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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13562On the entire exposed surface of the core

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a support solder ball
- Patent number 11,948,873
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and fabrication method thereof, display panel and d...
- Patent number 11,563,036
- Issue date Jan 24, 2023
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with conductive underfill ground plane
- Patent number 11,270,972
- Issue date Mar 8, 2022
- NXP B.V.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an illumination device and illumination device
- Patent number 11,094,868
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Klaus Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,985,117
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,872,861
- Issue date Dec 22, 2020
- ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG, TAIWAN
- Yong-Da Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,790,252
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Chip module with porous bonding layer and stacked structure with po...
- Patent number 10,714,448
- Issue date Jul 14, 2020
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,658,279
- Issue date May 19, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 10,522,491
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,510,689
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 10,510,684
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030145
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115347
- Publication date Apr 14, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND D...
- Publication number 20200411562
- Publication date Dec 31, 2020
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Shuai HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE
- Publication number 20200395332
- Publication date Dec 17, 2020
- NXP USA, Inc.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bump Formation Process
- Publication number 20200126937
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20200118947
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20190172778
- Publication date Jun 6, 2019
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20180337144
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20180337155
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED UBM AND MIXED PITCH ON A SINGLE DIE
- Publication number 20180331056
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Bump Formation Process
- Publication number 20180247907
- Publication date Aug 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE INTERCONNECTS
- Publication number 20180182696
- Publication date Jun 28, 2018
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTERCONNECT STRUCTURE
- Publication number 20180151523
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-TSE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061798
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
- Publication number 20170330852
- Publication date Nov 16, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20170330853
- Publication date Nov 16, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS

On the entire exposed surface of the core

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Semiconductor device and method for manufacturing the same

Semiconductor package including a support solder ball

Methods of manufacturing a semiconductor device including a joint a...

Industrial chip scale package for microelectronic device

Structures and methods for low temperature bonding using nanoparticles

Array substrate and fabrication method thereof, display panel and d...

Three dimensional integrated circuit (3DIC) with support structures

Semiconductor device and bump formation process

Package with conductive underfill ground plane

Mixed UBM and mixed pitch on a single die

Method of making a pillar structure having a non-metal sidewall pro...

Enhanced adhesive materials and processes for 3D applications

Method for manufacturing interconnect structure

Method for producing an illumination device and illumination device

Solder ball protection in packages

Interconnection structure including a metal post encapsulated by a...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Semiconductor packages

Mixed UBM and mixed pitch on a single die

Semiconductor devices, methods of manufacture thereof, and packaged...

Enhanced adhesive materials and processes for 3D applications

Chip module with porous bonding layer and stacked structure with po...

High density package interconnects

Structures and methods for low temperature bonding using nanoparticles

Semiconductor device and bump formation process

Solder ball protection in packages

Three dimensional integrated circuit (3DIC) with support structures

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND D...

PACKAGE WITH CONDUCTIVE UNDERFILL GROUND PLANE

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Semiconductor Device and Bump Formation Process

Solder Ball Protection in Packages

HIGH DENSITY PACKAGE INTERCONNECTS

Package-On-Package (PoP) Structure Including Stud Bulbs

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

Solder Ball Protection in Packages

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

MIXED UBM AND MIXED PITCH ON A SINGLE DIE

Semiconductor Device And Bump Formation Process

HIGH DENSITY PACKAGE INTERCONNECTS

METHOD FOR MANUFACTURING INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package-On-Package (PoP) Structure Including Stud Bulbs

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...