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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bending a substrate
- Patent number 10,600,658
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor substrate
- Patent number 10,475,668
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3608809
- Patent number 3,608,809
- Issue date Sep 28, 1971
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR