of a wire bonded chip

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/18165of a wire bonded chip

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step decapsulation technique for semiconductor package having s...
- Patent number 12,106,973
- Issue date Oct 1, 2024
- Silicon Laboratories Inc.
- Erwin Hendarto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,027,545
- Issue date Jul 2, 2024
- Tong Hsing Electronic Industries, Ltd.
- Jui-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip support device and corresponding manufacturing method
- Patent number 11,916,353
- Issue date Feb 27, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,817,445
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,798,870
- Issue date Oct 24, 2023
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and method of making
- Patent number 11,735,435
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Dan Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,581,260
- Issue date Feb 14, 2023
- Kore Semiconductor Co., Ltd.
- Chi-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including two joint structures including differen...
- Patent number 11,276,661
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,270,989
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,164,857
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including through conductors in sealing body
- Patent number 11,158,597
- Issue date Oct 26, 2021
- Renesas Electronics Corporation
- Wataru Shiroi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device and process for manufacturing an in...
- Patent number 11,069,587
- Issue date Jul 20, 2021
- STMicroelectronics S.r.l.
- Giovanni Campardo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including a fan-out sub-package
- Patent number 11,004,831
- Issue date May 11, 2021
- SK hynix Inc.
- Seung Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,971,429
- Issue date Apr 6, 2021
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,944,046
- Issue date Mar 9, 2021
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and modules related to shielded lead frame packages
- Patent number 10,854,559
- Issue date Dec 1, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 10,796,931
- Issue date Oct 6, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 10,714,526
- Issue date Jul 14, 2020
- Sony Corporation
- Yosuke Ogata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,685,934
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead package and method of making
- Patent number 10,665,475
- Issue date May 26, 2020
- Texas Instruments Incorporated
- Dan Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,607,920
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20240146019
- Publication date May 2, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298990
- Publication date Sep 21, 2023
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP DECAPSULATION TECHNIQUE FOR SEMICONDUCTOR PACKAGE HAVING S...
- Publication number 20230138508
- Publication date May 4, 2023
- Silicon Laboratories Inc.
- Erwin Hendarto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220223568
- Publication date Jul 14, 2022
- Rohm Co., Ltd.
- Kaito INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20220189942
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220102252
- Publication date Mar 31, 2022
- Rohm Co., Ltd.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210366864
- Publication date Nov 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20210328403
- Publication date Oct 21, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING AN IN...
- Publication number 20200402874
- Publication date Dec 24, 2020
- STMicroelectronics S.r.l.
- Giovanni Campardo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING A FAN-OUT SUB-PACKAGE
- Publication number 20200350290
- Publication date Nov 5, 2020
- SK HYNIX INC.
- Seung Yeop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200294954
- Publication date Sep 17, 2020
- RENESAS ELECTRONICS CORPORATION
- Wataru SHIROI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Flat No Lead Package And Method Of Making
- Publication number 20200251352
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dan Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20200126815
- Publication date Apr 23, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200091416
- Publication date Mar 19, 2020
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20200006313
- Publication date Jan 2, 2020
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
- Publication number 20190198551
- Publication date Jun 27, 2019
- SONY CORPORATION
- Yosuke Ogata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013289
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA FOR DIRECT CHIP ATTACH CONNECTIVITY MODULE PACKA...
- Publication number 20180286780
- Publication date Oct 4, 2018
- Intel IP Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
- Publication number 20180261571
- Publication date Sep 13, 2018
- Invensas Corporation
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20180076185
- Publication date Mar 15, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...
- Publication number 20180047588
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20170271228
- Publication date Sep 21, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE
- Publication number 20170148757
- Publication date May 25, 2017
- ROHM CO., LTD.
- Yuto NISHIYAMA
- G01 - MEASURING TESTING
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
- Publication number 20170133423
- Publication date May 11, 2017
- SONY CORPORATION
- Yosuke Ogata
- H01 - BASIC ELECTRIC ELEMENTS

of a wire bonded chip

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Floating die package

Semiconductor device packages, packaging methods, and packaged semi...

Two-step decapsulation technique for semiconductor package having s...

Semiconductor device

Sensor package structure

Electronic chip support device and corresponding manufacturing method

Semiconductor package and method of manufacturing the semiconductor...

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device packages, packaging methods, and packaged semi...

Semiconductor device

Quad flat no lead package and method of making

Package structure and manufacturing method thereof

Package-on-package assembly with wire bonds to encapsulation surface

Package structure including two joint structures including differen...

Semiconductor device packages, packaging methods, and packaged semi...

Semiconductor device packages, packaging methods, and packaged semi...

Electronic device including through conductors in sealing body

Integrated semiconductor device and process for manufacturing an in...

Stack packages including a fan-out sub-package

Method for forming a semiconductor package

Semiconductor device

Floating die package

Methods and modules related to shielded lead frame packages

Package-on-package assembly with wire bonds to encapsulation surface

Manufacturing method of package structure

Solid-state imaging device, manufacturing method thereof, and elect...

Semiconductor package device and method of manufacturing the same

Semiconductor chip package with resilient conductive paste post and...

Quad flat no lead package and method of making

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

SEMICONDUCTOR DEVICE

TWO-STEP DECAPSULATION TECHNIQUE FOR SEMICONDUCTOR PACKAGE HAVING S...

SEMICONDUCTOR DEVICE

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD

FLOATING DIE PACKAGE

INTEGRATED SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING AN IN...

STACK PACKAGES INCLUDING A FAN-OUT SUB-PACKAGE

ELECTRONIC DEVICE

Quad Flat No Lead Package And Method Of Making

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MANUFACTURING METHOD OF PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

INTEGRATED ANTENNA FOR DIRECT CHIP ATTACH CONNECTIVITY MODULE PACKA...

STACKABLE MICROELECTRONIC PACKAGE STRUCTURES

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...