductor device assemblies including multiple stacks of differ...

Semiconductor package including stacked chip structure

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor device

Compact leadframe package

Semiconductor package including a dummy pad

Semiconductor module and method for manufacturing semiconductor module

Stacked semiconductor package

Semiconductor arrangement and method for producing the same

Semiconductor device including sense insulated-gate bipolar transistor

Semiconductor device and method of manufacturing semiconductor device

Switching device and electronic circuit

Power management

Method of floated singulation

Semiconductor device and method for manufacturing the same

Semiconductor device including a bidirectional switch

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor device

Semiconductor power module

Package with an electrode-attached frame supported by a heat sink,...

Packaged stackable electronic power device for surface mounting and...

Package for power electronics

Reduction in susceptibility of analog integrated circuits and senso...

Semiconductor device

High voltage semiconductor device lead frame and method of fabrication

Semiconductor die singulation

Semiconductor package

Patents Applicationslast 30 patents

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

INTERCONNECT STRIPS

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

SEMICONDUCTOR PACKAGE

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...

GALVANIC ISOLATION DEVICE

LOW CAPACITANCE ESD PROTECTION DEVICES

IGNITER AND ENGINE IGNITION DEVICE

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

PACKAGE FOR POWER ELECTRONICS

DOCUMENT STRUCTURE FORMATION

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...

SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND IMAGING DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE

CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE