of the interface with the bonding area

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48458of the interface with the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,315,913
- Issue date Apr 26, 2022
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnections for semiconductor devices and methods f...
- Patent number 10,643,966
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Hyosung Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,431,572
- Issue date Oct 1, 2019
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,090,237
- Issue date Oct 2, 2018
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,997,499
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,812,388
- Issue date Nov 7, 2017
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, memory device, electronic device, or method f...
- Patent number 9,773,787
- Issue date Sep 26, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Takanori Matsuzaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,754,919
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and production method thereof
- Patent number 9,245,954
- Issue date Jan 26, 2016
- New Japan Radio Co., Ltd.
- Yoshio Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 9,136,245
- Issue date Sep 15, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonding connection of semiconductor device
- Patent number 9,059,182
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,048,278
- Issue date Jun 2, 2015
- Fuji Electric Co., Ltd.
- Taichi Karino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 9,006,874
- Issue date Apr 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 8,766,436
- Issue date Jul 1, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with a contact pad on a sl...
- Patent number 8,674,511
- Issue date Mar 18, 2014
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 8,643,159
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die structure, die arrangement and method of processing a die
- Patent number 8,610,274
- Issue date Dec 17, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 8,432,015
- Issue date Apr 30, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and method that eliminates special wire bond...
- Patent number 8,269,356
- Issue date Sep 18, 2012
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 8,105,932
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for producing the same
- Patent number 7,986,034
- Issue date Jul 26, 2011
- Infineon Technologies, AG
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tool and process
- Patent number 7,934,633
- Issue date May 3, 2011
- Orthodyne Electronics Corporation
- Mark Arnold Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tool and process
- Patent number 7,909,228
- Issue date Mar 22, 2011
- Orthodyne Electronics Corporation
- Mark Arnold Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure and method that eliminates special wire bond...
- Patent number 7,868,468
- Issue date Jan 11, 2011
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a power device with first metal laye...
- Patent number 7,851,913
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding tool and process
- Patent number 7,838,101
- Issue date Nov 23, 2010
- Orthodyne Electronics, Inc.
- Mark Arnold Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20240355693
- Publication date Oct 24, 2024
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038698
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Erh-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20180331064
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...
- Publication number 20180331084
- Publication date Nov 15, 2018
- Nichia Corporation.
- Hiroaki UKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180040552
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170330864
- Publication date Nov 16, 2017
- Renesas Electronics Corporation
- Hiroshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170213788
- Publication date Jul 27, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20170179065
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
- Publication number 20170125440
- Publication date May 4, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Munehiro KOZUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MEMORY DEVICE, ELECTRONIC DEVICE, OR METHOD F...
- Publication number 20170125420
- Publication date May 4, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Takanori Matsuzaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DEFINING, LOW CAPACITANCE WIRE BOND PAD
- Publication number 20140319703
- Publication date Oct 30, 2014
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20140120664
- Publication date May 1, 2014
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140011453
- Publication date Jan 9, 2014
- Hiroshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130334665
- Publication date Dec 19, 2013
- Osamu SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130320499
- Publication date Dec 5, 2013
- Fuji Electric Co., Ltd.
- Taichi Karino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20130306985
- Publication date Nov 21, 2013
- NEW JAPAN RADIO CO., LTD.
- Yoshio FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20130264693
- Publication date Oct 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130034955
- Publication date Feb 7, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20120223432
- Publication date Sep 6, 2012
- LSI Corporation
- JOHN M. DELUCCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURE, DIE ARRANGEMENT AND METHOD OF PROCESSING A DIE
- Publication number 20120061835
- Publication date Mar 15, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...
- Publication number 20110089566
- Publication date Apr 21, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...
- Publication number 20110018135
- Publication date Jan 27, 2011
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100258943
- Publication date Oct 14, 2010
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100258955
- Publication date Oct 14, 2010
- NEC ELECTRONICS CORPORATION
- YUICHI MIYAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Structure Between a Wound Coil and An IC-Chip for a Noncontac...
- Publication number 20100230161
- Publication date Sep 16, 2010
- Katsuji Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Bond
- Publication number 20100212153
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20100207234
- Publication date Aug 19, 2010
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

of the interface with the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Light emitting device and method of manufacturing the light emittin...

Electrical interconnections for semiconductor devices and methods f...

Light emitting device and method of manufacturing the light emittin...

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Methods for forming semiconductor devices with stepped bond pads

Semiconductor device, memory device, electronic device, or method f...

Semiconductor device and method of manufacturing the same

Semiconductor device and production method thereof

Moisture barrier for a wire bond

Mixed wire semiconductor lead frame package

Method for producing bonding connection of semiconductor device

Semiconductor device

Lead frame with grooved lead finger

Method for fabricating a bond

Moisture barrier for a wire bond

Method of forming a semiconductor device with a contact pad on a sl...

Lead frame with grooved lead finger

Die structure, die arrangement and method of processing a die

Semiconductor device and wire bonding method

Wire bonding structure and method that eliminates special wire bond...

Mixed wire semiconductor lead frame package

Power semiconductor module and method for producing the same

Ribbon bonding tool and process

Ribbon bonding tool and process

Wire bonding structure and method that eliminates special wire bond...

Semiconductor device including a power device with first metal laye...

Ribbon bonding tool and process

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, MEMORY DEVICE, ELECTRONIC DEVICE, OR METHOD F...

MOISTURE BARRIER FOR A WIRE BOND

SELF-DEFINING, LOW CAPACITANCE WIRE BOND PAD

LEAD FRAME WITH GROOVED LEAD FINGER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

LEAD FRAME WITH GROOVED LEAD FINGER

SEMICONDUCTOR DEVICE

MOISTURE BARRIER FOR A WIRE BOND

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

DIE STRUCTURE, DIE ARRANGEMENT AND METHOD OF PROCESSING A DIE

WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontac...

Method for Fabricating a Bond

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD