of bonding interfaces

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H01L2224/4007

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4007of bonding interfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a metal clip and related methods of ma...
- Patent number 12,266,628
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip module
- Patent number 11,264,351
- Issue date Mar 1, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,189,591
- Issue date Nov 30, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with conductive clips
- Patent number 10,546,805
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Oscar Paulo Razon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a clip
- Patent number 10,424,534
- Issue date Sep 24, 2019
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-packaging component with retaining structure for package body t...
- Patent number 10,037,964
- Issue date Jul 31, 2018
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor arrangement with semiconductor chips between two substrates
- Patent number 9,806,029
- Issue date Oct 31, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 9,455,238
- Issue date Sep 27, 2016
- Honda Motor Co., Ltd.
- Asako Yoneguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer lead frame package and method of fabrication
- Patent number 8,815,649
- Issue date Aug 26, 2014
- Alpha & Omega Semiconductor Corporation
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor unit, power module, power semiconductor unit ma...
- Patent number 8,723,306
- Issue date May 13, 2014
- Hitachi Automotive Systems, Ltd.
- Nobutake Tsuyuno
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packaging and fabrication method using connecting pla...
- Patent number 8,722,466
- Issue date May 13, 2014
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,592,914
- Issue date Nov 26, 2013
- Renesas Electronics Corporation
- Tomoaki Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer lead frame package and method of fabrication
- Patent number 8,513,784
- Issue date Aug 20, 2013
- Alpha and Omega Semiconductor Incorporated
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for connecting a die to a connection t...
- Patent number 8,513,811
- Issue date Aug 20, 2013
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal packaging of a semiconductor device mounted on die pads
- Patent number 8,395,364
- Issue date Mar 12, 2013
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device package and method of assembly thereof
- Patent number 8,389,336
- Issue date Mar 5, 2013
- Ciclon Semiconductor Device Corp.
- Juan A. Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal straps
- Patent number 8,253,224
- Issue date Aug 28, 2012
- International Rectifier Corporation
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a DC-DC converter having a metal plate
- Patent number 8,237,232
- Issue date Aug 7, 2012
- Renesas Electronics Corporation
- Tomoaki Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a bridge plate connection
- Patent number 8,053,874
- Issue date Nov 8, 2011
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND WIRING MEMBER
- Publication number 20240243093
- Publication date Jul 18, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105665
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Katsuyuki IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL CLIP AND RELATED METHODS OF MA...
- Publication number 20240055387
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240021569
- Publication date Jan 18, 2024
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006368
- Publication date Jan 4, 2024
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
- Publication number 20230326901
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Contact Clip
- Publication number 20230094566
- Publication date Mar 30, 2023
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210183807
- Publication date Jun 17, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP MODULE
- Publication number 20210175197
- Publication date Jun 10, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS
- Publication number 20190206773
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Oscar Paulo RAZON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CLIP
- Publication number 20170250125
- Publication date Aug 31, 2017
- INFINEON TECHNOLOGIES AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...
- Publication number 20140299998
- Publication date Oct 9, 2014
- Eckart Geinitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20140284809
- Publication date Sep 25, 2014
- Honda Motor Co., Ltd.
- Asako YONEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284786
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Hiroshi Fukuyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED POWER SEMICONDUCTOR DEVICE USING DUAL LEAD FRAME
- Publication number 20140191334
- Publication date Jul 10, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140084438
- Publication date Mar 27, 2014
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method Using Connecting Plate for Internal...
- Publication number 20140080263
- Publication date Mar 20, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Connecting Plate for Internal Connection
- Publication number 20140070386
- Publication date Mar 13, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140061821
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenya KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140042609
- Publication date Feb 13, 2014
- FUJI ELECTRIC CO., LTD.
- Fumio Nagaune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
- Publication number 20130334695
- Publication date Dec 19, 2013
- Edwin TIJSSEN
- H01 - BASIC ELECTRIC ELEMENTS

of bonding interfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having a metal clip and related methods of ma...

Semiconductor device with sense terminal

Semiconductor device

Method of manufacturing chip module

Electronic module

Method for electrically contacting a component by galvanic connecti...

Semiconductor device

Integrated circuit package with conductive clips

Semiconductor device including a clip

Die-packaging component with retaining structure for package body t...

Transistor arrangement with semiconductor chips between two substrates

Embedded package and method thereof

Power module and method of manufacturing power module

Semiconductor module package and method of manufacturing the same

Power converter

Lead for connection to a semiconductor device

Multi-layer lead frame package and method of fabrication

Power semiconductor unit, power module, power semiconductor unit ma...

Semiconductor packaging and fabrication method using connecting pla...

Power MOSFET having selectively silvered pads for clip and bond wir...

Semiconductor device and manufacturing method of the same

Power MOSFET having selectively silvered pads for clip and bond wir...

Multi-layer lead frame package and method of fabrication

Electronic device and method for connecting a die to a connection t...

Internal packaging of a semiconductor device mounted on die pads

Semiconductor device package and method of assembly thereof

IGBT power semiconductor package having a conductive clip

Semiconductor package with metal straps

Semiconductor device including a DC-DC converter having a metal plate

Semiconductor package having a bridge plate connection

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND WIRING MEMBER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING A METAL CLIP AND RELATED METHODS OF MA...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION

Chip Package with Contact Clip

Power Semiconductor Module with Accessible Metal Clips

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC MODULE

METHOD OF MANUFACTURING CHIP MODULE

INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS

SEMICONDUCTOR DEVICE INCLUDING A CLIP

Semiconductor Power Device Having a Heat Sink

METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...

POWER CONVERTER

SEMICONDUCTOR DEVICE

Semiconductor Modules and Methods of Formation Thereof

STACKED POWER SEMICONDUCTOR DEVICE USING DUAL LEAD FRAME

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Semiconductor Packaging Method Using Connecting Plate for Internal...

Semiconductor Package with Connecting Plate for Internal Connection

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE