Chip Package Structure

Abstract

A chip package structure including a carrier, a chip, first bonding wires, second bonding wires, and an encapsulant is provided. The carrier has first contacts and at least one second contact, and the chip has at lease one first bonding pad and at least one second bonding pad. In addition, the first bonding wire electrically connects the first bonding pad and the first contact, and the second bonding wire electrically connects the second bonding pad and the second contact, wherein each of the first bonding pads electrically connects at least two first contacts through at least two first bonding wires, and each second bonding pad electrically connects the second contact through one single second bonding wire. Further, the encapsulant is disposed on the carrier to encapsulate the chip, the first bonding wires, and the second bonding wires.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

FIG. 1A is a schematic diagram showing a conventional chip package structure;

FIG. 1B is a schematic top view illustrating the conventional chip package structure shown in FIG. 1A;

FIG. 2 is a schematic top view illustrating another conventional chip package structure;

FIG. 3A is a schematic diagram showing a chip package structure according to a first embodiment of the present invention;

FIG. 3B is a schematic top view illustrating the chip package structure shown in FIG. 3A;

FIG. 3C is a schematic diagram showing the structure of the first boding wires shown in FIG. 3A;

FIG. 4 is a schematic top view illustrating a chip package structure according to a second embodiment of the present invention; and

FIG. 5 is a schematic top view illustrating a chip package structure according to a third embodiment of the present invention.

Claims

1. A chip package structure, comprising: a carrier having a plurality of first contacts and at least one second contact;a chip having at least one first bonding pad and at least one second bonding pad;a plurality of first bonding wires electrically connecting the first bonding pad to the first contacts, wherein the first bonding pad is electrically connected to at least two of the first contacts via at least two of the first bonding wires;at least one second bonding wire electrically connecting the at least one second bonding pad to the second contact, wherein the second bonding pad is electrically connected to a second contact via one of the at least one second bonding wire; andan encapsulant disposed on the carrier to encapsulate the chip, the first bonding wires, and the at least one second bonding wire.

2. The chip package structure according to claim 1, wherein the carrier is a wiring substrate, and the first contacts and the second contacts are a plurality of connecting pads respectively.

3. The chip package structure according to claim 1, wherein the carrier is lead frame, and the first contacts and the second contacts are a plurality of leads respectively.

4. The chip package structure according to claim 1, wherein each of the first bonding wires comprises: a thumbtack-shaped bump; anda third bonding-wire having a wedge-shaped end connected onto the thumbtack-shaped bump.

5. The chip package structure according to claim 4, wherein the thumbtack-shaped bump and the wedge-shaped end of the third bonding-wire are mutually stacked on the first bonding pad.

6. The chip package structure according to claim 4, wherein the material forming the thumbtack-shaped bump comprises gold.

7. The chip package structure according to claim 4, wherein the material forming the wedge-shaped end of the third bonding-wire comprises gold.

8. A chip package structure, comprising: a carrier having a plurality of contacts;a chip having a plurality of bonding pads;a plurality of first bonding wires electrically connecting the bonding pads to the contacts, wherein at least one of the bonding pads is electrically connected to at least two of the contacts via at least two of the first bonding wires; andan encapsulant disposed on the carrier to encapsulate the chip and the first bonding wires.

9. The chip package structure according to claim 8, wherein the carrier is a wiring substrate, and the contacts are a plurality of connecting pads respectively.

10. The chip package structure according to claim 8, wherein the carrier is lead frame, and the contacts are a plurality of leads respectively.

11. The chip package structure according to claim 8, wherein each of the first bonding wires comprises: a thumbtack-shaped bump; anda third bonding-wire having a wedge-shaped end connected onto the thumbtack-shaped bump.

12. The chip package structure according to claim 11, wherein the thumbtack-shaped bump and the wedge-shaped end of the third bonding-wire are mutually stacked on the bonding pad.

13. The chip package structure according to claim 11, wherein the material forming the thumbtack-shaped bump comprises gold.

14. The chip package structure according to claim 11, wherein the material forming the wedge-shaped end of the third bonding-wire comprises gold.