operating processes therefor

Industry

CPC
B24B37/042

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/042operating processes therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for polishing, processing system, and method of polishing
- Patent number 12,179,312
- Issue date Dec 31, 2024
- Ebara Corporation
- Takuya Moriura
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry and polishing method
- Patent number 12,173,219
- Issue date Dec 24, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,172,263
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Michael Yen
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus using a magnetically couple...
- Patent number 12,151,336
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Pin Ho
- B24 - GRINDING POLISHING
Information Patent Grant
Automated semiconductor substrate polishing and cleaning
- Patent number 12,154,810
- Issue date Nov 26, 2024
- GlobalWafers Co., Ltd.
- ShinBae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Containment and exhaust system for substrate polishing components
- Patent number 12,145,236
- Issue date Nov 19, 2024
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system apparatus and methods for defect reduction at a su...
- Patent number 12,138,732
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Asheesh Jain
- B24 - GRINDING POLISHING
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,138,733
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing pad with enhanced rate
- Patent number 12,138,737
- Issue date Nov 12, 2024
- Rohm and Haas Electronic Materials Holdings, Inc.
- Mohammad T. Islam
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus and polishing liquid discharge method...
- Patent number 12,138,734
- Issue date Nov 12, 2024
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing diamond crystal, and diamond crystal
- Patent number 12,134,161
- Issue date Nov 5, 2024
- Orbray Co., Ltd.
- Seongwoo Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Channel cut polishing machine
- Patent number 12,134,164
- Issue date Nov 5, 2024
- UChicago Argonne, LLC
- Elina Kasman
- B24 - GRINDING POLISHING
Information Patent Grant
Replacing tool for sponge brush, method for installing sponge brush...
- Patent number 12,122,014
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jinwei Dang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry, screening method, and polishing method
- Patent number 12,104,112
- Issue date Oct 1, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing apparatus, polishing method and method for outputting vis...
- Patent number 12,083,646
- Issue date Sep 10, 2024
- Ebara Corporation
- Hiroaki Shibue
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 12,076,830
- Issue date Sep 3, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Slurry dispersion system with real time control
- Patent number 12,042,904
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Chen Chiang
- B24 - GRINDING POLISHING
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 12,036,636
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting non-conforming substrate processing events dur...
- Patent number 12,036,635
- Issue date Jul 16, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method
- Patent number 12,030,157
- Issue date Jul 9, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for removing debris during chemical mechanical pl...
- Patent number 12,017,325
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier head having abrasive structure on retainer ring
- Patent number 12,011,803
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 12,011,800
- Issue date Jun 18, 2024
- BRUKER NANO INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing semiconductor substrate
- Patent number 11,999,027
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
Planar grinder
- Patent number 12,000,764
- Issue date Jun 4, 2024
- Illinois Tool Works Inc.
- Kurt G. Adair
- G01 - MEASURING TESTING
Information Patent Grant
Preston matrix generator
- Patent number 11,989,492
- Issue date May 21, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Motor torque endpoint during polishing with spatial resolution
- Patent number 11,980,995
- Issue date May 14, 2024
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
CMP system and method of use
- Patent number 11,984,323
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL
- Publication number 20250001546
- Publication date Jan 2, 2025
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20240425737
- Publication date Dec 26, 2024
- Resonac Corporation
- Satoyuki NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240399529
- Publication date Dec 5, 2024
- Fujikoshi Machinery Corp.
- Yuya KANNO
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20240404894
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAINTAINING VALVE COMPONENTS
- Publication number 20240399528
- Publication date Dec 5, 2024
- Saudi Arabian Oil Company
- Hassan Shaker Ali Al-Sinan
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240391049
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Cheng LIN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING TOOL AND METHOD
- Publication number 20240383092
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROCESSING SUBSTRATE AND APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240383000
- Publication date Nov 21, 2024
- EBARA CORPORATION
- Jumpei FUJIKATA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
- Publication number 20240379342
- Publication date Nov 14, 2024
- Siltronic AG
- Stephan OBERHANS
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING
- Publication number 20240375238
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHIANG TSENG
- B24 - GRINDING POLISHING
Information Patent Application
SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES
- Publication number 20240375236
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING
- Publication number 20240371646
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Jimin ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A...
- Publication number 20240359286
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Donghoon KWON
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240363447
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...
- Publication number 20240359287
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PRE...
- Publication number 20240342857
- Publication date Oct 17, 2024
- SK enpulse Co., Ltd.
- Jong Wook YUN
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION
- Publication number 20240332026
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan CHEN
- B24 - GRINDING POLISHING
Information Patent Application
Process for Polishing and Grinding Copper Foil Surface for Reducing...
- Publication number 20240316718
- Publication date Sep 26, 2024
- Taichi Metal Material Technology Co., Ltd.
- Kuan-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20240316721
- Publication date Sep 26, 2024
- Disco Corporation
- Koshiro SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR DETECTION OF WAFER SLIPPAGE
- Publication number 20240308019
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240300066
- Publication date Sep 12, 2024
- SK enpulse Co., Ltd.
- Chang Gyu IM
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND WAFER NOTCH POLISHING METHOD
- Publication number 20240293911
- Publication date Sep 5, 2024
- NORITAKE CO., LIMITED
- Takamasa GOTO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20240286242
- Publication date Aug 29, 2024
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20240278381
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240278380
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Shinro OTA
- B24 - GRINDING POLISHING
Information Patent Application
CMP System and Method of Use
- Publication number 20240274440
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CONDITIONING POLISHING TOOL, SUBSTRATE PROCESSING METHOD...
- Publication number 20240253182
- Publication date Aug 1, 2024
- SCREEN Holdings Co., Ltd.
- Ryohei HOKAKU
- B24 - GRINDING POLISHING
Information Patent Application
PLANARIZED MEMBRANE AND METHODS FOR SUBSTRATE PROCESSING SYSTEMS
- Publication number 20240227116
- Publication date Jul 11, 2024
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING DEVICE AND POLISHING METHOD
- Publication number 20240227122
- Publication date Jul 11, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Ming-Hsiang Chen
- B24 - GRINDING POLISHING

