of an individual bonding area

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08of an individual bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked chip that shares power rails
- Patent number 12,272,647
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,272,676
- Issue date Apr 8, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and stacked storage unit...
- Patent number 12,274,049
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,272,662
- Issue date Apr 8, 2025
- United Microelectronics Corporation
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and equipment
- Patent number 12,272,710
- Issue date Apr 8, 2025
- Canon Kabushiki Kaisha
- Kazuhiro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory peripheral circuit having three-dimensional transistors and...
- Patent number 12,274,066
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor packaging system with enhanced dielectric-...
- Patent number 12,272,670
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having hybrid bondi...
- Patent number 12,266,622
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,266,634
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device manufacturing method
- Patent number 12,261,161
- Issue date Mar 25, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- François Templier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems with coolant channel for device packaging
- Patent number 12,261,099
- Issue date Mar 25, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for forming the same
- Patent number 12,261,137
- Issue date Mar 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,261,149
- Issue date Mar 25, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH MULTIPLE HBM STACKS
- Publication number 20250118719
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Brett P. WILKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
- Publication number 20250120089
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Sehoon Lee
- G11 - INFORMATION STORAGE
Information Patent Application
Mitigating process problems in hybrid bonding of vertical die stacking
- Publication number 20250118692
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118702
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Kwang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FOCAL PLANE ARRAY CIRCUIT AND METHOD THEREOF
- Publication number 20250120192
- Publication date Apr 10, 2025
- Aeluma, Inc.
- Michael MCGIVNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A THERMAL CARRIER
- Publication number 20250118706
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250118710
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118612
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
- Publication number 20250118636
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118646
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- MYUNGSAM KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118652
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118651
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungryong OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Publication number 20250112173
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Publication number 20250112199
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...
- Publication number 20250113484
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masato NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...
- Publication number 20250113486
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Nobuyuki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113492
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CHIPLET-BASED APPLICATION SPECIFIC INTEGRATED CIRCUIT
- Publication number 20250112207
- Publication date Apr 3, 2025
- Block, Inc.
- Vikram Suresh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Publication number 20250112187
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die and Wafer Level Processing of Laser Diodes and Other Semiconduc...
- Publication number 20250112189
- Publication date Apr 3, 2025
- Apple Inc.
- Nicolas Hotellier
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive coupling in a direct-bonded interface for microelectroni...

Stacking structure, package structure and method of fabricating the...

Semiconductor structure and manufacturing method of the same

3D stacked chip that shares power rails

Memory device

Thermal structure for semiconductor device and method of forming th...

Memory devices having vertical transistors and stacked storage unit...

Semiconductor package structure having interconnections between die...

Semiconductor structure

Semiconductor device and equipment

Three-dimensional device structure including substrate-embedded int...

Memory peripheral circuit having three-dimensional transistors and...

Integrated semiconductor packaging system with enhanced dielectric-...

Method of manufacturing semiconductor structure having hybrid bondi...

Display panel, method of manufacturing display panel, and display d...

Method of fabricating semiconductor package

Vertically mounted die groups

Optoelectronic device manufacturing method

Method of manufacturing substrate layered body and layered body

Integrated circuit packages

Semiconductor package having an encapulant comprising conductive fi...

Embedded cooling systems with coolant channel for device packaging

Bonding structure and method for forming the same

Molded dies in semiconductor packages and methods of forming same

Manufacturing method of semiconductor structure

Semiconductor device with composite conductive features and method...

Bond pads for semiconductor die assemblies and associated methods a...

Stacked semiconductor device

Electronic device with multi-layer contact and system

Structure and method for isolation of bit-line drivers for a three-...

Patents Applicationslast 30 patents

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE WITH MULTIPLE HBM STACKS

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME

Mitigating process problems in hybrid bonding of vertical die stacking

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

STACKED FOCAL PLANE ARRAY CIRCUIT AND METHOD THEREOF

CHIP PACKAGE WITH A THERMAL CARRIER

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

MULTI-DIE CHIPLET-BASED APPLICATION SPECIFIC INTEGRATED CIRCUIT

IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT

Die and Wafer Level Processing of Laser Diodes and Other Semiconduc...