Overplating

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CPC
H05K2201/0347

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0347Overplating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 11,798,875
- Issue date Oct 24, 2023
- Innolux Corporation
- Chung-Chun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method to reduce or eliminate voids in solder applied witho...
- Patent number 11,674,235
- Issue date Jun 13, 2023
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic control device
- Patent number 11,659,651
- Issue date May 23, 2023
- Hitachi Astemo, Ltd.
- Kazuo Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating edge connector pins of printed circuit boards withou...
- Patent number 11,653,455
- Issue date May 16, 2023
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 11,653,454
- Issue date May 16, 2023
- Sumitomo Electric Printed Circuits, Inc.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring board
- Patent number 11,647,589
- Issue date May 9, 2023
- Shinko Electric Industries Co., Ltd.
- Shuhei Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,503,709
- Issue date Nov 15, 2022
- Ibiden Co., Ltd.
- Shota Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit (FPC) board and method for manufacturing t...
- Patent number 11,432,404
- Issue date Aug 30, 2022
- Rui Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 11,399,426
- Issue date Jul 26, 2022
- NGK Spark Plug Co., Ltd.
- Toshio Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board, memory system, and method for manufacturing p...
- Patent number 11,272,610
- Issue date Mar 8, 2022
- Kioxia Corporation
- Daigo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and method for producing same
- Patent number 11,197,377
- Issue date Dec 7, 2021
- STEMCO CO., LTD.
- Hong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 11,140,784
- Issue date Oct 5, 2021
- Sumitomo Electric Printed Circuits, Inc.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, chip package including the same, and electr...
- Patent number 11,089,682
- Issue date Aug 10, 2021
- LG Innotek Co., Ltd
- Seung Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solderable solder deposit on a contact pad
- Patent number 11,032,914
- Issue date Jun 8, 2021
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming circuit board stacked structure
- Patent number 11,013,103
- Issue date May 18, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 10,912,202
- Issue date Feb 2, 2021
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit surface finish, method of use, and assemblies made...
- Patent number 10,902,967
- Issue date Jan 26, 2021
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed wiring board, electronic device having flexible pr...
- Patent number 10,784,642
- Issue date Sep 22, 2020
- Ibiden Co., Ltd.
- Takahisa Hirasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 10,729,009
- Issue date Jul 28, 2020
- MURATA MANUFACTURING CO., LTD.
- Yuki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric with woven wire braid
- Patent number 10,687,421
- Issue date Jun 16, 2020
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and camera module
- Patent number 10,674,601
- Issue date Jun 2, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device having a plated antenna and/or trace, and methods...
- Patent number 10,667,397
- Issue date May 26, 2020
- Thin Film Electronics ASA
- Mao Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164019
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Woo Seok YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20230276578
- Publication date Aug 31, 2023
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230262888
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Hiromichi TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20220386454
- Publication date Dec 1, 2022
- HITACHI ASTEMO, LTD.
- Kazuo Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20220279659
- Publication date Sep 1, 2022
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217843
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...
- Publication number 20220070998
- Publication date Mar 3, 2022
- KIOXIA Corporation
- Daigo SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20220039260
- Publication date Feb 3, 2022
- Shinko Electric Industries Co., Ltd.
- Shuhei MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210392754
- Publication date Dec 16, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210289624
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke MINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210259106
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Shota TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC ELECTRONIC COMPONENT
- Publication number 20200315005
- Publication date Oct 1, 2020
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC ELECTRONIC COMPONENT
- Publication number 20200315006
- Publication date Oct 1, 2020
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
- Publication number 20200286844
- Publication date Sep 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Keith Edward Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
- Publication number 20200196453
- Publication date Jun 18, 2020
- STEMCO CO., LTD.
- Hong Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD, CHIP PACKAGE INCLUDING THE SAME, AND ELECTR...
- Publication number 20200084888
- Publication date Mar 12, 2020
- LG INNOTEK CO., LTD
- Seung Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20200022262
- Publication date Jan 16, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD
- Publication number 20190350088
- Publication date Nov 14, 2019
- Atotech Deutschland GmbH
- Kai-Jens MATEJAT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating Method To Reduce Or Eliminate Voids In Solder Applied Witho...
- Publication number 20190316267
- Publication date Oct 17, 2019
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD PAD RESONANCE CONTROL SYSTEM
- Publication number 20190320529
- Publication date Oct 17, 2019
- Dell Products L.P.
- Vasa Mallikarjun Goud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PR...
- Publication number 20190036289
- Publication date Jan 31, 2019
- IBIDEN CO., LTD.
- Takahisa HIRASAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device Having a Plated Antenna and/or Trace, and Methods...
- Publication number 20180359858
- Publication date Dec 13, 2018
- Thin Film Electronics ASA
- Mao ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND CAMERA MODULE
- Publication number 20180310401
- Publication date Oct 25, 2018
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20150380391
- Publication date Dec 31, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS

Overplating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and method for manufacturing the same

Printed circuit board and method of manufacturing the same

Electronic device and manufacturing method thereof

Plating method to reduce or eliminate voids in solder applied witho...

Electronic control device

Electroplating edge connector pins of printed circuit boards withou...

Printed wiring board and manufacturing method thereof

Ceramic electronic component

Wiring board

Ceramic electronic component

Printed circuit board

Circuit board and method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Wiring board and method of manufacturing the same

Flexible printed circuit (FPC) board and method for manufacturing t...

Wiring board and method for manufacturing same

Printed wiring board, memory system, and method for manufacturing p...

Flexible circuit board and method for producing same

Printed wiring board and manufacturing method thereof

Flexible circuit board, chip package including the same, and electr...

Method of forming a solderable solder deposit on a contact pad

Method for forming circuit board stacked structure

Wiring board and method of manufacturing the same

Method of manufacturing printed circuit board

Printed circuit surface finish, method of use, and assemblies made...

Flexible printed wiring board, electronic device having flexible pr...

Ceramic electronic component

Fabric with woven wire braid

Printed wiring board and camera module

Electronic device having a plated antenna and/or trace, and methods...

Patents Applicationslast 30 patents

WIRING BOARD

PRINTED CIRCUIT BOARD

WIRING CIRCUIT BOARD

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CONTROL DEVICE

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...

WIRING BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

MODULE AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CERAMIC ELECTRONIC COMPONENT

CERAMIC ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

FLEXIBLE CIRCUIT BOARD, CHIP PACKAGE INCLUDING THE SAME, AND ELECTR...

PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD

Plating Method To Reduce Or Eliminate Voids In Solder Applied Witho...

CIRCUIT BOARD PAD RESONANCE CONTROL SYSTEM

FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PR...

VIA AND SKIP VIA STRUCTURES

Electronic Device Having a Plated Antenna and/or Trace, and Methods...

PRINTED WIRING BOARD AND CAMERA MODULE

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...