on the semiconductor or solid-state body

Industry

CPC
H01L2224/48479

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48479on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 11,658,243
- Issue date May 23, 2023
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro-mechanical device having two buried cavities and manu...
- Patent number 11,358,862
- Issue date Jun 14, 2022
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 11,152,342
- Issue date Oct 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe seals and methods of making
- Patent number 11,069,627
- Issue date Jul 20, 2021
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of optoelectronic components
- Patent number 10,847,686
- Issue date Nov 24, 2020
- OSRAM OLED GmbH
- Martin Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 10,734,369
- Issue date Aug 4, 2020
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro-mechanical device having two buried cavities and manu...
- Patent number 10,676,347
- Issue date Jun 9, 2020
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 10,439,065
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with notched main lead
- Patent number 10,431,532
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Kota Ise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 10,381,280
- Issue date Aug 13, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with stacked semiconductor chips
- Patent number 10,347,618
- Issue date Jul 9, 2019
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,312,171
- Issue date Jun 4, 2019
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor component
- Patent number 10,217,915
- Issue date Feb 26, 2019
- Osram Opto Semiconductors GmbH
- Johann Ramchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing optoelectronic semiconductor components, and op...
- Patent number 10,205,071
- Issue date Feb 12, 2019
- Osram Opto Semiconductors GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with overlapped lead terminals
- Patent number 10,134,659
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Hiroaki Narita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor chip package assembly and electronic device having sensor ch...
- Patent number 10,121,750
- Issue date Nov 6, 2018
- Shenzhen Goodix Technology Co., Ltd.
- Yuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,090,237
- Issue date Oct 2, 2018
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20240274570
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
- Publication number 20230275060
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xiaoling Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20220352111
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189906
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME
- Publication number 20200328199
- Publication date Oct 15, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kyohei MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANU...
- Publication number 20200262699
- Publication date Aug 20, 2020
- STMicroelectronics S.r.l.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096908
- Publication date Apr 5, 2018
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20180076188
- Publication date Mar 15, 2018
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180040552
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160293564
- Publication date Oct 6, 2016
- RENESAS ELECTRONICS CORPORATION
- Kenji OYACHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS
- Publication number 20140361444
- Publication date Dec 11, 2014
- Renesas Electronics Corporation
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140353822
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji OYACHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PLURALITY OF CIRCUITS ARRANGED ON A S...
- Publication number 20140339691
- Publication date Nov 20, 2014
- Masato NUMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140332942
- Publication date Nov 13, 2014
- RENESAS ELECTRONICS CORPORATION
- Koichi KANEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140306328
- Publication date Oct 16, 2014
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Module
- Publication number 20140231837
- Publication date Aug 21, 2014
- Frank Singer
- F21 - LIGHTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20140225240
- Publication date Aug 14, 2014
- RENESAS ELECTRONICS CORPORATION
- NORIYUKI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ARRAY PACKAGE
- Publication number 20140227833
- Publication date Aug 14, 2014
- Apple Inc.
- Shawn X. Arnold
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20140167292
- Publication date Jun 19, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro MASUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140127860
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROCESS
- Publication number 20140124919
- Publication date May 8, 2014
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Che-Hau Huang
- H01 - BASIC ELECTRIC ELEMENTS

on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Packages with electrical fuses

Stud bump for wirebonding high voltage isolation barrier connection

Stacked microfeature devices and associated methods

Semiconductor package including stacked semiconductor chips

Inverted leads for packaged isolation devices

Semiconductor device having an electrical connection between semico...

Stacked microfeature devices and associated methods

Micro-electro-mechanical device having two buried cavities and manu...

Receiver optical module and process of assembling the same

Scribe seals and methods of making

Production of optoelectronic components

Semiconductor device having an electrical connection between semico...

Receiver optical module and process of assembling the same

Electronic unit

Micro-electro-mechanical device having two buried cavities and manu...

Inverted leads for packaged isolation devices

Semiconductor device with notched main lead

Semiconductor packages and methods for forming semiconductor package

Silver bonding wire for semiconductor device containing indium, gal...

Non-volatile memory with stacked semiconductor chips

Surface finish for wirebonding

Semiconductor device

Optoelectronic semiconductor component

Method of producing optoelectronic semiconductor components, and op...

Semiconductor device

Semiconductor device

Semiconductor device with overlapped lead terminals

Sensor chip package assembly and electronic device having sensor ch...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME

MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANU...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A PLURALITY OF CIRCUITS ARRANGED ON A S...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LED Module

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

SENSOR ARRAY PACKAGE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROCESS