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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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last 30 patents
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Semiconductor package and manufacturing method of the same
Patent number
11,967,553
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
Patent number
11,967,546
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus including a terminal pad associated with a conductive tra...
Patent number
11,967,572
Issue date
Apr 23, 2024
Micron Technology, Inc.
Travis M. Jensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package having a main die and a dummy die
Patent number
11,967,563
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,967,577
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Yosui Futamura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Redistribution layers and methods of fabricating the same in semico...
Patent number
11,967,573
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsiang-Ku Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package component with stepped passivation layer
Patent number
11,961,762
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,961,813
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-insulator-metal structure
Patent number
11,961,880
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yuan-Yang Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display module and display apparatus
Patent number
11,963,429
Issue date
Apr 16, 2024
Chengdu BOE Optoelectronics Technology Co., Ltd.
Yu Wang
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Semiconductor package including a redistribution substrate and a me...
Patent number
11,961,793
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Sang-uk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having vias
Patent number
11,961,812
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Changeun Joo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package including stacked chip structure
Patent number
11,961,824
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Hyunggyun Noh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
Patent number
11,955,457
Issue date
Apr 9, 2024
Micron Technology, Inc.
Thomas H. Kinsley
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Power semiconductor component and method for producing a power semi...
Patent number
11,955,402
Issue date
Apr 9, 2024
Vitesco Technologies GbmH
Christina Quest-Matt
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Flip chip package structure and manufacturing method thereof
Patent number
11,955,443
Issue date
Apr 9, 2024
Amazing Cool Technology Corp
Shiann-Tsong Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip having stepped conductive pillars
Patent number
11,955,447
Issue date
Apr 9, 2024
Advanced Micro Devices, Inc.
Suming Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package comprising spacers between integrated devices
Patent number
11,948,909
Issue date
Apr 2, 2024
QUALCOMM Incorporated
Yangyang Sun
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package including high thermal conductivity layer
Patent number
11,948,851
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sunjae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for thin film capacitor integration
Patent number
11,948,871
Issue date
Apr 2, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Die and package structure
Patent number
11,948,904
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,948,903
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sang-Sick Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure with integrated device integrated beneath th...
Patent number
11,948,914
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic devices in semiconductor package cavities
Patent number
11,942,386
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Christopher Daniel Manack
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuits (ICs) employing directly coupled metal lines be...
Patent number
11,942,414
Issue date
Mar 26, 2024
QUALCOMM Incorporated
John Jianhong Zhu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
Publication number
20240136245
Publication date
Apr 25, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136327
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
AENEE JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
Publication number
20240136317
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Publication number
20240136280
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
Publication number
20240136316
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chiang-Jui Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
Publication number
20240136315
Publication date
Apr 25, 2024
Micron Technology, Inc.
Chao Wen Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240128173
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Ji-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240128142
Publication date
Apr 18, 2024
JCET GROUP CO., LTD.
Shuo Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE
Publication number
20240128153
Publication date
Apr 18, 2024
Ganstronic INC.
Cheng-Chuan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128195
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Sangwoong Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240128218
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Pin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
Publication number
20240128223
Publication date
Apr 18, 2024
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
Publication number
20240128149
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chieh HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE...
Publication number
20240128158
Publication date
Apr 18, 2024
Micron Technology, Inc.
YUTAKA NAKAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
Publication number
20240128215
Publication date
Apr 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Takashi NOMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
Publication number
20240128230
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Sinyeop LEE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF
Publication number
20240128233
Publication date
Apr 18, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
CHIA-SHUAI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
Publication number
20240128209
Publication date
Apr 18, 2024
Newport Fab, LLC dba Tower Semiconductor Newport Beach
Edward Preisler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Platinum-Based Solder Body Contacts for Integration of a First Subs...
Publication number
20240128213
Publication date
Apr 18, 2024
Newport Fab. LLC dba Tower Semiconductor Newport Beach
Zhirong Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240128217
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Jung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128190
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Seunghwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
Publication number
20240128219
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
Publication number
20240120301
Publication date
Apr 11, 2024
STMicroelectronics S.r.l
Simone Dario MARIANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120319
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240120207
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lung-Kai Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Layer-By-Layer Formation Of Through-Substrate Via
Publication number
20240120257
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
Publication number
20240120295
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Hsien Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240120315
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS