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H01L2224/30183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,972,555
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a light emitting device
- Patent number 9,768,152
- Issue date Sep 19, 2017
- Nichia Corporation
- Hideaki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interposer
- Patent number 8,829,654
- Issue date Sep 9, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a substrate and an interposer
- Patent number 8,829,655
- Issue date Sep 9, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an organic substrate and interposer...
- Patent number 8,587,132
- Issue date Nov 19, 2013
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20180033709
- Publication date Feb 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A LIGHT EMITTING DEVICE
- Publication number 20170040302
- Publication date Feb 9, 2017
- Nichia Corporation.
- Hideaki TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Interposer
- Publication number 20140061886
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including a Substrate and an Interposer
- Publication number 20140061945
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Interposer with Through-Semiconduct...
- Publication number 20140061946
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including an Organic Substrate and Interposer...
- Publication number 20130214426
- Publication date Aug 22, 2013
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTEGRATED CIRCUIT
- Publication number 20110215465
- Publication date Sep 8, 2011
- Xilinx, Inc.
- Arifur Rahman
- H01 - BASIC ELECTRIC ELEMENTS

On contiguous sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Semiconductor device and method of manufacturing same

Electronic system having increased coupling by using horizontal and...

Method for producing a light emitting device

Semiconductor package with interposer

Semiconductor package including a substrate and an interposer

Semiconductor package including an organic substrate and interposer...

Patents Applicationslast 30 patents

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR PRODUCING A LIGHT EMITTING DEVICE

CHIP AND CHIP ARRANGEMENT

Semiconductor Package with Interposer

Semiconductor Package Including a Substrate and an Interposer

Semiconductor Package Including Interposer with Through-Semiconduct...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Semiconductor Package Including an Organic Substrate and Interposer...

MULTI-CHIP INTEGRATED CIRCUIT