One or more single auxiliary printed circuits mounted on a main printed circuit

Industry

CPC
H05K1/141

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electric circuit module and manufacturing method thereof
- Patent number 11,979,988
- Issue date May 7, 2024
- TDK Corporation
- Shuichi Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Toolless information handling system Compression attached memory mo...
- Patent number 11,978,971
- Issue date May 7, 2024
- Dell Products, L.P.
- Glenn Chiappe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including antenna connecting structure including...
- Patent number 11,974,401
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Sunghyup Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable device for the brain
- Patent number 11,957,898
- Issue date Apr 16, 2024
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line, method of manufacturing transmission line, and e...
- Patent number 11,956,903
- Issue date Apr 9, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density neural implant cylindrical packaging
- Patent number 11,944,822
- Issue date Apr 2, 2024
- NEURALINK CORP.
- Joshua S. Hess
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and circuit board module thereof
- Patent number 11,917,747
- Issue date Feb 27, 2024
- Chicony Electronics Co., Ltd.
- Chien-Yueh Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fixing device
- Patent number 11,917,784
- Issue date Feb 27, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Point of load module and heatsink therefor
- Patent number 11,910,517
- Issue date Feb 20, 2024
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module and power device
- Patent number 11,901,108
- Issue date Feb 13, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Jin-Fa Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing systems including optical communication modules
- Patent number 11,895,798
- Issue date Feb 6, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Module and method of manufacturing the same
- Patent number 11,889,625
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Akio Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure, display panel, display apparatus, and manu...
- Patent number 11,882,657
- Issue date Jan 23, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Shuang Lei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board system
- Patent number 11,882,658
- Issue date Jan 23, 2024
- Quanta Computer Inc.
- Yaw-Tzorng Tsorng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Riser cards with inline slots
- Patent number 11,877,416
- Issue date Jan 16, 2024
- Hewlett-Packard Development Company, L.P.
- Yu Lih Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component mounting
- Patent number 11,877,414
- Issue date Jan 16, 2024
- Hewlett-Packard Development Company, L.P.
- Bradford Adam Gill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadless pressure sensors
- Patent number 11,867,583
- Issue date Jan 9, 2024
- Honeywell International Inc.
- Manjesh Kumar B
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modular wiring system for actuators
- Patent number 11,849,541
- Issue date Dec 19, 2023
- Hayward Industries, Inc.
- Brian J. Wheeler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly, display apparatus, terminal, and signal pro...
- Patent number 11,839,026
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhongjie Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Control module for a lighting fixture
- Patent number 11,824,256
- Issue date Nov 21, 2023
- Lutron Technology Company LLC
- Sean R. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable circuit board for abstracting third-party controls
- Patent number 11,818,842
- Issue date Nov 14, 2023
- Amazon Technologies, Inc.
- David E. Carrillo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply system and electronic device
- Patent number 11,812,545
- Issue date Nov 7, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module substrate and semiconductor module including the same
- Patent number 11,792,921
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Sunki Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,792,930
- Issue date Oct 17, 2023
- Kyocera Corporation
- Yuki Takeshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,785,720
- Issue date Oct 10, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package cellular assembly
- Patent number 11,765,823
- Issue date Sep 19, 2023
- Signetik, LLC
- Steven Poulsen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOARD-TO-BOARD CONNECTOR
- Publication number 20240145957
- Publication date May 2, 2024
- Japan Aviation Electronics Industry, Ltd.
- Osamu HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRODE, DISPLAY APPARATUS AND WEARABLE DEVICE
- Publication number 20240136626
- Publication date Apr 25, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Yuehan WEI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POINT OF LOAD MODULE AND HEATSINK THEREFOR
- Publication number 20240138051
- Publication date Apr 25, 2024
- AcLeap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240130043
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen TING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES
- Publication number 20240107669
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN...
- Publication number 20240098899
- Publication date Mar 21, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Subhashini BHARATH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME
- Publication number 20240090132
- Publication date Mar 14, 2024
- LG Innotek Co., Ltd.
- Sung June PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE
- Publication number 20240090117
- Publication date Mar 14, 2024
- Huawei Technologies Co., Ltd
- Yaofeng PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Assembly and Radio Unit Comprising the Same
- Publication number 20240080981
- Publication date Mar 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Donghai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Connection Assembly and Electrical Connection Device
- Publication number 20240079802
- Publication date Mar 7, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Litao Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INK INTERCONNECTED DEVICES
- Publication number 20240074045
- Publication date Feb 29, 2024
- NCR Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20240064922
- Publication date Feb 22, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Control Module for a Lighting Fixture
- Publication number 20240063526
- Publication date Feb 22, 2024
- Lutron Technology Company LLC
- Sean R. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TRACE INTERCONNECTION TAPE
- Publication number 20240015886
- Publication date Jan 11, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY MODULE CONNECTION INTERFACE FOR POWER DELIVERY
- Publication number 20240008181
- Publication date Jan 4, 2024
- Dell Products L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTIN...
- Publication number 20230422399
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Adam ANDERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity-Stacked Printed Circuit Board Assemblies
- Publication number 20230413440
- Publication date Dec 21, 2023
- Google LLC
- Jiali Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20230403793
- Publication date Dec 14, 2023
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20230380095
- Publication date Nov 23, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RF POWER PALLET WITH MANAGEMENT DAUGTHER BOARD
- Publication number 20230319995
- Publication date Oct 5, 2023
- MACOM Technology Solutions Holdings, Inc.
- Benone Achiriloaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOICE-CONTROLLED ELECTRONIC DEVICE
- Publication number 20230305638
- Publication date Sep 28, 2023
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE
- Publication number 20230284385
- Publication date Sep 7, 2023
- Rohm Co., Ltd.
- Kenji HAMACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF
- Publication number 20230262896
- Publication date Aug 17, 2023
- Getac Technology Corporation
- Jui-Lin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD SYSTEM
- Publication number 20230225053
- Publication date Jul 13, 2023
- QUANTA COMPUTER INC.
- Yaw-Tzorng Tsorng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20230209761
- Publication date Jun 29, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Point of Load Module and Heatsink Therefor
- Publication number 20230189427
- Publication date Jun 15, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTHERBOARD COMPRISING A PLANAR TRANSFORMER EQUIPPED WITH COMPONENT...
- Publication number 20230170128
- Publication date Jun 1, 2023
- MBDA FRANCE
- Charlotte GAZZANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20230156904
- Publication date May 18, 2023
- Kyocera Corporation
- Yukio MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

One or more single auxiliary printed circuits mounted on a main printed circuit

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electric circuit module and manufacturing method thereof

Toolless information handling system Compression attached memory mo...

Electronic device including antenna connecting structure including...

Implantable device for the brain

Transmission line, method of manufacturing transmission line, and e...

High density neural implant cylindrical packaging

Sensor interposer employing castellated through-vias

Electronic device and circuit board module thereof

Fixing device

Printed circuit board stack structure and manufacturing method thereof

Point of load module and heatsink therefor

Power module and power device

Data processing systems including optical communication modules

Module and method of manufacturing the same

Circuit board structure, display panel, display apparatus, and manu...

Printed circuit board system

Riser cards with inline slots

Electronic component mounting

Leadless pressure sensors

Modular wiring system for actuators

Circuit board assembly, display apparatus, terminal, and signal pro...

Control module for a lighting fixture

Configurable circuit board for abstracting third-party controls

Power supply system and electronic device

Module substrate and semiconductor module including the same

Wiring substrate, electronic device, and electronic module

Multilayer ceramic capacitor

Component carrier for arranging electrical components on a circuit...

Packages with Si-substrate-free interposer and method forming same

System-in-package cellular assembly

Patents Applicationslast 30 patents

BOARD-TO-BOARD CONNECTOR

FLEXIBLE ELECTRODE, DISPLAY APPARATUS AND WEARABLE DEVICE

POINT OF LOAD MODULE AND HEATSINK THEREFOR

ELECTRONIC DEVICE

INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN...

ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME

HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE

Circuit Board Assembly and Radio Unit Comprising the Same

Electrical Connection Assembly and Electrical Connection Device

CONDUCTIVE INK INTERCONNECTED DEVICES

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

Control Module for a Lighting Fixture

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

CONDUCTIVE TRACE INTERCONNECTION TAPE

MEMORY MODULE CONNECTION INTERFACE FOR POWER DELIVERY

METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTIN...

Cavity-Stacked Printed Circuit Board Assemblies

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

RF POWER PALLET WITH MANAGEMENT DAUGTHER BOARD

VOICE-CONTROLLED ELECTRONIC DEVICE

SUBSTRATE

ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF

PRINTED CIRCUIT BOARD SYSTEM

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

Point of Load Module and Heatsink Therefor

MOTHERBOARD COMPRISING A PLANAR TRANSFORMER EQUIPPED WITH COMPONENT...

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...