Other packages not provided for in groups B81B7/0035 - B81B7/0074

Industry

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B81B7/0077

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0077Other packages not provided for in groups B81B7/0035 - B81B7/0074

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiaxis sensing system for detection of airborne molecules and ra...
- Patent number 11,940,576
- Issue date Mar 26, 2024
- National Technology & Engineering Solutions of Sandia, LLC
- Mark D. Allendorf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS encapsulation employing lower pressure and higher pressure dep...
- Patent number 11,834,331
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,833,542
- Issue date Dec 5, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond wave optimization method and device
- Patent number 11,834,332
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,834,330
- Issue date Dec 5, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,684,949
- Issue date Jun 27, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sound port adapter for microphone assembly
- Patent number 11,659,311
- Issue date May 23, 2023
- Knowles Electronics, LLC
- Brian Lynch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 11,524,892
- Issue date Dec 13, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,459,226
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Yasuo Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding manufacturing method
- Patent number 11,352,251
- Issue date Jun 7, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Water proofing and water detection schemes for MEMS-based environme...
- Patent number 11,305,984
- Issue date Apr 19, 2022
- Apple Inc.
- Krishna Prasad Vummidi Murali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure
- Patent number 11,296,651
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging a microelectromechanical systems device
- Patent number 11,286,157
- Issue date Mar 29, 2022
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for a mems transducer
- Patent number 11,225,408
- Issue date Jan 18, 2022
- Infineon Technologies AG
- Andreas Wiesbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for acoustic hole optimization
- Patent number 11,228,845
- Issue date Jan 18, 2022
- Knowles Electronics, LLC
- Vahid Naderyan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,217,499
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 11,192,778
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 11,180,365
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 11,040,872
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone and manufacturing method thereof
- Patent number 11,034,579
- Issue date Jun 15, 2021
- Hyundai Motor Company
- Il Seon Yoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Terminal assembly structure of MEMS microphone
- Patent number 11,032,652
- Issue date Jun 8, 2021
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Kai Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic system comprising a microelectromechanical system and a...
- Patent number 10,994,988
- Issue date May 4, 2021
- Thales
- Bertrand Leverrier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method of manufacturing the MEMS microphone
- Patent number 10,999,684
- Issue date May 4, 2021
- SAE Magnetics (H. K.) Ltd.
- Lik Hang Ken Wan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structures with improved adhesion and strength
- Patent number 10,971,418
- Issue date Apr 6, 2021
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
- Publication number 20240076181
- Publication date Mar 7, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE
- Publication number 20240034620
- Publication date Feb 1, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Yung-Hsiang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bond Wave Optimization Method and Device
- Publication number 20230382723
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20230110259
- Publication date Apr 13, 2023
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230076715
- Publication date Mar 9, 2023
- CHIP POSITION SYSTEM CO., LTD.
- RUEI CHI CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND WAVE OPTIMIZATION METHOD AND DEVICE
- Publication number 20230043571
- Publication date Feb 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENCAPSULATION EMPLOYING LOWER PRESSURE AND HIGHER PRESSURE DEP...
- Publication number 20220324702
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DI...
- Publication number 20220192042
- Publication date Jun 16, 2022
- Intel Corporation
- Mohammad Enamul Kabir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hollow Package And Method For Manufacturing Same
- Publication number 20220068737
- Publication date Mar 3, 2022
- SUMITOMO BAKELITE CO., LTD.
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210246018
- Publication date Aug 12, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210246017
- Publication date Aug 12, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210198100
- Publication date Jul 1, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOUND PORT ADAPTER FOR MICROPHONE ASSEMBLY
- Publication number 20210204050
- Publication date Jul 1, 2021
- KNOWLES ELECTRONICS, LLC
- Brian Lynch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20210179421
- Publication date Jun 17, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF RAPID ENCAPSULATION OF MICROELECTRONIC DEVICES
- Publication number 20210166954
- Publication date Jun 3, 2021
- Carbon, Inc.
- James Patrick Troise
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20210114060
- Publication date Apr 22, 2021
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Barriers for Flexible Substrates and Methods of Making the Same
- Publication number 20210074653
- Publication date Mar 11, 2021
- Thin Film Electronics ASA
- Miki TRIFUNOVIC
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210061645
- Publication date Mar 4, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210036658
- Publication date Feb 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210024349
- Publication date Jan 28, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE AND MANUFACTURING METHOD THEREOF
- Publication number 20210009407
- Publication date Jan 14, 2021
- Hyundai Motor Company
- Il Seon Yoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210002128
- Publication date Jan 7, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200402879
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEMS DEVICE
- Publication number 20200391995
- Publication date Dec 17, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You QIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20200385261
- Publication date Dec 10, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package, MEMS Microphone, Method of Manufacturing the MEMS Pac...
- Publication number 20200377364
- Publication date Dec 3, 2020
- SAE Magnetics (H.K.) Ltd.
- Masashi Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE WITH ROUGHEND INTERFACE
- Publication number 20200339413
- Publication date Oct 29, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Other packages not provided for in groups B81B7/0035 - B81B7/0074

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hollow package and method for manufacturing same

Multiaxis sensing system for detection of airborne molecules and ra...

Enclosed cavity structures

Sensing module and manufacturing method thereof

Enclosed cavity structures

MEMS encapsulation employing lower pressure and higher pressure dep...

CMOS ultrasonic transducers and related apparatus and methods

Bond wave optimization method and device

Enclosed cavity structures

Stacked-die MEMS resonator

CMOS ultrasonic transducers and related apparatus and methods

Sound port adapter for microphone assembly

Method of manufacturing electronic devices and corresponding electr...

Semiconductor device and semiconductor device manufacturing method

Stacked-die MEMS resonator

Electronic device and corresponding manufacturing method

Water proofing and water detection schemes for MEMS-based environme...

Semiconductor package structure

Methods for packaging a microelectromechanical systems device

System and method for a mems transducer

Systems and methods for acoustic hole optimization

Semiconductor package structure and method for manufacturing the same

MEMS package with roughend interface

MEMS devices and methods of forming same

Semiconductor module

Microphone and manufacturing method thereof

Terminal assembly structure of MEMS microphone

Electronic system comprising a microelectromechanical system and a...

MEMS microphone and method of manufacturing the MEMS microphone

Packaging structures with improved adhesion and strength

Patents Applicationslast 30 patents

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

STACKED-DIE MEMS RESONATOR

Bond Wave Optimization Method and Device

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

SENSING MODULE AND MANUFACTURING METHOD THEREOF

BOND WAVE OPTIMIZATION METHOD AND DEVICE

STACKED-DIE MEMS RESONATOR

MEMS ENCAPSULATION EMPLOYING LOWER PRESSURE AND HIGHER PRESSURE DEP...

HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DI...

Hollow Package And Method For Manufacturing Same

ENCLOSED CAVITY STRUCTURES

ENCLOSED CAVITY STRUCTURES

ENCLOSED CAVITY STRUCTURES

SOUND PORT ADAPTER FOR MICROPHONE ASSEMBLY

STACKED-DIE MEMS RESONATOR

METHOD OF RAPID ENCAPSULATION OF MICROELECTRONIC DEVICES

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

Barriers for Flexible Substrates and Methods of Making the Same

ENCLOSED CAVITY STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURE

ENCLOSED CAVITY STRUCTURES

MICROPHONE AND MANUFACTURING METHOD THEREOF

ENCLOSED CAVITY STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEMS DEVICE

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

MEMS Package, MEMS Microphone, Method of Manufacturing the MEMS Pac...

MEMS PACKAGE WITH ROUGHEND INTERFACE