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SUBSTRATE STRUCTURE
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Publication number 20230422411
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Publication date Dec 28, 2023
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Subtron Technology Co., Ltd.
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Chung Ying Lu
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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PRINTED CIRCUIT BOARD
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Publication number 20230141270
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Publication date May 11, 2023
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Samsung Electro-Mechanics Co., Ltd.
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Chi Seong Kim
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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CIRCUIT BOARD PREPARATION METHOD
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Publication number 20220386472
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Publication date Dec 1, 2022
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SHENNAN CIRCUITS CO., LTD.
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CHANGSHENG TANG
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HERMETIC CHIP ON BOARD
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Publication number 20210100107
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Publication date Apr 1, 2021
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Raytheon Company
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John M. Bedinger
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SUBSTRATE BONDING STRUCTURE
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Publication number 20210045245
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Publication date Feb 11, 2021
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Murata Manufacturing Co., Ltd.
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Atsushi KASUYA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HERMETIC CHIP ON BOARD
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Publication number 20200359506
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Publication date Nov 12, 2020
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Raytheon Company
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John M. Bedinger
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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PRINTED CIRCUIT BOARD
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Publication number 20200260587
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Publication date Aug 13, 2020
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Samsung Electro-Mechanics Co., Ltd.
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Byung-Seung MIN
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H01 - BASIC ELECTRIC ELEMENTS
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