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H01L2224/73101

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73101on the same surface

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including post
- Patent number 11,967,578
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer
- Patent number 11,682,627
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,094,641
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,685,934
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die, and method of fo...
- Patent number 10,510,674
- Issue date Dec 17, 2019
- TAIWAN SEMICONDUCTOR MANUFACTURING, COMPANY, LTD.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die, and method of fo...
- Patent number 10,163,802
- Issue date Dec 25, 2018
- TAIWAN SEMICONDCUTOR MANUFACTURING COMPANY, LTD.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240379489
- Publication date Nov 14, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20240266298
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING POST
- Publication number 20240243090
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jaekul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
- Publication number 20240105659
- Publication date Mar 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...
- Publication number 20240030173
- Publication date Jan 25, 2024
- NXP B.V.
- Che Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006357
- Publication date Jan 4, 2024
- Rohm Co., Ltd.
- Takayuki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS
- Publication number 20230095931
- Publication date Mar 30, 2023
- DESIGNER MOLECULES, INC.
- Farhad Mizori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092121
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230021362
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Yeohoon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230012399
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Dae Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...
- Publication number 20220392866
- Publication date Dec 8, 2022
- SK HYNIX INC.
- Jeong Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING POST
- Publication number 20220246568
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Jaekul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...
- Publication number 20220223560
- Publication date Jul 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER
- Publication number 20210167017
- Publication date Jun 3, 2021
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Fo...
- Publication number 20200111749
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Fo...
- Publication number 20190148305
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013289
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Dummy Die and Method of Forming
- Publication number 20180151502
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS

on the same surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out package having a main die and a dummy die

Fan-out package having a main die and a dummy die

Semiconductor package including post

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor package including an interposer

Fan-out package having a main die and a dummy die

Semiconductor package device and method of manufacturing the same

Fan-out package having a main die and a dummy die, and method of fo...

Fan-out package having a main die and a dummy die, and method of fo...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR PACKAGE INCLUDING POST

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...

SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR

UBM-FREE METAL SKELETON FRAME WITH SUPPORT STUDS AND METHOD FOR FAB...

SEMICONDUCTOR DEVICE

Harvested Reconstitution Bumping

UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...

SEMICONDUCTOR PACKAGE INCLUDING POST

CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER

Fan-Out Package Having a Main Die and a Dummy Die, and Method of Fo...

Fan-Out Package Having a Main Die and a Dummy Die, and Method of Fo...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Fan-Out Package Having a Dummy Die and Method of Forming