of an individual wire connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/45of an individual wire connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 12,266,610
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Yencheng Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a dam structure
- Patent number 12,261,093
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,146
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,256,573
- Issue date Mar 18, 2025
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,598
- Issue date Feb 18, 2025
- Mediatek Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead stabilization in semiconductor packages
- Patent number 12,211,774
- Issue date Jan 28, 2025
- STMicroelectronics, Inc.
- Ela Mia Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,205,909
- Issue date Jan 21, 2025
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 12,191,275
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorescent body, method for manufacturing same, and light-emitting...
- Patent number 12,180,402
- Issue date Dec 31, 2024
- National Institute for Materials Science
- Naoto Hirosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered dies in ceramic packages
- Patent number 12,176,255
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250112184
- Publication date Apr 3, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250107126
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Tomohiro TANIGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20250107301
- Publication date Mar 27, 2025
- Toyoda Gosei Co., Ltd.
- Hiroaki MAKINO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Wire Bonding Method and Apparatus
- Publication number 20250096195
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Stefan Tophinke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087622
- Publication date Mar 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuaki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087546
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd
- Joon Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20250081579
- Publication date Mar 6, 2025
- Wolfspeed, Inc.
- Jonathan Van Buskirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND...
- Publication number 20250079278
- Publication date Mar 6, 2025
- Intel Corporation
- Karumbu Nathan Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS
- Publication number 20250054887
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Guy BRIZAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS
- Publication number 20250054918
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20250046699
- Publication date Feb 6, 2025
- Shanghai Avic Opto Electronics Co., Ltd.
- Huijun JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package and Manufacturing Method Thereof
- Publication number 20250038096
- Publication date Jan 30, 2025
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029909
- Publication date Jan 23, 2025
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022785
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- PYUNGHWA HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022822
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022821
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-BOND ARRANGEMENT
- Publication number 20250015037
- Publication date Jan 9, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Yee Weon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006617
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS

of an individual wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor memory device and structure with memory and metal...

Semiconductor package device and method for manufacturing the same

Leadless current sensor package with high isolation

Semiconductor packages having a dam structure

Semiconductor package

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Sensor package structure

3D semiconductor device and structure with metal layers and memory...

Display substrate, tiled display panel and display device

Palladium-coated copper bonding wire, manufacturing method of palla...

Integrated circuit package having wirebonded multi-die stack

Electronics assemblies employing copper in multiple locations

Semiconductor package

Semiconductor module and power conversion apparatus

Semiconductor device and method of manufacturing the same

Package-on-package assembly with wire bond vias

Camera module, and photosensitive assembly and manufacturing method...

Lead stabilization in semiconductor packages

Semiconductor device and method for fabricating the same

Packaging structure of power semiconductor module

Power semiconductor apparatus and fabrication method for the same

Fluorescent body, method for manufacturing same, and light-emitting...

Semiconductor device

Floating die package

Cantilevered dies in ceramic packages

Bonding wire for semiconductor devices

Semiconductor device

Semiconductor device and temperature measurement method

Methods for producing a 3D semiconductor memory device and structure

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DEVICE

Wire Bonding Method and Apparatus

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES

LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND...

SEMICONDUCTOR DEVICE

POWER MODULE AND METHOD FOR PRODUCING SAME

COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS

POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS

FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE

Semiconductor Chip Package and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

BALL-BOND ARRANGEMENT

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SELECTIVE WIRE COATING DURING WIRE BONDING