of the bonding head

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H01L2224/75841

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75841of the bonding head

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,545,606
- Issue date Jan 3, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,063,195
- Issue date Jul 13, 2021
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,031,368
- Issue date Jun 8, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hitoshi Mukohjima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die bonding apparatus comprising an inert gas environment
- Patent number 10,475,763
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 10,361,166
- Issue date Jul 23, 2019
- Shinkawa Ltd.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonders, methods of operating thermocompression b...
- Patent number 9,847,313
- Issue date Dec 19, 2017
- Kulicke and Soffa Industries, Inc.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a functional inlay
- Patent number 9,780,062
- Issue date Oct 3, 2017
- Assa Abloy AB
- Stephane Ayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing electronic device
- Patent number 9,761,556
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshitada Higashizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a functional inlay
- Patent number 9,501,733
- Issue date Nov 22, 2016
- Assa Abloy AB
- Stephane Ayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of operating bonding machines for bonding semiconductor ele...
- Patent number 9,478,516
- Issue date Oct 25, 2016
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210313501
- Publication date Oct 7, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296551
- Publication date Sep 23, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20190348393
- Publication date Nov 14, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HITOSHI MUKOHJIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
- Publication number 20160351527
- Publication date Dec 1, 2016
- ASM Technology Singapore Pte Ltd
- Siu Wing LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION B...
- Publication number 20160315064
- Publication date Oct 27, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Horst Clauberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20160035694
- Publication date Feb 4, 2016
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20130291378
- Publication date Nov 7, 2013
- Shinko Electric Industries Co., Ltd.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Systems Involving Soldering
- Publication number 20120205424
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

of the bonding head

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Electronic device

Electronic device and method for manufacturing the same

Electronic device and method for manufacturing the same

Bonding apparatus

Die bonding apparatus comprising an inert gas environment

Bonding device

Die bonding with liquid phase solder

Thermocompression bonders, methods of operating thermocompression b...

Method of manufacturing a functional inlay

Method of manufacturing electronic device

Method of manufacturing a functional inlay

Methods of operating bonding machines for bonding semiconductor ele...

Methods and systems involving soldering

Method for mounting electronic components

Patents Applicationslast 30 patents

DIE BONDING APPARATUS

ELECTRONIC DEVICE

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

BONDING APPARATUS AND BONDING METHOD

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

BONDING APPARATUS

DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT

THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION B...

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

Methods and Systems Involving Soldering

METHOD FOR MOUNTING ELECTRONIC COMPONENTS