of an individual high density interconnect connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/24of an individual high density interconnect connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,230,549
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro-LED, and manufacturing method therefor
- Patent number 12,230,617
- Issue date Feb 18, 2025
- LG Electronics Inc.
- Bongchu Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image display device manufacturing method and image display device
- Patent number 12,224,273
- Issue date Feb 11, 2025
- Nichia Corporation
- Hajime Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,224,384
- Issue date Feb 11, 2025
- Samsung Display Co., Ltd.
- Moon Jung An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing same
- Patent number 12,218,299
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Chang Il Tae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,218,108
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices using microchannels for interconnections
- Patent number 12,205,882
- Issue date Jan 21, 2025
- 3M Innovative Properties Company
- Kayla C. Niccum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly comprising a 3D block and method of making t...
- Patent number 12,205,881
- Issue date Jan 21, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and manufacuring method thereof
- Patent number 12,205,934
- Issue date Jan 21, 2025
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,205,959
- Issue date Jan 21, 2025
- Samsung Display Co., Ltd.
- Jong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 12,183,649
- Issue date Dec 31, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having improved reliability and inspe...
- Patent number 12,183,707
- Issue date Dec 31, 2024
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with composite bottle-shaped through...
- Patent number 12,183,705
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive tracks, and electronic module
- Patent number 12,183,710
- Issue date Dec 31, 2024
- Siemens Aktiengesellschaft
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple pixel package structure with buried chip and electronic de...
- Patent number 12,183,724
- Issue date Dec 31, 2024
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double resist structure for electrodeposition bonding
- Patent number 12,183,708
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Koki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,176,337
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20250062267
- Publication date Feb 20, 2025
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250062164
- Publication date Feb 20, 2025
- LG Display Co., Ltd.
- Seeun KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20250054894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...
- Publication number 20250046682
- Publication date Feb 6, 2025
- Huawei Digital Power Technologies Co.,Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20250046771
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038081
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250038145
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Tzu-Jui FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20250029947
- Publication date Jan 23, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20250029969
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Youngki JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250022857
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
- Publication number 20250014957
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jingu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015043
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015014
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME
- Publication number 20250015066
- Publication date Jan 9, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xiaochen XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250015069
- Publication date Jan 9, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
- Publication number 20250015036
- Publication date Jan 9, 2025
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Chia CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Publication number 20250006570
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Inverted EWLB Package wi...
- Publication number 20250006608
- Publication date Jan 2, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421096
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413115
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240404977
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS

of an individual high density interconnect connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposers for microelectronic devices

Three-dimensional integrated circuit structures and methods of form...

Display device using micro-LED, and manufacturing method therefor

Fan-out package having a main die and a dummy die

Image display device manufacturing method and image display device

Display device and manufacturing method therefor

Display device and method for manufacturing same

Semiconductor package and method of fabricating the same

Chip package structure having molding layer

Passivation structure with planar top surfaces

Package and manufacturing method thereof

Methods and devices using microchannels for interconnections

Method of processing a semiconductor wafer, semiconductor die, and...

Semiconductor assembly comprising a 3D block and method of making t...

High-density interconnects for integrated circuit packages

Method of transferring micro-light emitting diode for LED display

Electronic component package and manufacuring method thereof

Display device

Semiconductor device, semiconductor package and method of manufactu...

Stacked via structure disposed on a conductive pillar of a semicond...

Method of producing a multi-chip assembly

IC package including multi-chip unit with bonded integrated heat sp...

Packaged semiconductor device having improved reliability and inspe...

Semiconductor device structure with composite bottle-shaped through...

Method for producing conductive tracks, and electronic module

Multiple pixel package structure with buried chip and electronic de...

Double resist structure for electrodeposition bonding

Semiconductor devices and methods of manufacturing

Method for fabricating electronic package

Semiconductor package

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...

METHOD FOR FABRICATING ELECTRONIC PACKAGE

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME

SEMICONDUCTOR PACKAGE STRUCTURE

PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...

GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS

Semiconductor Device and Method of Forming Inverted EWLB Package wi...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

OPTOELECTRONIC SYSTEM

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

PACKAGE STRUCTURE

SEMICONDUCTOR DIE SHIELDING STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE