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H01L2224/09183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Serializer-deserializer die for high speed signal interconnect
- Patent number 11,581,282
- Issue date Feb 14, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor module for PCB embedding
- Patent number 11,404,392
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,964,610
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dice systems
- Patent number 10,916,524
- Issue date Feb 9, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with optical inspection feature
- Patent number 9,287,238
- Issue date Mar 15, 2016
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Mechanisms for Dies with Different Sizes of Connectors
- Publication number 20210217672
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING MULTIPLE CHIPS USING AN INTERCONNECT DEVICE
- Publication number 20200402913
- Publication date Dec 24, 2020
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DICE SYSTEMS
- Publication number 20200083194
- Publication date Mar 12, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT
- Publication number 20200075521
- Publication date Mar 5, 2020
- Intel Corporation
- Adel A. Elsherbini
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Leadless Semiconductor Package with Optical Inspection Feature
- Publication number 20150155229
- Publication date Jun 4, 2015
- INFINEON TECHNOLOGIES AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE SIDE CONNECTION
- Publication number 20150084202
- Publication date Mar 26, 2015
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS

On contiguous sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting multiple chips using an interconnect device

Serializer-deserializer die for high speed signal interconnect

Packaging mechanisms for dies with different sizes of connectors

Molded semiconductor module for PCB embedding

Packaging mechanisms for dies with different sizes of connectors

Stacked dice systems

Leadless semiconductor package with optical inspection feature

Die edge side connection

Patents Applicationslast 30 patents

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

Packaging Mechanisms for Dies with Different Sizes of Connectors

CONNECTING MULTIPLE CHIPS USING AN INTERCONNECT DEVICE

STACKED DICE SYSTEMS

SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT

Leadless Semiconductor Package with Optical Inspection Feature

DIE EDGE SIDE CONNECTION