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H01L2224/17183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17183On contiguous sides of the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,707,145
- Issue date Jul 7, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die semiconductor structure with intermediate vertical side c...
- Patent number 9,812,425
- Issue date Nov 7, 2017
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die semiconductor structure with intermediate vertical side c...
- Patent number 9,478,524
- Issue date Oct 25, 2016
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package and method of manufacturing the same
- Patent number 9,343,436
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method to enable controlled side chip interconnection for 3D integr...
- Patent number 9,136,251
- Issue date Sep 15, 2015
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,551,816
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,237,271
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of conductive lines on the back side of wafers and dice for sem...
- Patent number 5,817,530
- Issue date Oct 6, 1998
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines on the back side of wafers and dice for semiconduc...
- Patent number 5,801,448
- Issue date Sep 1, 1998
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...
- Publication number 20220392862
- Publication date Dec 8, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165696
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE C...
- Publication number 20170018530
- Publication date Jan 19, 2017
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150021755
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE CONTROLLED SIDE CHIP INTERCONNECTION FOR 3D INTEGR...
- Publication number 20130341803
- Publication date Dec 26, 2013
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Edge Connection for Multi-Chip Integrated Circuits
- Publication number 20120187577
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS
- Publication number 20080315409
- Publication date Dec 25, 2008
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS

On contiguous sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

High density multi-component packages

Semiconductor method for forming semiconductor structure having bum...

Semiconductor structure having bump on tilting upper corner surface

Multi-die semiconductor structure with intermediate vertical side c...

Multi-die semiconductor structure with intermediate vertical side c...

Stacked package and method of manufacturing the same

Method to enable controlled side chip interconnection for 3D integr...

Direct edge connection for multi-chip integrated circuits

Direct edge connection for multi-chip integrated circuits

Use of conductive lines on the back side of wafers and dice for sem...

Conductive lines on the back side of wafers and dice for semiconduc...

Patents Applicationslast 30 patents

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE C...

STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD TO ENABLE CONTROLLED SIDE CHIP INTERCONNECTION FOR 3D INTEGR...

Direct Edge Connection for Multi-Chip Integrated Circuits

DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS