3313464

Information

• Patent Grant
• 3313464

• References
• Source

• Patent Number

  3,313,464

• Date Filed

  Not available

• Date Issued

  Tuesday, April 11, 1967
  57 years ago

• CPC

  • H01L24/85 - using a wire connector
  • B23K20/005 - Capillary welding
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L2224/45015 - being circular
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/48137 - the bodies being arranged next to each other
  • H01L2224/4823 - connecting the wire to a pin of the item
  • H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/48699 - Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
  • H01L2224/78301 - Capillary
  • H01L2224/78303 - of the pressing surface
  • H01L2224/78313 - Wedge
  • H01L2224/78318 - inside the capillary
  • H01L2224/7855 - Mechanical means
  • H01L2224/85201 - Compression bonding
  • H01L2224/85203 - Thermocompression bonding
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01322 - Eutectic Alloys
  • Y10S228/904 - Wire bonding
  • Y10T29/49162 - by using wire as conductive path
  • Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor
  • Y10T29/49194 - Assembling elongated conductors, e.g., splicing, etc.

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 257 - Active solid-state devices