Oxidising metal

Industry

CPC
H05K2203/0315

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0315Oxidising metal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and device for a high temperature vacuum-safe solder resist...
- Patent number 11,135,669
- Issue date Oct 5, 2021
- Cree, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foils with ordered crystal structure and method for producing...
- Patent number 10,980,130
- Issue date Apr 13, 2021
- The Curators of the University of Missouri
- Jay A. Switzer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,940,671
- Issue date Mar 9, 2021
- Rogers Germany GmbH
- Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal 3D non-planar multi-layer circuitry
- Patent number 10,827,608
- Issue date Nov 3, 2020
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,821,704
- Issue date Nov 3, 2020
- Rogers Germany GmbH
- Andreas Meyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for metallizing a component
- Patent number 10,808,330
- Issue date Oct 20, 2020
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Markus Glatthaar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conformal 3D non-planar multi-layer circuitry
- Patent number 10,568,204
- Issue date Feb 18, 2020
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for circuit board based on copper ceramic subs...
- Patent number 10,383,236
- Issue date Aug 13, 2019
- Shunsin Technology (Zhong Shan) Limited
- Fei Ren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 10,375,835
- Issue date Aug 6, 2019
- Atotech Deutchland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive structure body precursor, conductive structure body and...
- Patent number 10,338,706
- Issue date Jul 2, 2019
- LG Chem, Ltd.
- Jin Hyong Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible electronic substrate
- Patent number 10,299,374
- Issue date May 21, 2019
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,163,840
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for a high temperature vacuum-safe solder stop ut...
- Patent number 10,076,800
- Issue date Sep 18, 2018
- Cree Fayetteville, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching method and etching apparatus
- Patent number 9,991,138
- Issue date Jun 5, 2018
- Tokyo Electron Limited
- Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for fabricating the same
- Patent number 9,974,171
- Issue date May 15, 2018
- BYD Company Limited
- Qiang Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printing
- Patent number 9,956,756
- Issue date May 1, 2018
- J P Imaging Limited
- John David Adamson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Mitigation and elimination of tin whiskers
- Patent number 9,920,415
- Issue date Mar 20, 2018
- International Business Machines Corporation
- Eric V. Kline
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing structures having concealed components
- Patent number 9,896,777
- Issue date Feb 20, 2018
- ESSENTIAL PRODUCTS, INC.
- David John Evans
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conformal 3D non-planar multi-layer circuitry
- Patent number 9,894,760
- Issue date Feb 13, 2018
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microstructure, multilayer wiring board, semiconductor package and...
- Patent number 9,799,594
- Issue date Oct 24, 2017
- FUJIFILM Corporation
- Kosuke Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,769,933
- Issue date Sep 19, 2017
- Hitachi Metals, Ltd.
- Hideyuki Sagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 9,763,336
- Issue date Sep 12, 2017
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication process of stepped circuit board
- Patent number 9,713,261
- Issue date Jul 18, 2017
- SHENZHEN SUNTAK MULTILAYER PCB CO., LTD.
- Jianyuan Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-metallic coating and method of its production
- Patent number 9,677,187
- Issue date Jun 13, 2017
- Cambridge Nanolitic Limited
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Low haze transparent conductive electrodes and method of making the...
- Patent number 9,655,252
- Issue date May 16, 2017
- SUZHOU NUOFEI NANO SCIENCE AND TECHNOLOGY CO., LTD.
- Hakfei Poon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Mitigation and elimination of tin whiskers
- Patent number 9,644,253
- Issue date May 9, 2017
- International Business Machines Corporation
- Eric V. Kline
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Relating to printing
- Patent number 9,586,392
- Issue date Mar 7, 2017
- J P Imaging Limited
- John David Adamson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Security mesh and method of making
- Patent number 9,565,777
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215158
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230422397
- Publication date Dec 28, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING...
- Publication number 20190132957
- Publication date May 2, 2019
- THE CURATORS OF THE UNIVERSITY OF MISSOURI
- Jay A. Switzer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20190019774
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTR...
- Publication number 20180200989
- Publication date Jul 19, 2018
- Rogers Germany GmbH
- Andreas MEYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFORMAL 3D NON-PLANAR MULTI-LAYER CIRCUITRY
- Publication number 20180192513
- Publication date Jul 5, 2018
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR CIRCUIT BOARD BASED ON COPPER CERAMIC SUBS...
- Publication number 20170303404
- Publication date Oct 19, 2017
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- FEI REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING
- Publication number 20170239934
- Publication date Aug 24, 2017
- J P IMAGING LIMITED
- John David Adamson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY
- Publication number 20160360623
- Publication date Dec 8, 2016
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL SUBSTRATE WITH INSULATED VIAS
- Publication number 20160286644
- Publication date Sep 29, 2016
- Cambridge Nanotherm Limited
- Pavel SHASHKOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20160073497
- Publication date Mar 10, 2016
- BYD Company Limited
- Qiang XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150241386
- Publication date Aug 27, 2015
- Industry-Academic Cooperation Foundation, Yonsei University
- Hyungjun KIM
- G01 - MEASURING TESTING
Information Patent Application
Transparent conductive electrodes comprising merged metal nanowires...
- Publication number 20150010695
- Publication date Jan 8, 2015
- NUOVO FILM, INC.
- Hakfei Poon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING LINK BETWEEN AT LE...
- Publication number 20140347821
- Publication date Nov 27, 2014
- Larbi Bendani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrically Insulating Elements And Electrically Conductive Elemen...
- Publication number 20140321032
- Publication date Oct 30, 2014
- Nathan S. Lazarus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INSULATED METAL SUBSTRATE
- Publication number 20140293554
- Publication date Oct 2, 2014
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods of Treating Metal Surfaces and Devices Formed Thereby
- Publication number 20140261897
- Publication date Sep 18, 2014
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262465
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Treating Metal Surfaces and Devices Formed Thereby
- Publication number 20140251502
- Publication date Sep 11, 2014
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BENDABLE CIRCUIT BOARD FOR LED MOUNTING AND INTERCONNECTION
- Publication number 20140226347
- Publication date Aug 14, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- Daniel I. Amey
- F21 - LIGHTING
Information Patent Application
Heat Sink Package
- Publication number 20140217572
- Publication date Aug 7, 2014
- Fairchild Korea Semiconductor, Ltd.
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20140174940
- Publication date Jun 26, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140174794
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...
- Publication number 20140117539
- Publication date May 1, 2014
- Shinko Electric Industries Co., Ltd.
- Yuko KARASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140110023
- Publication date Apr 24, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Hwan LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140096380
- Publication date Apr 10, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE
- Publication number 20140085834
- Publication date Mar 27, 2014
- Sanyo Electric Co., Ltd.
- Keishi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATION AND ELIMINATION OF TIN WHISKERS
- Publication number 20140060907
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Eric V. Kline
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Oxidising metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and device for a high temperature vacuum-safe solder resist...