operating processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for polishing, processing system, and method of polishing

Slurry and polishing method

Chemical mechanical planarization tool

Chemical mechanical polishing apparatus using a magnetically couple...

Automated semiconductor substrate polishing and cleaning

Containment and exhaust system for substrate polishing components

Polishing system apparatus and methods for defect reduction at a su...

Roller for location-specific wafer polishing

CMP polishing pad with enhanced rate

Substrate polishing apparatus and polishing liquid discharge method...

Method for polishing diamond crystal, and diamond crystal

Channel cut polishing machine

Replacing tool for sponge brush, method for installing sponge brush...

Chemical-mechanical polishing apparatus

Slurry, screening method, and polishing method

Polishing apparatus, polishing method and method for outputting vis...

Polishing method and polishing apparatus

Microelectronic assembly from processed substrate

Slurry dispersion system with real time control

Mega-sonic vibration assisted chemical mechanical planarization

Methods of detecting non-conforming substrate processing events dur...

Processing method

System and method for removing debris during chemical mechanical pl...

Carrier head having abrasive structure on retainer ring

Chemical-mechanical polishing system with a potentiostat and pulsed...

Method for polishing semiconductor substrate

Planar grinder

Preston matrix generator

Motor torque endpoint during polishing with spatial resolution

CMP system and method of use

Patents Applicationslast 30 patents

DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL

SLURRY, SCREENING METHOD, AND POLISHING METHOD

POLISHING APPARATUS AND POLISHING METHOD

SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION

MAINTAINING VALVE COMPONENTS

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

POLISHING TOOL AND METHOD

METHOD OF PROCESSING SUBSTRATE AND APPARATUS FOR PROCESSING SUBSTRATE

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

METHOD FOR GRINDING SEMICONDUCTOR WAFERS

METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING

SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A...

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...

POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PRE...

SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION

Process for Polishing and Grinding Copper Foil Surface for Reducing...

POLISHING PAD AND POLISHING METHOD

METHOD FOR DETECTION OF WAFER SLIPPAGE

POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE

POLISHING PAD AND WAFER NOTCH POLISHING METHOD

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...

POLISHING METHOD AND POLISHING APPARATUS

CMP System and Method of Use

METHOD FOR CONDITIONING POLISHING TOOL, SUBSTRATE PROCESSING METHOD...

PLANARIZED MEMBRANE AND METHODS FOR SUBSTRATE PROCESSING SYSTEMS

CHEMICAL MECHANICAL POLISHING DEVICE AND POLISHING METHOD