of an individual bump connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/13of an individual bump connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,368,132
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,362,344
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,298
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
- Patent number 12,362,322
- Issue date Jul 15, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,272
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming packages of stacked chips
- Patent number 12,362,327
- Issue date Jul 15, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and methods
- Patent number 12,364,074
- Issue date Jul 15, 2025
- CreeLED, Inc.
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 12,355,002
- Issue date Jul 8, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and method for manufacturing imaging device
- Patent number 12,356,753
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaya Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First layer interconnect first on carrier approach for EMIB patch
- Patent number 12,354,992
- Issue date Jul 8, 2025
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for low temperature chip bonding
- Patent number 12,354,988
- Issue date Jul 8, 2025
- Northrop Grumman Systems Corporation
- Justin C. Hackley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine-pitch joining pad structure
- Patent number 12,354,983
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,347,739
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device each having non-photosensitiv...
- Patent number 12,341,088
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with through-electrode and electrode land...
- Patent number 12,341,084
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an encapsulant
- Patent number 12,341,118
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel including electrically connected...
- Patent number 12,342,620
- Issue date Jun 24, 2025
- BOE Technology Group Co., Ltd.
- Xue Dong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT PROCESS FOR WAFER BONDING PROCESSES
- Publication number 20250239564
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250239516
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kana ISERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS
- Publication number 20250239551
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH DIE AND COPPER POSTS
- Publication number 20250239507
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250239561
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
- Publication number 20250239509
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250233090
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250233040
- Publication date Jul 17, 2025
- MEDIATEK INC.
- Sang-Mao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250233083
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250226342
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226360
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20250226302
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Yeoil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250226299
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- TAE OH HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226343
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226344
- Publication date Jul 10, 2025
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

Package structure including stacked pillar portions and method for...

Joint structure in semiconductor package and manufacturing method t...

Hybrid integrated circuit packages

Method of manufacturing semiconductor device including passivation...

Thermocompression bonding with passivated silver-based contacting m...

Semiconductor package and method of manufacturing the same

Semiconductor device and method of manufacture

Method of making a fan-out semiconductor assembly with an intermedi...

Method for fabricating a chip package

Semiconductor structure and manufacturing method thereof

Thermocompression bonding with passivated gold contacting metal

3D semiconductor memory device and structure

Method of forming packages of stacked chips

Light emitting diodes and methods

Hyperchip

Imaging device and method for manufacturing imaging device

Chip package structure and storage system

First layer interconnect first on carrier approach for EMIB patch

Bump structures for low temperature chip bonding

Fine-pitch joining pad structure

Thermocompression bonding with passivated tin-based contacting metal

Semiconductor device structure with a protection cap at an end port...

Semiconductor packages

Package structure

Microdevice integration into system substrate

Wiring board and semiconductor device each having non-photosensitiv...

Integrated circuit device with through-electrode and electrode land...

Semiconductor package including an encapsulant

Array substrate and display panel including electrically connected...

Patents Applicationslast 30 patents

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

TREATMENT PROCESS FOR WAFER BONDING PROCESSES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS

IC PACKAGE WITH DIE AND COPPER POSTS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR PACKAGE

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

HYBRID SUBSTRATE WITH EMBEDDED COMPONENT

Semiconductor Device and Method of Making a Molded IPD-CoW

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE

CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...