on the semiconductor or sold-state device [

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19104on the semiconductor or sold-state device [

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resistor element
- Patent number 12,142,589
- Issue date Nov 12, 2024
- SK hynix Inc.
- Chan Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 12,131,988
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of cracks in passivation layer
- Patent number 12,087,714
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure with a redistribution layer and a buffer layer
- Patent number 12,080,753
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices including source structu...
- Patent number 12,046,582
- Issue date Jul 23, 2024
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including resistor element
- Patent number 11,929,336
- Issue date Mar 12, 2024
- SK hynix Inc.
- Chan Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency module with multi-mode stacked...
- Patent number 11,864,295
- Issue date Jan 2, 2024
- Skyworks Solutions, Inc.
- Yasser Khairat Soliman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and passive element with interposer
- Patent number 11,848,262
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having distinguishable electrodes
- Patent number 11,817,439
- Issue date Nov 14, 2023
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant material at locations of high fields
- Patent number 11,749,712
- Issue date Sep 5, 2023
- Skyworks Solutions, Inc.
- Dan B. Kasha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure including bonding pads as electrodes and method...
- Patent number 11,728,305
- Issue date Aug 15, 2023
- SanDisk Technologies LLC
- Shiqian Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure and methods of forming the same
- Patent number 11,715,756
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...
- Publication number 20240371834
- Publication date Nov 7, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371920
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...
- Publication number 20240371809
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Haritez Narisetty
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20240234231
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240222262
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203961
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240203962
- Publication date Jun 20, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Cyrille Laviron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
- Publication number 20240178172
- Publication date May 30, 2024
- SK HYNIX INC.
- Chan Ho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
- Publication number 20240145447
- Publication date May 2, 2024
- pSemi Corporation
- Shishir Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128248
- Publication date Apr 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Passive Element with Interposer
- Publication number 20240079310
- Publication date Mar 7, 2024
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES
- Publication number 20240030175
- Publication date Jan 25, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240021592
- Publication date Jan 18, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE
- Publication number 20230387053
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Changhun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END MODULE WITH VERTICALLY STACKED DIE AND CIRCULATOR
- Publication number 20230387042
- Publication date Nov 30, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230335578
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20230317693
- Publication date Oct 5, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or sold-state device [

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor device

Semiconductor device including resistor element

Integrating passive devices in package structures

Semiconductor package and passive element with interposer

Reduction of cracks in passivation layer

Semiconductor device assembly with surface-mount die support struct...

Device structure with a redistribution layer and a buffer layer

Multi-die fine grain integrated voltage regulation

Package structure and method of forming the same

Methods of forming microelectronic devices including source structu...

Structures for low temperature bonding using nanoparticles

Vertical inductor for WLCSP

Methods for low temperature bonding using nanoparticles

Structure and method for fabricating a computing system with an int...

Process for thin film capacitor integration

Electronic devices in semiconductor package cavities

Semiconductor device including resistor element

Multilayer power, converter with devices having reduced lateral cur...

Selectively shielded radio frequency module with multi-mode stacked...

Semicondutor package substrate with die cavity and redistribution l...

Semiconductor package and passive element with interposer

Semiconductor device

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device having distinguishable electrodes

High dielectric constant material at locations of high fields

Passive devices in package-on-package structures and methods for fo...

Capacitor structure including bonding pads as electrodes and method...

Device structure and methods of forming the same

Structures and methods for low temperature bonding using nanoparticles

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

REDUCTION OF CRACKS IN PASSIVATION LAYER

MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...

DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

Structure and Method for Fabricating a Computing System with an Int...

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT

SEMICONDUCTOR DEVICE

Integration of Discrete Embeddable Capacitors on Integrated Circuit...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Package and Passive Element with Interposer

INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES

SEMICONDUCTOR DEVICE

NON-VOLATILE MEMORY DEVICE

FRONT-END MODULE WITH VERTICALLY STACKED DIE AND CIRCULATOR

Structure and Method for Fabricating a Computing System with an Int...

DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF