of metal-silicide layers

Industry

CPC
H01L21/32053

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32053of metal-silicide layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit containing a decoy structure
- Patent number 12,051,656
- Issue date Jul 30, 2024
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective work function tuning via silicide induced interface dipol...
- Patent number 11,990,522
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Tien Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 11,915,976
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a vertical thin-film transistor that serves as...
- Patent number 11,910,612
- Issue date Feb 20, 2024
- SUNRISE MEMORY CORPORATION
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing fluorine/carbon-free conformal tungsten
- Patent number 11,887,855
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for metal silicide deposition
- Patent number 11,615,986
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Xuebin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit containing a decoy structure
- Patent number 11,581,270
- Issue date Feb 14, 2023
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 11,569,362
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective work function tuning via silicide induced interface dipol...
- Patent number 11,527,622
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Tien Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical thing-film transistor and application as bit-line connecto...
- Patent number 11,398,492
- Issue date Jul 26, 2022
- SUNRISE MEMORY CORPORATION
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 11,373,905
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate device and method of fabrication thereof
- Patent number 11,355,611
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for electronic component
- Patent number 11,322,363
- Issue date May 3, 2022
- STMicroelectronics (Crolles 2) SAS
- Julien Borrel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse contact and silicide process for three-dimensional semicond...
- Patent number 11,322,401
- Issue date May 3, 2022
- Tokyo Electron Limited
- Jeffrey Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 11,289,604
- Issue date Mar 29, 2022
- United Microelectronics Corp.
- Tsung-Hsun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse contact and silicide process for three-dimensional logic de...
- Patent number 11,264,274
- Issue date Mar 1, 2022
- Tokyo Electron Limited
- Jeffrey Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with silicided bit line contacts
- Patent number 11,183,509
- Issue date Nov 23, 2021
- Cypress Semiconductor Corporation
- Ching-Huang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal contacts with ruthenium metal plugs for semiconductor de...
- Patent number 11,171,060
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonics integration method and structure
- Patent number 11,164,980
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with dielectric blocking layer for improving interpol...
- Patent number 11,158,646
- Issue date Oct 26, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Soh Yun Siah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising monocrystalline semiconductor materials and mo...
- Patent number 11,152,371
- Issue date Oct 19, 2021
- Micron Technology, Inc.
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 11,152,495
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods and apparatus for metal silicide deposition
- Patent number 11,152,221
- Issue date Oct 19, 2021
- Applied Materials, Inc.
- Xuebin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D circuit provided with mesa isolation for the ground plane zone
- Patent number 11,139,209
- Issue date Oct 5, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Perrine Batude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 11,081,572
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device with low resistivity contact structure
- Patent number 11,011,611
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing fluorine/carbon-free conformal tungsten
- Patent number 10,985,023
- Issue date Apr 20, 2021
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact openings and methods forming same
- Patent number 10,978,341
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of metal silicide layers on substrates and chamber compo...
- Patent number 10,950,445
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metal silicide interconnection nanowire struc...
- Patent number 10,930,472
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...
- Publication number 20240387190
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guangyan Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240379377
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE
- Publication number 20240347481
- Publication date Oct 17, 2024
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE WORK FUNCTION TUNING VIA SILICIDE INDUCED INTERFACE DIPOL...
- Publication number 20240313067
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Tien Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE CONTACTS OF DIFFEREN...
- Publication number 20240258235
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS FORMED USING A WIDE BANDGAP SEMICONDUCTOR...
- Publication number 20240250126
- Publication date Jul 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
- Publication number 20240179919
- Publication date May 30, 2024
- Sunrise Memory Corporation
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTEGRATED CIRCUIT TO REMEDY DEFECTS OR DIS...
- Publication number 20240170298
- Publication date May 23, 2024
- EM Microelectronic-Marin SA
- Jean-Philippe JACQUEMIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20240136226
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CONTACT RESISTANCE
- Publication number 20240105464
- Publication date Mar 28, 2024
- Shanghai Huali Integrated Circuit Corporation
- Wensheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...
- Publication number 20240079456
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jae Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH
- Publication number 20230298896
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Gregory Clinton Veber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298897
- Publication date Sep 21, 2023
- HAMAMATSU PHOTONICS K. K.
- Wei DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230207637
- Publication date Jun 29, 2023
- NANYA TECHNOLOGY CORPORATION
- YU-PING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20230170397
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE
- Publication number 20230163083
- Publication date May 25, 2023
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Effective Work Function Tuning Via Silicide Induced Interface Dipol...
- Publication number 20230104442
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Tien Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE CONTACTS OF DIFFEREN...
- Publication number 20230031274
- Publication date Feb 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS
- Publication number 20230028568
- Publication date Jan 26, 2023
- Intel Corporation
- Sameer S. Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20220328350
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
- Publication number 20220293623
- Publication date Sep 15, 2022
- Sunrise Memory Corporation
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE WORK FUNCTION TUNING VIA SILICIDE INDUCED INTERFACE DIPOL...
- Publication number 20220223693
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Tien Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device
- Publication number 20220173244
- Publication date Jun 2, 2022
- UNITED MICROELECTRONICS CORP.
- Tsung-Hsun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SILICIDE WRAP-AROUND CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20220109066
- Publication date Apr 7, 2022
- TOKYO ELECTRON LIMITED
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20220068712
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR METAL SILICIDE DEPOSITION
- Publication number 20220005705
- Publication date Jan 6, 2022
- Applied Materials, Inc.
- Xuebin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR METAL SILICIDE DEPOSITION
- Publication number 20220005704
- Publication date Jan 6, 2022
- Applied Materials, Inc.
- Xuebin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CAPACITOR
- Publication number 20210391210
- Publication date Dec 16, 2021
- Hua Hong Semiconductor (Wuxi) Limited
- Junwen LIU
- H01 - BASIC ELECTRIC ELEMENTS

of metal-silicide layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit containing a decoy structure

Effective work function tuning via silicide induced interface dipol...

Semiconductor device pre-cleaning

Process for forming a vertical thin-film transistor that serves as...

Methods for depositing fluorine/carbon-free conformal tungsten

Methods and apparatus for metal silicide deposition

Integrated circuit containing a decoy structure

Semiconductor device and a method for fabricating the same

Effective work function tuning via silicide induced interface dipol...

Vertical thing-film transistor and application as bit-line connecto...

Semiconductor device pre-cleaning

Multi-gate device and method of fabrication thereof

Contacts for electronic component

Reverse contact and silicide process for three-dimensional semicond...

Method for fabricating a semiconductor device

Reverse contact and silicide process for three-dimensional logic de...

Non-volatile memory with silicided bit line contacts

Dual metal contacts with ruthenium metal plugs for semiconductor de...

Silicon photonics integration method and structure

Memory device with dielectric blocking layer for improving interpol...

Apparatus comprising monocrystalline semiconductor materials and mo...

Integrated circuit heat dissipation using nanostructures

Methods and apparatus for metal silicide deposition

3D circuit provided with mesa isolation for the ground plane zone

Integrated circuit heat dissipation using nanostructures

Semiconductor device with low resistivity contact structure

Methods for depositing fluorine/carbon-free conformal tungsten

Contact openings and methods forming same

Deposition of metal silicide layers on substrates and chamber compo...

Methods for forming a metal silicide interconnection nanowire struc...

Patents Applicationslast 30 patents

FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE

EFFECTIVE WORK FUNCTION TUNING VIA SILICIDE INDUCED INTERFACE DIPOL...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE CONTACTS OF DIFFEREN...

FIELD-EFFECT TRANSISTORS FORMED USING A WIDE BANDGAP SEMICONDUCTOR...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT TO REMEDY DEFECTS OR DIS...

SEMICONDUCTOR DEVICE PRE-CLEANING

METHOD FOR REDUCING CONTACT RESISTANCE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...

METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE

Effective Work Function Tuning Via Silicide Induced Interface Dipol...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE CONTACTS OF DIFFEREN...

SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS

SEMICONDUCTOR DEVICE PRE-CLEANING

VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...

EFFECTIVE WORK FUNCTION TUNING VIA SILICIDE INDUCED INTERFACE DIPOL...

Method for Fabricating a Semiconductor Device

DUAL SILICIDE WRAP-AROUND CONTACTS FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE PRE-CLEANING

METHODS AND APPARATUS FOR METAL SILICIDE DEPOSITION

METHODS AND APPARATUS FOR METAL SILICIDE DEPOSITION

METHOD FOR MANUFACTURING A CAPACITOR