on the semiconductor or solid-state body

Industry

CPC
H01L2224/09103

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09103on the semiconductor or solid-state body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit chip, integrated circuit package and display app...
- Patent number 11,721,640
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Jun-gu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, integrated circuit package and display app...
- Patent number 11,222,853
- Issue date Jan 11, 2022
- Samsung Electronics Co., Ltd.
- Jun-gu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,685,934
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned interlockin...
- Patent number 10,381,322
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Yasunobu Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,318,426
- Issue date Apr 19, 2016
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,420,444
- Issue date Apr 16, 2013
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...
- Publication number 20220392862
- Publication date Dec 8, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257324
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP, INTEGRATED CIRCUIT PACKAGE AND DISPLAY APP...
- Publication number 20200227359
- Publication date Jul 16, 2020
- Samsung Electronics Co., Ltd.
- Jun-gu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013289
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130187271
- Publication date Jul 25, 2013
- FUJITSU TEN LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110233765
- Publication date Sep 29, 2011
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit chip, integrated circuit package and display app...

Integrated circuit chip, integrated circuit package and display app...

Semiconductor package device and method of manufacturing the same

Three-dimensional memory device containing self-aligned interlockin...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT CHIP, INTEGRATED CIRCUIT PACKAGE AND DISPLAY APP...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME