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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/48of an individual wire connector

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
- Patent number 12,368,113
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device comprising transistor
- Patent number 12,364,041
- Issue date Jul 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Motomu Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with balanced wiring structure
- Patent number 12,362,313
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,362,270
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kris Lipu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filter optical package
- Patent number 12,364,052
- Issue date Jul 15, 2025
- Texas Instruments Incorporated
- Steven Alfred Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 12,362,244
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, semiconductor apparatus, and vehicle
- Patent number 12,362,257
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Masahide Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,264
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross stack bridge bonding devices and associated methods
- Patent number 12,362,319
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,339
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Kenichi Agawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and methods
- Patent number 12,364,074
- Issue date Jul 15, 2025
- CreeLED, Inc.
- Christopher P. Hussell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,355,015
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of LIDAR sensor systems having integrated semic...
- Patent number 12,352,868
- Issue date Jul 8, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package die stacking system and method
- Patent number 12,347,810
- Issue date Jul 1, 2025
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and measurement device
- Patent number 12,347,757
- Issue date Jul 1, 2025
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,347,791
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with heat spreader
- Patent number 12,347,742
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having galvanic isolation and method therefor
- Patent number 12,347,753
- Issue date Jul 1, 2025
- NXP USA, INC.
- Jerry Rudiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 12,347,760
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with load terminals on which coupled power component and lo...
- Patent number 12,347,754
- Issue date Jul 1, 2025
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250239549
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Pierre-Yves PICHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20250239496
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250239512
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Che-Neng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239560
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Tetsuo YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...
- Publication number 20250239543
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239559
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20250240006
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...
- Publication number 20250233059
- Publication date Jul 17, 2025
- Kyocera Corporation
- Akihiko FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233100
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Youn Jo MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20250233055
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226276
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
- Publication number 20250226338
- Publication date Jul 10, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...
- Publication number 20250226352
- Publication date Jul 10, 2025
- Lumentum Technology (UK) Limited
- Angelito Pizarro LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY
- Publication number 20250226362
- Publication date Jul 10, 2025
- Lumileds LLC
- Cheng Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226285
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Myungsung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20250226295
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS
- Publication number 20250226301
- Publication date Jul 10, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS

of an individual wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for using spacer-on-spacer design for solder...

Semiconductor package

Power management

Semiconductor device comprising transistor

Semiconductor package with balanced wiring structure

Semiconductor package comprising semiconductor chip with stepped po...

Methods of packaging semiconductor devices and packaged semiconduct...

Integrated circuit (IC) and electronic apparatus

Package structure and method of fabricating the same

Integrated filter optical package

3D semiconductor memory device and structure

Memory device including circuitry under bond pads

Semiconductor module, semiconductor apparatus, and vehicle

Semiconductor device

Cross stack bridge bonding devices and associated methods

Semiconductor device

Light emitting diodes and methods

Semiconductor device and method for manufacturing the same

Semiconductor device

Systems and methods of LIDAR sensor systems having integrated semic...

Multi-role semiconductor device substrates, semiconductor device as...

Signal routing between memory die and logic die for performing oper...

Semiconductor device

Semiconductor device package die stacking system and method

Semiconductor device and measurement device

Integrated circuit package and method

IC package with heat spreader

Semiconductor device having galvanic isolation and method therefor

Interconnection structure and semiconductor package including the same

Package with load terminals on which coupled power component and lo...

Patents Applicationslast 30 patents

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF

CAVITY TAPE FOR PACKAGE PROTECTION

MEMORY DEVICE

INTEGRATED CIRCUIT PACKAGE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...

SEMICONDUCTOR DEVICE

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONI...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

Power Semiconductor Devices Including Shape-Memory Metallization

V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY

SEMICONDUCTOR PACKAGE

MULTI-DIE SEMICONDUCTOR PACKAGE

MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS