of a plurality of wire connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49of a plurality of wire connectors

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Patents Grantslast 30 patents

Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
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Information Patent Grant
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Doped-zirconia ceramic ribbon
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Patents Applicationslast 30 patents

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SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...
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MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
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SELECTIVE WIRE COATING DURING WIRE BONDING
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
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- H01 - BASIC ELECTRIC ELEMENTS
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- NEXPERIA B.V.
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- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-typed integrated passive device (IPD) components and devices...

ESD protection device

DC and AC magnetic field protection for MRAM device using magnetic-...

Semiconductor device and method of manufacturing the same

Package-on-package assembly with wire bond vias

Power semiconductor package having first and second lead frames

Reliable semiconductor packages

Semiconductor package structure and packaging method thereof

Semiconductor module

Semiconductor packages

Package structure

Semiconductor fuse with multi-bond wire

Semiconductor device

Doped-zirconia ceramic ribbon

Methods of determining a sequence for creating a plurality of wire...

Semiconductor device

Semiconductor device

Method for forming an electrical connection between an electronic c...

Semiconductor device

Semiconductor package

Semiconductor device and temperature measurement method

Isolation device and method of transmitting a signal across an isol...

Semiconductor device and semiconductor package

Long-life extended temperature range embedded diode design for elec...

Light bulb shaped lamp

Power amplifier modules including semiconductor resistor and tantal...

Solid state lighting devices with accessible electrodes and methods...

Transceiver and interface for IC package

Memory device comprising programmable command-and-address and/or da...

Semiconductor package including stacked semiconductor chips

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

SEMICONDUCTOR DEVICE

Semiconductor Device and Method Using Lead Frame Interposer in Bump...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

COMPUTING DEVICE

Semiconductor Chip Package and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING MEMORY DEVICES STACKED IN STAIRCASE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

ELECTRONIC DEVICE

OUTPUT MATCHING NETWORK TO REDUCE SELF AND MUTUAL INDUCTANCES OF OU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SELECTIVE WIRE COATING DURING WIRE BONDING

POWER MODULE STRUCTURE

SEMICONDUCTOR DEVICE

OPTOELECTRONIC SYSTEM

ROLL TO ROLL SINTERING SYSTEM FOR WIDE INORGANIC TAPE MATERIAL AND...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

CATHODE FOR A SOLID-STATE BATTERY

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...