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H01L2224/30181

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/30181On opposite sides of the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,009,349
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with temperature sensors and shaped top...
- Patent number 11,728,251
- Issue date Aug 15, 2023
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DMOS FET chip scale package and method of making the same
- Patent number 11,699,627
- Issue date Jul 11, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with shielding struc...
- Patent number 11,270,953
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,685,932
- Issue date Jun 16, 2020
- Mitsubishi Electric Corporation
- Sho Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with preferred heat dissipating eff...
- Patent number 10,679,965
- Issue date Jun 9, 2020
- ZOWIE TECHNOLOGY CORPORATION
- Chia-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro devices
- Patent number 10,431,569
- Issue date Oct 1, 2019
- PlayNitride Inc.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interconnections having different melting temperatures
- Patent number 10,211,133
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,177,109
- Issue date Jan 8, 2019
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming a thin semiconductor device
- Patent number 8,993,381
- Issue date Mar 31, 2015
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 8,829,534
- Issue date Sep 9, 2014
- Mitsubishi Electric Corporation
- Masao Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 8,810,026
- Issue date Aug 19, 2014
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming a thin semiconductor device
- Patent number 8,723,299
- Issue date May 13, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor modules and semiconductor module
- Patent number 8,629,004
- Issue date Jan 14, 2014
- Denso Corporation
- Daisuke Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor packages stacked on on...
- Patent number 8,537,551
- Issue date Sep 17, 2013
- Denso Corporation
- Shigeo Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,470,644
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power package including multiple semiconductor devices
- Patent number 8,399,997
- Issue date Mar 19, 2013
- Shanghai Kalhong Electronic Company Limited
- Jiangyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20240371841
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243111
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203813
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055332
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE
- Publication number 20230282601
- Publication date Sep 7, 2023
- Fuji Electric Co., Ltd.
- Yoshinori UEZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Same
- Publication number 20230045422
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20220278009
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE
- Publication number 20210166997
- Publication date Jun 3, 2021
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20210125903
- Publication date Apr 29, 2021
- Mitsubishi Electric Corporation
- Masakazu TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210125887
- Publication date Apr 29, 2021
- Toyota Jidosha Kabushiki Kaisha
- Keigo INABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200144215
- Publication date May 7, 2020
- Mitsubishi Electric Corporation
- Sho SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20190157192
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190157235
- Publication date May 23, 2019
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20180138111
- Publication date May 17, 2018
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20170170150
- Publication date Jun 15, 2017
- KABUSHIKI KAISHA TOSHIBA
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MODULE
- Publication number 20150262915
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Miwako SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module comprising two substrates and method of manufacturing...
- Publication number 20140353818
- Publication date Dec 4, 2014
- Ottmar GEITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A THIN SEMICONDUCTOR DEVICE
- Publication number 20140220742
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Kahlil HOSSEINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20130154081
- Publication date Jun 20, 2013
- TOYOTA JIDOSHI KABUSHIKI KAISHA
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS

On opposite sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selectable monolithic or external scalable die-to-die interconnecti...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Semiconductor device having high yield strength intermediate plate

Vertical semiconductor package including horizontally stacked dies...

Semiconductor package and method of forming same

Selectable monolithic or external scalable die-to-die interconnecti...

Semiconductor power module with temperature sensors and shaped top...

DMOS FET chip scale package and method of making the same

Power module comprising two substrates and method of manufacturing...

Structure and formation method of chip package with shielding struc...

Semiconductor device

Semiconductor package structure with preferred heat dissipating eff...

Method of transferring micro devices

Package with interconnections having different melting temperatures

Method of manufacturing semiconductor device

Method for producing structured sintered connection layers, and sem...

Small footprint semiconductor package

Semiconductor packaging containing sintering die-attach material

Semiconductor device

Bump package and methods of formation thereof

Package structure and the method to manufacture thereof

Method for forming a thin semiconductor device

Power semiconductor device

Bonding method and bonding material using metal particle

Semiconductor module

Method and system for forming a thin semiconductor device

Method of manufacturing semiconductor modules and semiconductor module

Semiconductor device including semiconductor packages stacked on on...

Exposed die package for direct surface mounting

Power package including multiple semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

Semiconductor Package and Method of Forming Same

DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

Package with interconnections having different melting temperatures

SEMICONDUCTOR DEVICE

Package with interconnections having different melting temperatures

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MODULE

Power module comprising two substrates and method of manufacturing...

Small Footprint Semiconductor Package

Semiconductor Device and Manufacturing Method Thereof

Method for Producing Structured Sintered Connection Layers, and Sem...

METHOD FOR FORMING A THIN SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

Bump Package and Methods of Formation Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF