Organic materials with or without a thermoconductive filler

Industry

CPC
H01L23/3737

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3737Organic materials with or without a thermoconductive filler

Industries

Patents Grantslast 30 patents

Information Patent Grant
Surface-modified inorganic nitride, composition, thermally conducti...
- Patent number 11,945,718
- Issue date Apr 2, 2024
- FUJIFILM Corporation
- Seiichi Hitomi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Two-pack curable composition set, thermally conductive cured produc...
- Patent number 11,915,993
- Issue date Feb 27, 2024
- DENKA COMPANY LIMITED
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
- Patent number 11,881,440
- Issue date Jan 23, 2024
- Intel Corporation
- Marely E. Tejeda Ferrari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material paste and semiconductor package
- Patent number 11,876,031
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste composition, semiconductor device, and electrical/electronic...
- Patent number 11,859,112
- Issue date Jan 2, 2024
- Kyocera Corporation
- Masakazu Fujiwara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermally conductive composition and methods and devices in which s...
- Patent number 11,851,603
- Issue date Dec 26, 2023
- Dow Silicones Corporation
- Xiaolian Hu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manufacturing method for thermal conductive layer, manufacturing me...
- Patent number 11,848,249
- Issue date Dec 19, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package and display apparatus including the same
- Patent number 11,842,945
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, heat dissipation member, and semiconductor...
- Patent number 11,834,603
- Issue date Dec 5, 2023
- Mitsubishi Chemical Corporation
- Toshiyuki Sawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions that reduce inductive coupling between...
- Patent number 11,823,972
- Issue date Nov 21, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally conductive sheet and method for manufacturing thermally c...
- Patent number 11,742,258
- Issue date Aug 29, 2023
- Dexerials Corporation
- Yuma Sato
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High efficiency heat dissipation using thermal interface material film
- Patent number 11,705,381
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive material, device with thermally conductive lay...
- Patent number 11,702,578
- Issue date Jul 18, 2023
- FUJIFILM Corporation
- Seiichi Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing and modularizing assembled thermal manageme...
- Patent number 11,702,736
- Issue date Jul 18, 2023
- Korea Institute of Science and Technology
- Jae Kap Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive layer, photosensitive layer, photosensitive comp...
- Patent number 11,697,754
- Issue date Jul 11, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package including lid structure with opening and recess
- Patent number 11,688,655
- Issue date Jun 27, 2023
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of thermal interface material in multi-chip package
- Patent number 11,682,603
- Issue date Jun 20, 2023
- Flex Ltd.
- Cheng Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Channeled lids for integrated circuit packages
- Patent number 11,670,569
- Issue date Jun 6, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet and method for producing the same
- Patent number 11,667,825
- Issue date Jun 6, 2023
- Fuji Polymer Industries Co., Ltd.
- Hitoshi Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,658,094
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Soo Jeoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 11,658,044
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conduction sheet, method of manufacturing heat conduction shee...
- Patent number 11,639,426
- Issue date May 2, 2023
- Resonac Corporation
- Akihiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive resin composition and thermally conductive she...
- Patent number 11,634,581
- Issue date Apr 25, 2023
- Dexerials Corporation
- Masayuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with spring biased lid
- Patent number 11,631,624
- Issue date Apr 18, 2023
- Advanced Micro Devices, Inc.
- Kaushik Mysore Srinivasa Setty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for implementing a sliding thermal interfac...
- Patent number 11,626,342
- Issue date Apr 11, 2023
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oriented heat conducting sheet and preparation method thereof, and...
- Patent number 11,615,999
- Issue date Mar 28, 2023
- GUANGDONG SUQUN NEW MATERIAL CO., LTD
- Zhoujie Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin film, metal foil with resin, prepreg, meta...
- Patent number 11,617,261
- Issue date Mar 28, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akihiro Yamauchi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT CONDUCTOR AND THERMAL MANAGEMENT PART
- Publication number 20240145335
- Publication date May 2, 2024
- Shinko Electric Industries Co., Ltd.
- Takamasa NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112982
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- HIROFUMI MAKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
- Publication number 20240096736
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A POWER SEMI...
- Publication number 20240096738
- Publication date Mar 21, 2024
- Vitesco Technologies GMBH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240071854
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF...
- Publication number 20240063085
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Mihyae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monatomic Single-Entity Baseplate Structure Employing a Thermoplast...
- Publication number 20240063086
- Publication date Feb 22, 2024
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE URETHANE RESIN COMPOSITION AND CURED PRODUCT
- Publication number 20240052223
- Publication date Feb 15, 2024
- SHOWA DENKO K.K.
- Hajime FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047292
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Su Jung HYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240047301
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyoun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVER...
- Publication number 20240030094
- Publication date Jan 25, 2024
- ZF Friedrichshafen AG
- Thomas Bosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT SHEET, COMPOSITE MOLDED BODY, AND...
- Publication number 20240010814
- Publication date Jan 11, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Toshiyuki SAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...
- Publication number 20230411335
- Publication date Dec 21, 2023
- Kyocera Corporation
- Masakazu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343672
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343673
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE
- Publication number 20230335482
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Efficiency Heat Dissipation Using Thermal Interface Material Film
- Publication number 20230317552
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A...
- Publication number 20230253291
- Publication date Aug 10, 2023
- INFINEON TECHNOLOGIES AG
- Matthias Lassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRIMER, SUBSTRATE EQUIPPED WITH PRIMER LAYER, METHOD FOR PRODUCING...
- Publication number 20230183415
- Publication date Jun 15, 2023
- Showa Denko Materials Co., Ltd.
- Ning TANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANIC SPACER FOR INTEGRATED CIRCUITS
- Publication number 20230163045
- Publication date May 25, 2023
- Intel Corporation
- Bin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL COMPOSITES CONTAINING ORGANIC ADDITIVE AS THERMAL INTE...
- Publication number 20230142030
- Publication date May 11, 2023
- Indium Corporation
- Guangyu Fan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230125822
- Publication date Apr 27, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH HEAT-REMOVING FUNCTION AND METHOD...
- Publication number 20230127545
- Publication date Apr 27, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATIVE PASSIVE COOLING AND HEATING VIA METASURFACES AND NANOSTRU...
- Publication number 20230126407
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Radwanul SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILSESQUIOXANE DERIVATIVE AND USE THEREOF
- Publication number 20230128852
- Publication date Apr 27, 2023
- TOAGOSEI CO., LTD.
- Yoshiaki IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR SEVERAL INTEGRATED CIRCUITS
- Publication number 20230069969
- Publication date Mar 9, 2023
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS

Organic materials with or without a thermoconductive filler

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface-modified inorganic nitride, composition, thermally conducti...

Two-pack curable composition set, thermally conductive cured produc...

Thermal interface material having different thicknesses in packages

Carbon based polymer thermal interface materials with polymer chain...

Thermal interface material paste and semiconductor package

Paste composition, semiconductor device, and electrical/electronic...

Thermally conductive composition and methods and devices in which s...

Manufacturing method for thermal conductive layer, manufacturing me...

Chip on film package and display apparatus including the same

Heat dissipation sheet, heat dissipation member, and semiconductor...

Thermal management solutions that reduce inductive coupling between...

Thermosetting resin composition, semiconductor device, and electric...

Compressible foamed thermal interface materials and methods of maki...

Thermally conductive sheet and method for manufacturing thermally c...

High efficiency heat dissipation using thermal interface material film

Thermally conductive material, device with thermally conductive lay...

Method of manufacturing and modularizing assembled thermal manageme...

Thermal conductive layer, photosensitive layer, photosensitive comp...

Semiconductor package including lid structure with opening and recess

Control of thermal interface material in multi-chip package

Channeled lids for integrated circuit packages

Thermally conductive sheet and method for producing the same

Semiconductor package

Thermally conductive structure for heat dissipation in semiconducto...

Heat conduction sheet, method of manufacturing heat conduction shee...

Thermally conductive resin composition and thermally conductive she...

Semiconductor chip package with spring biased lid

Apparatuses and methods for implementing a sliding thermal interfac...

Oriented heat conducting sheet and preparation method thereof, and...

Resin composition, resin film, metal foil with resin, prepreg, meta...

Patents Applicationslast 30 patents

HEAT CONDUCTOR AND THERMAL MANAGEMENT PART

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Graphene-Coated Core Emb...

POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A POWER SEMI...

MULTI-DIE PACKAGE AND METHODS OF FORMATION

THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF...

Monatomic Single-Entity Baseplate Structure Employing a Thermoplast...

THERMALLY CONDUCTIVE URETHANE RESIN COMPOSITION AND CURED PRODUCT

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Electronic Package Comprising a Decoupling Layer Structure

HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVER...

RESIN COMPOSITION, CURED PRODUCT SHEET, COMPOSITE MOLDED BODY, AND...

THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

FILM PACKAGE

High Efficiency Heat Dissipation Using Thermal Interface Material Film

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A...

PRIMER, SUBSTRATE EQUIPPED WITH PRIMER LAYER, METHOD FOR PRODUCING...

ORGANIC SPACER FOR INTEGRATED CIRCUITS

LIQUID METAL COMPOSITES CONTAINING ORGANIC ADDITIVE AS THERMAL INTE...

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR PACKAGE DEVICE WITH HEAT-REMOVING FUNCTION AND METHOD...

RADIATIVE PASSIVE COOLING AND HEATING VIA METASURFACES AND NANOSTRU...

SILSESQUIOXANE DERIVATIVE AND USE THEREOF

PACKAGE FOR SEVERAL INTEGRATED CIRCUITS