of an individual strap connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/37of an individual strap connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor package and smart card having the same
- Patent number 12,294,000
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,767
- Issue date Apr 29, 2025
- Denso Corporation
- Hideki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 12,191,275
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection member, electrical connection structure, and...
- Patent number 12,176,315
- Issue date Dec 24, 2024
- Hitachi Metals, Ltd.
- Junya Nishina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of bus bars intersecting a plurality electrode
- Patent number 12,113,010
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Shigeto Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding method
- Patent number 12,080,675
- Issue date Sep 3, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation and corrosion prevention in semiconductor devices and sem...
- Patent number 12,051,661
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a barrier layer along the sidewall of...
- Patent number 12,046,551
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resin with a filler for encapsulatin...
- Patent number 11,990,393
- Issue date May 21, 2024
- Denso Corporation
- Tarou Igoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack module and method of fabricating the same
- Patent number 11,984,432
- Issue date May 14, 2024
- Unity Power Technology Limited
- Kuk Fong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with branch electrode terminal and method of m...
- Patent number 11,901,326
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 11,848,295
- Issue date Dec 19, 2023
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20250240006
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...
- Publication number 20250219029
- Publication date Jul 3, 2025
- MURATA MANUFACTURING CO., LTD.
- David M. GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210578
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Engineered Interconnect Structures for Enhanced Bonding Strength
- Publication number 20250201674
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND...
- Publication number 20250201754
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Joon Shyan TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192092
- Publication date Jun 12, 2025
- DENSO CORPORATION
- Hideki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20250183218
- Publication date Jun 5, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A SEMICONDUCTOR MO...
- Publication number 20250149496
- Publication date May 8, 2025
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH CONNECTION PAD
- Publication number 20250140745
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOSE ARVIN PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT DEVICE AND POWER MODULE ARRANGEMENT
- Publication number 20250132282
- Publication date Apr 24, 2025
- ROBERT BOSCH GmbH
- Alexander Kaiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250133803
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250132666
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118699
- Publication date Apr 10, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105199
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Georgio El-Zammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105198
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Heiming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20250081579
- Publication date Mar 6, 2025
- Wolfspeed, Inc.
- Jonathan Van Buskirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20250022832
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20250022833
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...
- Publication number 20250014972
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H01 - BASIC ELECTRIC ELEMENTS

of an individual strap connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacture

Switching device and electronic circuit

Wiring structure and semiconductor module

Power substrate assembly with reduced warpage

Fingerprint sensor package and smart card having the same

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor device

Semiconductor packages

Power semiconductor apparatus and fabrication method for the same

Half-bridge module for an inverter of an electric drive of an elect...

Electrical connection member, electrical connection structure, and...

Semiconductor device with sense terminal

Plurality of transistors attached to a heat sink with a periphery n...

Plurality of bus bars intersecting a plurality electrode

Semiconductor device and bonding method

Chip package and semiconductor arrangement having thermally conduct...

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor device and production method for semiconductor device

Oxidation and corrosion prevention in semiconductor devices and sem...

Interconnect structure having a barrier layer along the sidewall of...

Leadframe package with adjustable clip

Semiconductor device and electronic device

Semiconductor device including resin with a filler for encapsulatin...

Semiconductor chip stack module and method of fabricating the same

Switching device and electronic circuit

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor device with branch electrode terminal and method of m...

Semiconductor device having a contact clip with a contact region ha...

Power semiconductor apparatus and fabrication method for the same

Patents Applicationslast 30 patents

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR DEVICE

Engineered Interconnect Structures for Enhanced Bonding Strength

SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND...

SEMICONDUCTOR DEVICE

ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A SEMICONDUCTOR MO...

DIE WITH CONNECTION PAD

CONTACT DEVICE AND POWER MODULE ARRANGEMENT

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

CLIP

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

CLIP

SEMICONDUCTOR MODULE

POWER MODULE AND POWER CONVERSION APPARATUS

METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES

DUAL SWITCHING POWER DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...