on the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49426on the semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device reducing risks of a wire short-circuit and a w...
- Patent number 8,975,760
- Issue date Mar 10, 2015
- PS4 Luxco S.A.R.L.
- Shori Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,941,237
- Issue date Jan 27, 2015
- PS4 Luxco S.A.R.L.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly and chip assembling method
- Patent number 8,860,219
- Issue date Oct 14, 2014
- Hon Hai Precision Industry Co., Ltd.
- Kai-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having multiple wire bonds for a bond area and methods thereof
- Patent number 8,791,007
- Issue date Jul 29, 2014
- Spansion LLC
- Gin Ghee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,487,433
- Issue date Jul 16, 2013
- Elpida Memory, Inc.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bond connection system
- Patent number 8,181,845
- Issue date May 22, 2012
- Robert Bosch GmbH
- Manfred Reinold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 7,821,140
- Issue date Oct 26, 2010
- Shinkawa Ltd.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond and method for bonding two contact surfaces
- Patent number 7,582,832
- Issue date Sep 1, 2009
- Robert Bosch GmbH
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a number of bonding leads and method for...
- Patent number 7,391,121
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for coupling conductive leads of semiconducto...
- Patent number 6,602,778
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for coupling conductive leads of semiconducto...
- Patent number 6,380,635
- Issue date Apr 30, 2002
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically coupling bond pads of a microelectronic device
- Patent number 6,192,578
- Issue date Feb 27, 2001
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electrically coupling bond pads of a microelectronic...
- Patent number 6,169,331
- Issue date Jan 2, 2001
- Micron Technology, Inc.
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sense circuit
- Patent number 4,945,445
- Issue date Jul 31, 1990
- Gentron Corporation
- Richard F. Schmerda
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20160049390
- Publication date Feb 18, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD
- Publication number 20130285239
- Publication date Oct 31, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130277835
- Publication date Oct 24, 2013
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING MULTIPLE WIRE BONDS FOR A BOND AREA AND METHODS THEREOF
- Publication number 20130134578
- Publication date May 30, 2013
- SPANSION LLC
- Gin Ghee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE REDUCING RISKS OF A WIRE SHORT-CIRCUIT AND A W...
- Publication number 20130037941
- Publication date Feb 14, 2013
- Elpida Memory, Inc.
- Shori FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20120193791
- Publication date Aug 2, 2012
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120061826
- Publication date Mar 15, 2012
- Elpida Memory, Inc.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BOND CONNECTION SYSTEM
- Publication number 20110121059
- Publication date May 26, 2011
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20100237480
- Publication date Sep 23, 2010
- SHINKAWA LTD.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Center Conductor to Integrated Circuit for High Frequency Applications
- Publication number 20090079042
- Publication date Mar 26, 2009
- AGILENT TECHNOLOGIES, INC.
- Jim Clatterbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20080023831
- Publication date Jan 31, 2008
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond and method for bonding two contact surfaces
- Publication number 20080006437
- Publication date Jan 10, 2008
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure
- Publication number 20070215993
- Publication date Sep 20, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sheng-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a number of bonding leads and method for...
- Publication number 20060186554
- Publication date Aug 24, 2006
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for coupling conductive leads of semiconducto...
- Publication number 20020089070
- Publication date Jul 11, 2002
- Troy A. Manning
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor device reducing risks of a wire short-circuit and a w...

Semiconductor device

Chip assembly and chip assembling method

Device having multiple wire bonds for a bond area and methods thereof

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device

Electrical bond connection system

Semiconductor device and manufacturing method for the same

Semiconductor device and wire bonding method

Bond and method for bonding two contact surfaces

Semiconductor device with a number of bonding leads and method for...

Apparatus and methods for coupling conductive leads of semiconducto...

Apparatus and methods for coupling conductive leads of semiconducto...

Method for electrically coupling bond pads of a microelectronic device

Apparatus for electrically coupling bond pads of a microelectronic...

Current sense circuit

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Multiple bond via arrays of different wire heights on a same substrate

CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD

SEMICONDUCTOR DEVICE

DEVICE HAVING MULTIPLE WIRE BONDS FOR A BOND AREA AND METHODS THEREOF

SEMICONDUCTOR DEVICE REDUCING RISKS OF A WIRE SHORT-CIRCUIT AND A W...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

ELECTRICAL BOND CONNECTION SYSTEM

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor device and manufacturing method for the same

Bond and method for bonding two contact surfaces

Chip Package Structure

Semiconductor device with a number of bonding leads and method for...

Apparatus and methods for coupling conductive leads of semiconducto...