Metal foils with ordered crystal structure and method for producing...

Substrate for electrical circuits and method for producing a substr...

Conformal 3D non-planar multi-layer circuitry

Substrate for electrical circuits and method for producing a substr...

Process for metallizing a component

Conformal 3D non-planar multi-layer circuitry

Methods of fluxless micro-piercing of solder balls, and resulting d...

Manufacturing method for circuit board based on copper ceramic subs...

Methods of treating metal surfaces and devices formed thereby

Conductive structure body precursor, conductive structure body and...

Flexible electronic substrate

Roughened copper foil, copper clad laminate, and printed circuit board

Methods of fluxless micro-piercing of solder balls, and resulting d...

Method and device for a high temperature vacuum-safe solder stop ut...

Etching method and etching apparatus

Circuit board and method for fabricating the same

Printing

Mitigation and elimination of tin whiskers

Methods of manufacturing structures having concealed components

Conformal 3D non-planar multi-layer circuitry

Microstructure, multilayer wiring board, semiconductor package and...

Printed circuit board and method of manufacturing the same

Methods of treating metal surfaces and devices formed thereby

Fabrication process of stepped circuit board

Non-metallic coating and method of its production

Low haze transparent conductive electrodes and method of making the...

Mitigation and elimination of tin whiskers

Relating to printing

Security mesh and method of making

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

WIRING CIRCUIT BOARD

COMPOSITE COPPER COMPONENTS

METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING...

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTR...

CONFORMAL 3D NON-PLANAR MULTI-LAYER CIRCUITRY

MANUFACTURING METHOD FOR CIRCUIT BOARD BASED ON COPPER CERAMIC SUBS...

PRINTING

METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY

METAL SUBSTRATE WITH INSULATED VIAS

CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

GAS SENSOR AND METHOD OF MANUFACTURING THE SAME

Transparent conductive electrodes comprising merged metal nanowires...

THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING LINK BETWEEN AT LE...

Electrically Insulating Elements And Electrically Conductive Elemen...

INSULATED METAL SUBSTRATE

Methods of Treating Metal Surfaces and Devices Formed Thereby

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Methods of Treating Metal Surfaces and Devices Formed Thereby

BENDABLE CIRCUIT BOARD FOR LED MOUNTING AND INTERCONNECTION

Heat Sink Package

HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF

HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE

MITIGATION AND ELIMINATION OF TIN WHISKERS