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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16505outside the bonding interface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of repairing light emitting device and display panel having...
- Patent number 11,749,652
- Issue date Sep 5, 2023
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 11,705,471
- Issue date Jul 18, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,538,737
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing light emitting device and display panel having...
- Patent number 11,508,704
- Issue date Nov 22, 2022
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit (FPC) board and method for manufacturing t...
- Patent number 11,432,404
- Issue date Aug 30, 2022
- Rui Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,663,816
- Issue date May 26, 2020
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,310,341
- Issue date Jun 4, 2019
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding WLCSP components in E-WLB and E-PLB
- Patent number 10,147,710
- Issue date Dec 4, 2018
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 10,062,658
- Issue date Aug 28, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive paste, and electrically conducive connectio...
- Patent number 10,046,418
- Issue date Aug 14, 2018
- Furukawa Electric Co., Ltd.
- Shunji Masumori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding WLCSP components in e-WLB and e-PLB
- Patent number 9,991,239
- Issue date Jun 5, 2018
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding with silver paste
- Patent number 9,972,597
- Issue date May 15, 2018
- Hyundai Motor Company
- Kyoung-Kook Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation detector element
- Patent number 9,748,300
- Issue date Aug 29, 2017
- Koninklijke Philips N.V.
- Nicolaas Johannes Anthonius Van Veen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,691,738
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 9,331,042
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING...
- Publication number 20230387085
- Publication date Nov 30, 2023
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20230282665
- Publication date Sep 7, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING...
- Publication number 20230081487
- Publication date Mar 16, 2023
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20220130883
- Publication date Apr 28, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210210414
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING...
- Publication number 20210183828
- Publication date Jun 17, 2021
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT (FPC) BOARD AND METHOD FOR MANUFACTURING T...
- Publication number 20200404788
- Publication date Dec 24, 2020
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Rui XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB
- Publication number 20180269190
- Publication date Sep 20, 2018
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE, WIRE BONDING METHOD USING THE BONDING WIRE, AND ELECT...
- Publication number 20180026004
- Publication date Jan 25, 2018
- Samsung Electronics Co., Ltd.
- WON-GIL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20160377905
- Publication date Dec 29, 2016
- LG Display Co., Ltd.
- WonJun CHOI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160351540
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Koji OGISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20160329293
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION DETECTOR ELEMENT
- Publication number 20160276387
- Publication date Sep 22, 2016
- Koninklijke Philips N.V.
- NICOLAAS JOHANNES ANTHONIUS VAN VEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB
- Publication number 20160276325
- Publication date Sep 22, 2016
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20150311171
- Publication date Oct 29, 2015
- FUJITSU LIMITED
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140299986
- Publication date Oct 9, 2014
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package components Through Plating
- Publication number 20130334692
- Publication date Dec 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20130164956
- Publication date Jun 27, 2013
- Fujitsu Limited
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-D...
- Publication number 20130069248
- Publication date Mar 21, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECT...
- Publication number 20130001774
- Publication date Jan 3, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Shunji Masumori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090117688
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

outside the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Close butted collocated variable technology imaging arrays on a sin...

Advanced device assembly structures and methods

Method of repairing light emitting device and display panel having...

Close butted collocated variable technology imaging arrays on a sin...

Multi-chip package and manufacturing method thereof

Semiconductor package

Method of repairing light emitting device and display panel having...

Flexible printed circuit (FPC) board and method for manufacturing t...

Bonded structures for package and substrate

Bonding package components through plating

Display device and method of manufacturing the same

Bonding package components through plating

Bonded structures for package and substrate

Resin fluxed solder paste, and mount structure

Display device and method of manufacturing the same

Method of embedding WLCSP components in E-WLB and E-PLB

Electronic component and electronic device

Electrically conductive paste, and electrically conducive connectio...

Method of embedding WLCSP components in e-WLB and e-PLB

Method of bonding with silver paste

Transient interface gradient bonding for metal bonds

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Radiation detector element

Bonding package components through plating

Bonded structures for package and substrate

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Anisotropic conductive adhesive with reduced migration

Semiconductor device manufacturing method and semiconductor device

Patents Applicationslast 30 patents

Advanced Device Assembly Structures And Methods

METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING...

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING...

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

Advanced Device Assembly Structures And Methods

SEMICONDUCTOR PACKAGE

METHOD OF REPAIRING LIGHT EMITTING DEVICE AND DISPLAY PANEL HAVING...

FLEXIBLE PRINTED CIRCUIT (FPC) BOARD AND METHOD FOR MANUFACTURING T...

Bonded Structures for Package and Substrate

Bonding Package Components Through Plating

METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

BONDING WIRE, WIRE BONDING METHOD USING THE BONDING WIRE, AND ELECT...

Display Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Bonded Structures for Package and Substrate

RADIATION DETECTOR ELEMENT

METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Anisotropic Conductive Adhesive with Reduced Migration

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

Bonding Package components Through Plating

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-D...

ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECT...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD