on the semiconductor or solid-state body

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H01L2224/48482

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48482on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-chip package
- Patent number 10,679,972
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for remapping a packaged extracted die
- Patent number 10,177,054
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 9,508,673
- Issue date Nov 29, 2016
- Nanya Technology Corporation
- Po-Chun Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices with embedded die interconnect structures, and m...
- Patent number 9,401,338
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including embedded controller die and method o...
- Patent number 9,236,368
- Issue date Jan 12, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,024,454
- Issue date May 5, 2015
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire having different width portions
- Patent number 8,772,952
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flex bump
- Patent number 8,637,394
- Issue date Jan 28, 2014
- Stats Chippac Ltd.
- Jairus Legaspi Pisigan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wire bonds in semiconductor devices
- Patent number 8,198,737
- Issue date Jun 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Changliang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding over active circuits
- Patent number 8,125,091
- Issue date Feb 28, 2012
- LSI Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including wire bonds
- Patent number 7,888,257
- Issue date Feb 15, 2011
- Agere Systems Inc.
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and manufacturing method thereof
- Patent number 7,859,123
- Issue date Dec 28, 2010
- Great Team Backend Foundry Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a stacked bump to reduce kirkendall voi...
- Patent number 7,847,398
- Issue date Dec 7, 2010
- Amkor Technology, Inc.
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked bump structure and manufacturing method thereof
- Patent number 7,566,970
- Issue date Jul 28, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,417,324
- Issue date Aug 26, 2008
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonds having pressure-absorbing balls
- Patent number 7,404,513
- Issue date Jul 29, 2008
- Texas Instruments Incorporated
- Sohichi Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for wire bonding over active, brittle and lo...
- Patent number 7,176,580
- Issue date Feb 13, 2007
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by utiliz...
- Patent number 6,624,059
- Issue date Sep 23, 2003
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to remove semiconductor chips from a plastic package
- Patent number 6,429,028
- Issue date Aug 6, 2002
- DPA Labs, Incorporated
- Philip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by using...
- Patent number 6,420,256
- Issue date Jul 16, 2002
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by using...
- Patent number 6,165,887
- Issue date Dec 26, 2000
- Micron Technology , Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by utiliz...
- Patent number 6,034,440
- Issue date Mar 7, 2000
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor device by utilizi...
- Patent number 5,976,964
- Issue date Nov 2, 1999
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304590
- Publication date Sep 12, 2024
- DENSO CORPORATION
- MASAKAZU WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION
- Publication number 20240006353
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anton Johann BAYERSTADLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND IMPEDANCE MATCHING
- Publication number 20220254750
- Publication date Aug 11, 2022
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189906
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding For Semiconductor Devices
- Publication number 20220052014
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD
- Publication number 20160247777
- Publication date Aug 25, 2016
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD
- Publication number 20150262963
- Publication date Sep 17, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Kenichi KOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND M...
- Publication number 20140145325
- Publication date May 29, 2014
- ALAN J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Structures for Integrated Circuits
- Publication number 20130241058
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE FOR WIRE-BONDING CONNECTION
- Publication number 20130026658
- Publication date Jan 31, 2013
- Yen-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110074019
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...
- Publication number 20110018135
- Publication date Jan 27, 2011
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING WIRE BONDS IN SEMICONDUCTOR DEVICES
- Publication number 20100314754
- Publication date Dec 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Changliang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295180
- Publication date Nov 25, 2010
- GREAT TEAM BACKEND FOUNDRY INC.
- CHING HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTUR...
- Publication number 20100126763
- Publication date May 27, 2010
- Fujitsu Limited
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072619
- Publication date Mar 25, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING OVER ACTIVE CIRCUITS
- Publication number 20090236742
- Publication date Sep 24, 2009
- LSI Corporation
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package including wire bonds
- Publication number 20090098687
- Publication date Apr 16, 2009
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090032947
- Publication date Feb 5, 2009
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20090020872
- Publication date Jan 22, 2009
- SHINKAWA LTD.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP
- Publication number 20090008761
- Publication date Jan 8, 2009
- Jairus Legaspi Pisigan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT D...
- Publication number 20080293235
- Publication date Nov 27, 2008
- Harris Corporation
- Hector Deju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
- Publication number 20080272487
- Publication date Nov 6, 2008
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package using copper wires and wire bonding method fo...
- Publication number 20080265385
- Publication date Oct 30, 2008
- Siliconware Precision Industries Co., Ltd.
- Han-Lung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonds Having Pressure-Absorbing Balls
- Publication number 20080251918
- Publication date Oct 16, 2008
- TEXAS INSTRUMENTS INCORPORATED
- SOHICHI KADOGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Wire bonding for semiconductor devices

Semiconductor package including stacked semiconductor chips

Method of manufacturing multi-chip package

Surface finish for wirebonding

Method for remapping a packaged extracted die

Wire bonding method

Electronic devices with embedded die interconnect structures, and m...

Semiconductor device including embedded controller die and method o...

Method of manufacturing semiconductor device

Semiconductor device with copper wire having different width portions

Integrated circuit package system with flex bump

Method of forming wire bonds in semiconductor devices

Semiconductor device and manufacturing method for the same

Wire bonding over active circuits

Integrated circuit package including wire bonds

Wire bonding structure and manufacturing method thereof

Semiconductor device having a stacked bump to reduce kirkendall voi...

Stacked bump structure and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Wire bonds having pressure-absorbing balls

Structures and methods for wire bonding over active, brittle and lo...

Method of improving interconnect of semiconductor devices by utiliz...

Process to remove semiconductor chips from a plastic package

Method of improving interconnect of semiconductor devices by using...

Method of improving interconnect of semiconductor devices by using...

Method of improving interconnect of semiconductor devices by utiliz...

Method of improving interconnect of semiconductor device by utilizi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

BALL BOND IMPEDANCE MATCHING

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

Wire Bonding For Semiconductor Devices

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

WIRE BONDING METHOD

SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND M...

Wire Bonding Structures for Integrated Circuits

WAFER LEVEL CHIP SCALE PACKAGE FOR WIRE-BONDING CONNECTION

SEMICONDUCTOR DEVICE

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...

METHOD OF FORMING WIRE BONDS IN SEMICONDUCTOR DEVICES

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTUR...

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

WIRE BONDING OVER ACTIVE CIRCUITS

Integrated circuit package including wire bonds

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP

COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT D...

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Semiconductor package using copper wires and wire bonding method fo...

Wire Bonds Having Pressure-Absorbing Balls