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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78303of the pressing surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-segment wire-bond
- Patent number 11,869,868
- Issue date Jan 9, 2024
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-segment wire-bond
- Patent number 11,515,284
- Issue date Nov 29, 2022
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and ball bonder
- Patent number 10,497,662
- Issue date Dec 3, 2019
- ABLIC Inc.
- Tomomitsu Risaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,379,077
- Issue date Jun 28, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interconnects and method o...
- Patent number 8,609,525
- Issue date Dec 17, 2013
- Stats Chippac Ltd.
- BongHwan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package using stud bump coated with solder
- Patent number 8,071,470
- Issue date Dec 6, 2011
- Carsem (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus, and wire bonding contr...
- Patent number 8,042,725
- Issue date Oct 25, 2011
- Kaijo Corporation
- Toru Arahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, wire bonding apparatus, and wire bonding contr...
- Patent number 7,748,599
- Issue date Jul 6, 2010
- Kaijo Corporation
- Toru Arahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 7,397,114
- Issue date Jul 8, 2008
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 7,176,056
- Issue date Feb 13, 2007
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 7,071,090
- Issue date Jul 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 7,038,306
- Issue date May 2, 2006
- Hitachi, Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 6,894,387
- Issue date May 17, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 6,891,253
- Issue date May 10, 2005
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 6,564,989
- Issue date May 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad sealing using wire bonding
- Patent number 6,278,191
- Issue date Aug 21, 2001
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 6,250,539
- Issue date Jun 26, 2001
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a ball bond using a bonding capillary
- Patent number 6,207,549
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary for a wire bonding apparatus
- Patent number 5,884,830
- Issue date Mar 23, 1999
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary tip for bonding a wire
- Patent number 4,886,200
- Issue date Dec 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding means and method
- Patent number 4,415,115
- Issue date Nov 15, 1983
- Motorola, Inc.
- Kristi L. James
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite bonding tool and method of making same
- Patent number 4,405,074
- Issue date Sep 20, 1983
- Kulicke and Soffa Industries Inc.
- Chaim Levintov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3917148
- Patent number 3,917,148
- Issue date Nov 4, 1975
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3313464
- Patent number 3,313,464
- Issue date Apr 11, 1967
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SEGMENT WIRE-BOND
- Publication number 20230098210
- Publication date Mar 30, 2023
- Semiconductor Components Industries, LLC
- Elmer Cunanan BAYRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SEGMENT WIRE-BOND
- Publication number 20220020720
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- Elmer Cunanan BAYRON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241964
- Publication date Sep 27, 2012
- BongHwan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120153444
- Publication date Jun 21, 2012
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20120043655
- Publication date Feb 23, 2012
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE
- Publication number 20110058979
- Publication date Mar 10, 2011
- TANAKA DENSHI KOGYO K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...
- Publication number 20100206940
- Publication date Aug 19, 2010
- KAIJO CORPORATION
- Toru ARAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20100102444
- Publication date Apr 29, 2010
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...
- Publication number 20100059574
- Publication date Mar 11, 2010
- KAIJO CORPORATION
- Toru ARAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20090014855
- Publication date Jan 15, 2009
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080054052
- Publication date Mar 6, 2008
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding structure to electrically connect a printhead chip to...
- Publication number 20060290744
- Publication date Dec 28, 2006
- Jao-cheol Lee
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20060138617
- Publication date Jun 29, 2006
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor element having protruded bump electrodes
- Publication number 20050146029
- Publication date Jul 7, 2005
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20040245607
- Publication date Dec 9, 2004
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20030067067
- Publication date Apr 10, 2003
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and wire bonding apparatus
- Publication number 20020027151
- Publication date Mar 7, 2002
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20010018264
- Publication date Aug 30, 2001
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and method of manufacturing...
- Publication number 20010015481
- Publication date Aug 23, 2001
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a ball bond using a bonding capillary
- Publication number 20010005054
- Publication date Jun 28, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

of the pressing surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-segment wire-bond

Multi-segment wire-bond

Semiconductor device and ball bonder

Semiconductor device

Semiconductor device

Metal contact for semiconductor device

Integrated circuit packaging system with interconnects and method o...

Copper on organic solderability preservative (OSP) interconnect and...

Wafer level package using stud bump coated with solder

Wire bonding method, wire bonding apparatus, and wire bonding contr...

Wire bonding method, wire bonding apparatus, and wire bonding contr...

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor element having protruded bump electrodes

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor element having protruded bump electrodes

Semiconductor integrated circuit device and method of manufacturing...

Wire bonding method and wire bonding apparatus

Bond pad sealing using wire bonding

Wire bonding method

Method of forming a ball bond using a bonding capillary

Capillary for a wire bonding apparatus

Capillary tip for bonding a wire

Bonding means and method

Composite bonding tool and method of making same

3917148

3313464

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

MULTI-SEGMENT WIRE-BOND

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

MULTI-SEGMENT WIRE-BOND

SEMICONDUCTOR DEVICE AND BALL BONDER

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...

SEMICONDUCTOR DEVICE

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

BONDING WIRE

WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...

WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wire bonding structure to electrically connect a printhead chip to...

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor element having protruded bump electrodes

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor integrated circuit device and method of manufacturing...

Wire bonding method and wire bonding apparatus

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor integrated circuit device and method of manufacturing...

Method of forming a ball bond using a bonding capillary