of an individual high density interconnect connector

Industry

CPC
H01L24/24

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/24of an individual high density interconnect connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Asymmetric Stackup Structure for SoC package substrates
- Patent number 12,322,721
- Issue date Jun 3, 2025
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor manufacturing pro...
- Patent number 12,322,672
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,317,658
- Issue date May 27, 2025
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,308,357
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Jong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element, display device including the same, and manu...
- Patent number 12,300,768
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Hyung Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies with power electronic devices and three-dime...
- Patent number 12,300,653
- Issue date May 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,570
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel and display device including the same
- Patent number 12,283,582
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Eun A Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic bo...
- Patent number 12,283,560
- Issue date Apr 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having insulating pattern with concave-convex pattern
- Patent number 12,283,580
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Eun Ju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for producing a component
- Patent number 12,278,318
- Issue date Apr 15, 2025
- Osram Opto Semiconductors GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and display device including the same
- Patent number 12,274,093
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Joon Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
- Patent number 12,265,330
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including dummy pattern on bank
- Patent number 12,261,160
- Issue date Mar 25, 2025
- Samsung Display Co., Ltd.
- Ki Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,255,194
- Issue date Mar 18, 2025
- Samsung Display Co., Ltd.
- Min Kyu Woo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for transferring micro LED
- Patent number 12,255,193
- Issue date Mar 18, 2025
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having fan-out area and line protection configuration
- Patent number 12,255,210
- Issue date Mar 18, 2025
- Samsung Display Co., Ltd.
- Yeon Kyung Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device using semiconductor light-emitting element and manuf...
- Patent number 12,255,187
- Issue date Mar 18, 2025
- LG Electronics Inc.
- Jisoo Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate and circuit module using th...
- Patent number 12,243,841
- Issue date Mar 4, 2025
- TDK Corporation
- Toshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183214
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250174534
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20250174542
- Publication date May 29, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20250167060
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
- Publication number 20250167157
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250167155
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250167089
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250157996
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140731
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140765
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132294
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125298
- Publication date Apr 17, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...
- Publication number 20250125247
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125313
- Publication date Apr 17, 2025
- Siliconware Precision Industries Co., Ltd.
- I-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125206
- Publication date Apr 17, 2025
- Powertech Technology Inc.
- SHANG YU CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125321
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFA...
- Publication number 20250112205
- Publication date Apr 3, 2025
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS

of an individual high density interconnect connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Asymmetric Stackup Structure for SoC package substrates

Semiconductor package structure and semiconductor manufacturing pro...

Semiconductor structure and manufacturing method thereof

Display device

Semiconductor device and semiconductor module

Semiconductor package

Display device

Light emitting element, display device including the same, and manu...

Electronics assemblies with power electronic devices and three-dime...

Integrated circuit package and method

Photonics integrated circuit package

Package structure

Pixel and display device including the same

Electronic package including electronic structure and electronic bo...

Display device having insulating pattern with concave-convex pattern

Component and method for producing a component

Integrated fan-out package with 3D magnetic core inductor

Wiring substrate and display device including the same

Polymer material in a redistribution structure of a semiconductor p...

Display device including dummy pattern on bank

Embedded package with electrically isolating dielectric liner

Semiconductor package structure comprising via structure and redist...

Display device

Method for transferring micro LED

Display device having fan-out area and line protection configuration

Display device using semiconductor light-emitting element and manuf...

Semiconductor structure and forming method thereof

Display device and display unit

Semiconductor device with open cavity and method therefor

Electronic component embedded substrate and circuit module using th...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGES

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Fan-Out Package Structur...

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Package And Method Of Fabricating The Same

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFA...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES