of a plurality of wire connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/46of a plurality of wire connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement comprising a semiconductor element, a sub...
- Patent number 12,136,603
- Issue date Nov 5, 2024
- Siemens Aktiengesellschaft
- Bernd Kürten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die, probe and ultrasound system
- Patent number 12,128,443
- Issue date Oct 29, 2024
- Koninklijke Philips N.V.
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile semiconductor memory device and fabrication method of t...
- Patent number 11,963,371
- Issue date Apr 16, 2024
- Kioxia Corporation
- Kotaro Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing substrates with coefficient of...
- Patent number 11,929,310
- Issue date Mar 12, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,916,029
- Issue date Feb 27, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices incorporating stacked bonds and methods of forming the same
- Patent number 11,908,823
- Issue date Feb 20, 2024
- Wolfspeed, Inc.
- Erwin Orejola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with an electrode-attached frame supported by a heat sink,...
- Patent number 11,901,268
- Issue date Feb 13, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,894,349
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic memory device having an electrode continuously provided on...
- Patent number 11,895,925
- Issue date Feb 6, 2024
- Kioxia Corporation
- Hiroyuki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for manufacturing semicondu...
- Patent number 11,889,698
- Issue date Jan 30, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated temperature sensor package with embedded spacer in dielect...
- Patent number 11,879,790
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,856,880
- Issue date Dec 26, 2023
- Kioxia Corporation
- Hiroyuki Ode
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device that includes a semiconductor column th...
- Patent number 11,856,774
- Issue date Dec 26, 2023
- Kioxia Corporation
- Toshifumi Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for manufacturing the same
- Patent number 11,785,773
- Issue date Oct 10, 2023
- Kioxia Corporation
- Hiroshi Nakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package-on-package device and bonding appar...
- Patent number 11,776,946
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Junho Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chip mounted on die pad and...
- Patent number 11,769,714
- Issue date Sep 26, 2023
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,756,918
- Issue date Sep 12, 2023
- Kioxia Corporation
- Tsutomu Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,728,298
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,706,921
- Issue date Jul 18, 2023
- Kioxia Corporation
- Yosuke Murakami
- G11 - INFORMATION STORAGE
Information Patent Grant
Leadframe capacitors
- Patent number 11,688,672
- Issue date Jun 27, 2023
- Texas Instruments Incorporated
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with side solder ball contact and method of manuf...
- Patent number 11,658,098
- Issue date May 23, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having inner lead exposed from sealing resin,...
- Patent number 11,652,032
- Issue date May 16, 2023
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20240379621
- Publication date Nov 14, 2024
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321655
- Publication date Sep 26, 2024
- Fuji Electric Co., Ltd.
- Shuangching CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...
- Publication number 20240266312
- Publication date Aug 8, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258186
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240222284
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Bongju CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20240120322
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE THAT INCLUDES A SEMICONDUCTOR COLUMN TH...
- Publication number 20240081065
- Publication date Mar 7, 2024
- KIOXIA Corporation
- Toshifumi HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240047438
- Publication date Feb 8, 2024
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...
- Publication number 20230411340
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369278
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230369174
- Publication date Nov 16, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Miaomiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343735
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20230174828
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163093
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Fumihito KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
- Publication number 20230139201
- Publication date May 4, 2023
- Sony Semiconductor Solutions Corporation
- Kenta FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED TEMPERATURE SENSOR PACKAGE WITH EMBEDDED SPACER IN DIELECT...
- Publication number 20230138475
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- G01 - MEASURING TESTING
Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20230086535
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20230025045
- Publication date Jan 26, 2023
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230015101
- Publication date Jan 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220359327
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220328412
- Publication date Oct 13, 2022
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Branched Proximal Connectors For High Density Neural Interfaces
- Publication number 20220323773
- Publication date Oct 13, 2022
- Verily Life Sciences LLC
- Bo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20220320056
- Publication date Oct 6, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCORPORATING STACKED BONDS AND METHODS OF FORMING THE SAME
- Publication number 20220223559
- Publication date Jul 14, 2022
- Wolfspeed, Inc.
- Erwin Orejola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181281
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat slug attached to a die pad for semiconductor package

Semiconductor arrangement comprising a semiconductor element, a sub...

Semiconductor packages

IC die, probe and ultrasound system

Package with electrically insulated carrier and at least one step o...

Light-emitting substrate, method of manufacturing light-emitting su...

Plurality of overlapping power terminals in a semiconductor module

Nonvolatile semiconductor memory device and fabrication method of t...

Radio frequency packages containing substrates with coefficient of...

Semiconductor device

Devices incorporating stacked bonds and methods of forming the same

Package with an electrode-attached frame supported by a heat sink,...

Semiconductor device comprising PN junction diode and Schottky barr...

Magnetic memory device having an electrode continuously provided on...

Semiconductor storage device and method for manufacturing semicondu...

Isolated temperature sensor package with embedded spacer in dielect...

Package with electrically insulated carrier and at least one step o...

Semiconductor storage device

Semiconductor memory device that includes a semiconductor column th...

Semiconductor device and method of manufacturing the same

Semiconductor storage device and method for manufacturing the same

Method of manufacturing package-on-package device and bonding appar...

Semiconductor device with semiconductor chip mounted on die pad and...

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor storage device

Leadframe capacitors

Leadframe package with side solder ball contact and method of manuf...

Semiconductor device having inner lead exposed from sealing resin,...

Ultra-thin embedded semiconductor device package and method of manu...

Patents Applicationslast 30 patents

MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR MEMORY DEVICE THAT INCLUDES A SEMICONDUCTOR COLUMN TH...

SEMICONDUCTOR EQUIPMENT

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

SEMICONDUCTOR DEVICE

IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT

ISOLATED TEMPERATURE SENSOR PACKAGE WITH EMBEDDED SPACER IN DIELECT...

COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGES

Branched Proximal Connectors For High Density Neural Interfaces

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

DEVICES INCORPORATING STACKED BONDS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE