of an individual bonding area

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H01L2224/05

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05of an individual bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,237,283
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,237,303
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and implantable medical device including same
- Patent number 12,237,281
- Issue date Feb 25, 2025
- Medtronic, Inc.
- Mark E. Henschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,304
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 12,237,299
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,237,239
- Issue date Feb 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising a via structure with a first pr...
- Patent number 12,237,274
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zongzheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,285
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having cell over periphery structure, memory package...
- Patent number 12,224,277
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Yonghyuk Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer structure and semiconductor device
- Patent number 12,224,256
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
- Patent number 12,224,274
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamped semiconductor wafers and semiconductor devices
- Patent number 12,224,259
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method therefor
- Patent number 12,218,295
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display assembly and display device each including flexible circuit...
- Patent number 12,219,697
- Issue date Feb 4, 2025
- BOE Technology Group Co., Ltd.
- Xiao Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
- Publication number 20250069975
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250069918
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070063
- Publication date Feb 27, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Hironao NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HIGH METAL BUMPS AND ULTRA-THIN SUBSTR...
- Publication number 20250070069
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250070078
- Publication date Feb 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL
- Publication number 20250069985
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...
- Publication number 20250070003
- Publication date Feb 27, 2025
- TOPPAN Holdings Inc.
- Kenta SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
- Publication number 20250070017
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250070060
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
- Publication number 20250070061
- Publication date Feb 27, 2025
- HEFEI VISIONOX TECHNOLOGY CO., LTD.
- Bo YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME
- Publication number 20250070045
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHOD FOR FORMING SAME...
- Publication number 20250070062
- Publication date Feb 27, 2025
- CXMT Corporation
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250062241
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME
- Publication number 20250062244
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- KANG JOON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250062295
- Publication date Feb 20, 2025
- Seoul Viosys Co., Ltd.
- Seong Kyu JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20250063832
- Publication date Feb 20, 2025
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062201
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20250062256
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062257
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE
- Publication number 20250062258
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH IC SUBSTRATE AND ELECTRONIC COMPONENT CONNECTED WITH D...
- Publication number 20250062261
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...
- Publication number 20250062306
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME EDGE REINFORCEMENT STRUCTURE FOR PACKAGE STRUCTURES AND METHO...
- Publication number 20250062176
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062221
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
- Publication number 20250062129
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Yin Wei LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP
- Publication number 20250062254
- Publication date Feb 20, 2025
- Shanghai Huali Integrated Circuit Corporation
- Tianquan SHI
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for manufacturing the same

Vertically mounted die groups

Display substrate, tiled display panel and display device

Electronic package and implantable medical device including same

Semiconductor package

Semiconductor device and method of forming the same

Systems and methods for direct bonding in semiconductor die manufac...

Semiconductor device and manufacturing method thereof

Semiconductor structures comprising a via structure with a first pr...

Semiconductor package

Palladium-coated copper bonding wire, manufacturing method of palla...

Electronics assemblies employing copper in multiple locations

Wafer level package with polymer layer delamination prevention desi...

Shield structure for backside through substrate vias (TSVs)

Semiconductor device and method of forming micro interconnect struc...

Methods for registration of circuit dies and electrical interconnects

Semiconductor chip and semiconductor package including the same

Memory devices having cell over periphery structure, memory package...

Stacked semiconductor device assembly in computer system

Wafer structure and semiconductor device

Micro light-emitting diode display panel and manufacturing method t...

Semiconductor module and power conversion apparatus

Clamped semiconductor wafers and semiconductor devices

Micro LED display and manufacturing method therefor

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor device with composite conductive features and method...

Semiconductor die connection system and method

Chip package structure having molding layer

Semiconductor package and method of forming the same

Display assembly and display device each including flexible circuit...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING HIGH METAL BUMPS AND ULTRA-THIN SUBSTR...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE

PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHOD FOR FORMING SAME...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME

LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE

PACKAGE WITH IC SUBSTRATE AND ELECTRONIC COMPONENT CONNECTED WITH D...

COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...

FRAME EDGE REINFORCEMENT STRUCTURE FOR PACKAGE STRUCTURES AND METHO...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES

METHOD FOR MANUFACTURING ALUMINUM PAD OF SEMICONDUCTOR CHIP