outside the semiconductor or solid-state body

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H01L2224/4848

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4848outside the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor devices and methods for manufacturing pressure sens...
- Patent number 11,815,414
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Emanuel Stoicescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor devices and methods for manufacturing pressure sens...
- Patent number 11,067,466
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Emanuel Stoicescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphor and method of manufacturing same, and LED lamp
- Patent number 11,005,010
- Issue date May 11, 2021
- Kabushiki Kaisha Toshiba
- Yoshitaka Funayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-chip package
- Patent number 10,679,972
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biometric sensing chip and electronic device using same
- Patent number 10,395,087
- Issue date Aug 27, 2019
- SHENZHEN XINWEI TECHNOLOGY CO, LTD.
- Wenjie Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for remapping a packaged extracted die
- Patent number 10,177,054
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 9,698,086
- Issue date Jul 4, 2017
- Infineon Technologies AG
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging having plurality of wires bonding to...
- Patent number 9,536,859
- Issue date Jan 3, 2017
- Rohm Co., Ltd.
- Hiroyuki Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 9,508,673
- Issue date Nov 29, 2016
- Nanya Technology Corporation
- Po-Chun Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting module and light irradiating apparatus
- Patent number 9,496,244
- Issue date Nov 15, 2016
- Ushio Denki Kabushiki Kaisha
- Koji Enomoto
- G02 - OPTICS
Information Patent Grant
Light emitting device, light source for illumination, and illuminat...
- Patent number 9,443,832
- Issue date Sep 13, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with embedded die interconnect structures, and m...
- Patent number 9,401,338
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, light-emitting device, illuminating light source, and li...
- Patent number 9,368,706
- Issue date Jun 14, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kenji Sugiura
- F21 - LIGHTING
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array semiconductor package and method of manufacturing t...
- Patent number 9,245,864
- Issue date Jan 26, 2016
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including embedded controller die and method o...
- Patent number 9,236,368
- Issue date Jan 12, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304590
- Publication date Sep 12, 2024
- DENSO CORPORATION
- MASAKAZU WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION
- Publication number 20240006353
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anton Johann BAYERSTADLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND IMPEDANCE MATCHING
- Publication number 20220254750
- Publication date Aug 11, 2022
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189906
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding For Semiconductor Devices
- Publication number 20220052014
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR DEVICES AND METHODS FOR MANUFACTURING PRESSURE SENS...
- Publication number 20210310890
- Publication date Oct 7, 2021
- INFINEON TECHNOLOGIES AG
- Emanuel STOICESCU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES
- Publication number 20200027848
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20190051616
- Publication date Feb 14, 2019
- Amkor Technology Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD
- Publication number 20160247777
- Publication date Aug 25, 2016
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD
- Publication number 20150262963
- Publication date Sep 17, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Kenichi KOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291823
- Publication date Oct 2, 2014
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20140225240
- Publication date Aug 14, 2014
- RENESAS ELECTRONICS CORPORATION
- NORIYUKI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20140167292
- Publication date Jun 19, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro MASUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND M...
- Publication number 20140145325
- Publication date May 29, 2014
- ALAN J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCT...
- Publication number 20140048950
- Publication date Feb 20, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A NON-PLANAR CONDUCTIVE PATTERN, AN...
- Publication number 20140042633
- Publication date Feb 13, 2014
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140008776
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY USING A CARRIER-FREE TECHNIQUE
- Publication number 20130344657
- Publication date Dec 26, 2013
- NXP B.V.
- Chi-Feng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130334687
- Publication date Dec 19, 2013
- Hiroyuki KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20130329386
- Publication date Dec 12, 2013
- Subtron Technology Co. Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT AND LOW LOOP WIRE BONDING
- Publication number 20130328194
- Publication date Dec 12, 2013
- Carsem (M) Sdn.Bhd.
- Liew Siew Har
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130249119
- Publication date Sep 26, 2013
- Seiko Instruments Inc.
- Hirofumi HARADA
- H01 - BASIC ELECTRIC ELEMENTS

outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ball bond impedance matching

Semiconductor package including stacked semiconductor chips

Wire bonding for semiconductor devices

Semiconductor device packages with high angle wire bonding and non-...

Pressure sensor devices and methods for manufacturing pressure sens...

Semiconductor device having conductive wire with increased attachme...

Semiconductor package including stacked semiconductor chips

Wire bonding between isolation capacitors for multichip modules

Semiconductor device having an electrical connection between semico...

Pressure sensor devices and methods for manufacturing pressure sens...

Phosphor and method of manufacturing same, and LED lamp

Semiconductor device having conductive wire with increased attachme...

Semiconductor device having an electrical connection between semico...

Method of manufacturing multi-chip package

Biometric sensing chip and electronic device using same

Surface finish for wirebonding

Method for remapping a packaged extracted die

Semiconductor device having conductive wire with increased attachme...

Chip package and method of manufacturing the same

Thin plastic leadless package with exposed metal die paddle

Semiconductor device packaging having plurality of wires bonding to...

Wire bonding method

Light emitting module and light irradiating apparatus

Light emitting device, light source for illumination, and illuminat...

Electronic devices with embedded die interconnect structures, and m...

Substrate, light-emitting device, illuminating light source, and li...

Bonding structure of bonding wire

Method for fabricating wire bonding structure

Ball grid array semiconductor package and method of manufacturing t...

Semiconductor device including embedded controller die and method o...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

BALL BOND IMPEDANCE MATCHING

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

Wire Bonding For Semiconductor Devices

PRESSURE SENSOR DEVICES AND METHODS FOR MANUFACTURING PRESSURE SENS...

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

WIRE BONDING METHOD

SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND M...

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCT...

SEMICONDUCTOR DEVICES INCLUDING A NON-PLANAR CONDUCTIVE PATTERN, AN...

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE ASSEMBLY USING A CARRIER-FREE TECHNIQUE

SEMICONDUCTOR DEVICE

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

SHORT AND LOW LOOP WIRE BONDING

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE