of blind holes

Industry

CPC
H05K3/0035

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0035of blind holes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable electrical connecting device
- Patent number 11,785,716
- Issue date Oct 10, 2023
- Albert-Ludwigs-Universitat Freiburg
- Patrick Kiele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded component and horizontally elongate...
- Patent number 11,470,714
- Issue date Oct 11, 2022
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having through via and method of fabricating the same
- Patent number 11,406,022
- Issue date Aug 2, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic chip on board
- Patent number 11,363,722
- Issue date Jun 14, 2022
- Raytheon Company
- John M. Bedinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,357,105
- Issue date Jun 7, 2022
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of processed resin substrate and laser process...
- Patent number 11,338,393
- Issue date May 24, 2022
- LASER SYSTEMS INC.
- Kock Khuen Seet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,219,129
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of supplying electrical power from rigid printed circuit boa...
- Patent number 11,184,981
- Issue date Nov 23, 2021
- Adventive IP Bank
- Richard K Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,184,977
- Issue date Nov 23, 2021
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding structure
- Patent number 11,096,282
- Issue date Aug 17, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning and removal of circuit board material using ultrafast la...
- Patent number 11,064,611
- Issue date Jul 13, 2021
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic layer as carrier for component embedded in cavity of compo...
- Patent number 11,058,004
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing holes in component carrier material
- Patent number 11,039,535
- Issue date Jun 15, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminates and method for manufacturing a printed circui...
- Patent number 10,952,329
- Issue date Mar 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Youn-Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 10,933,490
- Issue date Mar 2, 2021
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292537
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292536
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237221
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230422411
- Publication date Dec 28, 2023
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20230292435
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...
- Publication number 20230282553
- Publication date Sep 7, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...
- Publication number 20230199958
- Publication date Jun 22, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED AR...
- Publication number 20230156923
- Publication date May 18, 2023
- SANKEI GIKEN KOGYO CO., LTD.
- Toshiyuki Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141270
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coreless Component Carrier With Embedded Components
- Publication number 20230128938
- Publication date Apr 27, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Allen ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Through Hole in Component Carrier by Laser Drilling Blind H...
- Publication number 20230085035
- Publication date Mar 16, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230069980
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSE...
- Publication number 20220406692
- Publication date Dec 22, 2022
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD PREPARATION METHOD
- Publication number 20220386472
- Publication date Dec 1, 2022
- SHENNAN CIRCUITS CO., LTD.
- CHANGSHENG TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220338347
- Publication date Oct 20, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD
- Publication number 20220304153
- Publication date Sep 22, 2022
- NextGin Technology BV
- J.A.A.M. Tourne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PROCESSED RESIN SUBSTRATE AND LASER PROCESS...
- Publication number 20220241901
- Publication date Aug 4, 2022
- Laser Systems Inc.
- Kock Khuen SEET
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR TRANSMITTING HIGH-FREQUENCY SIGNAL AND METHOD FOR...
- Publication number 20220232696
- Publication date Jul 21, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220225510
- Publication date Jul 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING THROUGH-HOLE, AND SUBSTRATE FOR FLEXIBLE PRINTED...
- Publication number 20220117085
- Publication date Apr 14, 2022
- NIPPON MEKTRON, LTD.
- Toshihiro HIGASHIRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20220095457
- Publication date Mar 24, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20210337656
- Publication date Oct 28, 2021
- Murata Manufacturing Co., Ltd.
- Tomohiro FURUMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...
- Publication number 20210127478
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

of blind holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board, semiconductor device, and method of manufacturing wir...

Wiring board

Multilayer resin substrate, and method of manufacturing multilayer...

Circuit board for transmitting high-frequency signal and method for...

Circuit board preparation method

Printed circuit board

Structure for embedding and packaging multiple devices by layer and...

Wiring substrate and method for manufacturing wiring substrate

Method for forming through-hole, and substrate for flexible printed...

Printed circuit boards with plated blind slots for improved vertica...

Implantable electrical connecting device

Power semiconductor module for PCB embedding, power electronic asse...

Component carrier with blind hole filled with an electrically condu...

Multilayer printed wiring board and method of manufacturing the same

Process for fabrication of a printed circuit board using a semi-add...

Component carrier with embedded component and horizontally elongate...

Substrate having through via and method of fabricating the same

Hermetic chip on board

Method for producing a printed circuit board

Manufacturing method of processed resin substrate and laser process...

Component carrier with blind hole filled with an electrically condu...

Method of supplying electrical power from rigid printed circuit boa...

Method for producing a printed circuit board

Method for producing a printed circuit board structure

Substrate bonding structure

Patterning and removal of circuit board material using ultrafast la...

Metallic layer as carrier for component embedded in cavity of compo...

Manufacturing holes in component carrier material

Copper clad laminates and method for manufacturing a printed circui...

Metal sublayer sensing in multi-layer workpiece hole drilling

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

SUBSTRATE STRUCTURE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...

PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED AR...

PRINTED CIRCUIT BOARD

Coreless Component Carrier With Embedded Components

Forming Through Hole in Component Carrier by Laser Drilling Blind H...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSE...

CIRCUIT BOARD PREPARATION METHOD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF PROCESSED RESIN SUBSTRATE AND LASER PROCESS...

CIRCUIT BOARD FOR TRANSMITTING HIGH-FREQUENCY SIGNAL AND METHOD FOR...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING THROUGH-HOLE, AND SUBSTRATE FOR FLEXIBLE PRINTED...

Component Carrier With Blind Hole Filled With An Electrically Condu...

MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...

COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...