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BONDING STRUCTURE AND POWER DEVICE
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Publication number 20240145426
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Publication date May 2, 2024
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Huawei Digital Power Technologies Co., Ltd.
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Fenglong LU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240145456
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Publication date May 2, 2024
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Kabushiki Kaisha Toshiba
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Yuichiro NIIKURA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240145413
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Publication date May 2, 2024
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SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
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Makoto NISHIHARA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240136320
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Publication date Apr 25, 2024
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ROHM CO., LTD.
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Kohei TANIKAWA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240136266
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Choongbin YIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240136347
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Publication date Apr 25, 2024
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ROHM CO., LTD.
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Isamu NISHIMURA
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H01 - BASIC ELECTRIC ELEMENTS