Organo-silicon compounds

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H01L23/296

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/296Organo-silicon compounds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silylated isocyanurate compound, metal corrosion inhibitor, curable...
- Patent number 12,139,634
- Issue date Nov 12, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tomoyuki Mizunashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone composition, encapsulant and optical semiconductor...
- Patent number 12,110,412
- Issue date Oct 8, 2024
- DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
- Akito Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing silicone cured product, silicone cured prod...
- Patent number 12,065,567
- Issue date Aug 20, 2024
- Momentive Performance Materials Japan LLC
- Kikuo Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor film composition, method for manufacturing semiconduc...
- Patent number 11,965,109
- Issue date Apr 23, 2024
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of the same
- Patent number 11,935,844
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated segments and methods of manufacturin...
- Patent number 11,894,327
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hotmelt silicone composition, encapsulant, hotmelt adhesive and opt...
- Patent number 11,780,968
- Issue date Oct 10, 2023
- DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
- Shunya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 11,742,302
- Issue date Aug 29, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,710,721
- Issue date Jul 25, 2023
- Beijing BOE Optoelectronics Technology Co., Ltd
- Tielei Zhao
- G02 - OPTICS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,559
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 11,605,607
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,587,861
- Issue date Feb 21, 2023
- Fuji Electric Co., Ltd.
- Hiroyuki Nogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable granular silicone composition, semiconductor member compris...
- Patent number 11,555,119
- Issue date Jan 17, 2023
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Curable organopolysiloxane composition and a protectant or adhesive...
- Patent number 11,555,118
- Issue date Jan 17, 2023
- Dow Toray Co., Ltd.
- Toyohiko Fujisawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component or precursor thereof, and method for manufactu...
- Patent number 11,551,988
- Issue date Jan 10, 2023
- Dow Toray Co., Ltd.
- Manabu Sutoh
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods of manufacturing a photovoltaic module
- Patent number 11,538,955
- Issue date Dec 27, 2022
- CSEM Centre Suisse d'Electronique et de Microtechnique S.A. Recherche et Deve...
- Hengyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive resin coating, pho...
- Patent number 11,526,078
- Issue date Dec 13, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of using surface treatment compositions
- Patent number 11,447,642
- Issue date Sep 20, 2022
- Fujifilm Electronic Materials U.S.A., Inc.
- William A. Wojtczak
- B08 - CLEANING
Information Patent Grant
Silicone gel composition, cured product thereof, and power module
- Patent number 11,434,370
- Issue date Sep 6, 2022
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Matsuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,410,898
- Issue date Aug 9, 2022
- Nagase Chemtex Corporation
- Takayuki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicous film forming composition comprising block copolymer and me...
- Patent number 11,401,384
- Issue date Aug 2, 2022
- Merck Patent GmbH
- Takashi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dually-curable resin composition, cured body prepared therefrom, an...
- Patent number 11,390,748
- Issue date Jul 19, 2022
- Dow Silicones Corporation
- Jong-Ok Lim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES
- Publication number 20240404903
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Anita Herzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FO...
- Publication number 20240384100
- Publication date Nov 21, 2024
- Dow Toray Co., Ltd.
- Ryosuke YAMAZAKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...
- Publication number 20240379473
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20240355693
- Publication date Oct 24, 2024
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SILICONE COMPOSITION IN THE POTTING OF ELECTRONIC COMPONENTS
- Publication number 20240355690
- Publication date Oct 24, 2024
- Momentive Performance Materials Inc.
- Andrea RUPPENTHAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES I...
- Publication number 20240321663
- Publication date Sep 26, 2024
- Afshin DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE...
- Publication number 20240304506
- Publication date Sep 12, 2024
- Intel Corporation
- Sangeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240282656
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING
- Publication number 20240266306
- Publication date Aug 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258188
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Shoji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240194553
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20240136310
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088073
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Yoichi HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088064
- Publication date Mar 14, 2024
- Mitsubishi Electric Corporation
- Daichi OTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
- Publication number 20240071851
- Publication date Feb 29, 2024
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREFROM
- Publication number 20240043623
- Publication date Feb 8, 2024
- DOW TORAY CO., LTD.
- Ryosuke YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038640
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Hiroki MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURI...
- Publication number 20240038610
- Publication date Feb 1, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ENCAPSULANT WITH METAL ACTIVATED INORGANIC FI...
- Publication number 20230420319
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Qun YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE SEALED SURFACE-MOUNT PACKAGE
- Publication number 20230360990
- Publication date Nov 9, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...
- Publication number 20230352450
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...
- Publication number 20230352449
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
- Publication number 20230352425
- Publication date Nov 2, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230343770
- Publication date Oct 26, 2023
- Fuji Electric Co., Ltd.
- Nobuharu KUSAKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Encapsulant Strength Enhancer
- Publication number 20230343661
- Publication date Oct 26, 2023
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS

Organo-silicon compounds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Silylated isocyanurate compound, metal corrosion inhibitor, curable...

Electronic device packages with internal moisture barriers

Curable silicone composition, encapsulant and optical semiconductor...

Chip package and semiconductor arrangement having thermally conduct...

Method of manufacturing silicone cured product, silicone cured prod...

Semiconductor film composition, method for manufacturing semiconduc...

Semiconductor device and method of the same

Apparatus including integrated segments and methods of manufacturin...

Semiconductor package structure with heat sink and method preparing...

Apparatus including integrated pads and methods of manufacturing th...

Hotmelt silicone composition, encapsulant, hotmelt adhesive and opt...

Semiconductor device

Electronic device packages with internal moisture barriers

Display device and manufacturing method thereof

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor device

Semiconductor device and methods of manufacture

Semiconductor device and manufacturing method thereof

Curable granular silicone composition, semiconductor member compris...

Curable organopolysiloxane composition and a protectant or adhesive...

Electronic component or precursor thereof, and method for manufactu...

Methods of manufacturing a photovoltaic module

Photosensitive resin composition, photosensitive resin coating, pho...

Semiconductor package structure with heat sink and method preparing...

Methods of using surface treatment compositions

Silicone gel composition, cured product thereof, and power module

Manufacturing method of mounting structure, and sheet therefor

Silicous film forming composition comprising block copolymer and me...

Dually-curable resin composition, cured body prepared therefrom, an...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FO...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

A SILICONE COMPOSITION IN THE POTTING OF ELECTRONIC COMPONENTS

HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES I...

INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE WITH BLAST SHIELDING

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PACKAGE INCLUDING A GEL

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREFROM

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURI...

SEMICONDUCTOR PACKAGE ENCAPSULANT WITH METAL ACTIVATED INORGANIC FI...

SEMICONDUCTOR DEVICE

LOW-PROFILE SEALED SURFACE-MOUNT PACKAGE

POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...

FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...

ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS

SEMICONDUCTOR MODULE

Semiconductor Encapsulant Strength Enhancer