On the entire surface of the internal layer

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H01L2224/05561

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05561On the entire surface of the internal layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,142,587
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,804,459
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 11,699,678
- Issue date Jul 11, 2023
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing low dielectric constant bonding dielectr...
- Patent number 11,646,283
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-emission semiconductor device and method of manufacturing same
- Patent number 11,335,830
- Issue date May 17, 2022
- Sony Corporation
- Naoki Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 11,075,187
- Issue date Jul 27, 2021
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,491
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 10,950,568
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,510,700
- Issue date Dec 17, 2019
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 10,153,248
- Issue date Dec 11, 2018
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,032,739
- Issue date Jul 24, 2018
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 9,837,375
- Issue date Dec 5, 2017
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,595,469
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,937
- Issue date May 31, 2016
- Mitsubishi Electric Corporation
- Hidetoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked solder bumps with intervening...
- Patent number 9,142,498
- Issue date Sep 22, 2015
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the production of an electronic component and electronic...
- Patent number 9,054,080
- Issue date Jun 9, 2015
- United Monolithic Semiconductors GmbH
- Guenter Jonsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,933,559
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,299,605
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Veeraraghavan S Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device having through electrode and method of fabrica...
- Patent number 7,777,345
- Issue date Aug 17, 2010
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a semiconductor device having a roughened surface
- Patent number 7,560,372
- Issue date Jul 14, 2009
- NEC Electronics Corporation
- Hiroaki Tomimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a roughened surface
- Patent number 7,170,172
- Issue date Jan 30, 2007
- NEC Electronics Corporation
- Hiroaki Tomimori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...
- Publication number 20240304648
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162343
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Yuji ENARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20240153966
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Se Hun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...
- Publication number 20240021628
- Publication date Jan 18, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhuhui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230420397
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411233
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230326932
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Duck SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20230275065
- Publication date Aug 31, 2023
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230238398
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byeong Kyun CHOI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238373
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Nak Cho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230049315
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384373
- Publication date Dec 1, 2022
- XINTEC INC.
- Chieh CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20220285596
- Publication date Sep 8, 2022
- XIAMEN SANAN OPTOELECTRONICS CO., LTD.
- Shiwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...
- Publication number 20220216244
- Publication date Jul 7, 2022
- ams AG
- Gerhard EILMSTEINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220102319
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTR...
- Publication number 20210327838
- Publication date Oct 21, 2021
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210074669
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20210057378
- Publication date Feb 25, 2021
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200098713
- Publication date Mar 26, 2020
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190189584
- Publication date Jun 20, 2019
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20190067241
- Publication date Feb 28, 2019
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20180301429
- Publication date Oct 18, 2018
- ROHM CO., LTD.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20180068976
- Publication date Mar 8, 2018
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20170250158
- Publication date Aug 31, 2017
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20170243844
- Publication date Aug 24, 2017
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS

On the entire surface of the internal layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of fabricating the same

Semiconductor device assembly with surface-mount die support struct...

Semiconductor device and method of fabricating the same

Semiconductor device and method of forming insulating layers around...

Bonded assembly containing low dielectric constant bonding dielectr...

Semiconductor device including bonding pads and method of manufactu...

Photo-emission semiconductor device and method of manufacturing same

Conductive barrier direct hybrid bonding

Semiconductor device and method of forming insulating layers around...

Semiconductor device

Semiconductor device packages and methods of manufacturing the same

Semiconductor device assembly with surface-mount die support struct...

Semiconductor device

Semiconductor device and method of forming insulating layers around...

Semiconductor device

Semiconductor device and method of forming insulating layers around...

Method for bonding metallic contact areas with solution of a sacrif...

Semiconductor device and method for producing the same

Semiconductor device

Semiconductor devices having stacked solder bumps with intervening...

Method for the production of an electronic component and electronic...

Carbon nanotube structures for enhancement of thermal dissipation f...

Carbon nanotube structures for enhancement of thermal dissipation f...

Semiconductor device having through electrode and method of fabrica...

Process for making a semiconductor device having a roughened surface

Semiconductor device having a roughened surface

Patents Applicationslast 30 patents

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor Device and Method of Forming Insulating Layers Around...

DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTR...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Insulating Layers Around...

Semiconductor Device

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Insulating Layers Around...

Semiconductor Device

Semiconductor Device and Method of Forming Insulating Layers Around...

Semiconductor Device and Method of Forming Insulating Layers Around...

Semiconductor Device