Packaging optical devices

Industry

CPC
B81C1/00317

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00317Packaging optical devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 12,078,799
- Issue date Sep 3, 2024
- STMicroelectron S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-height optoelectronic modules and packages
- Patent number 12,037,238
- Issue date Jul 16, 2024
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel Sànchez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with shock and vibration protection
- Patent number 11,975,961
- Issue date May 7, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IR emitter with glass lid
- Patent number 11,926,521
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulant barrier
- Patent number 11,807,522
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 11,675,186
- Issue date Jun 13, 2023
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detachable MEMS package top cover
- Patent number 11,673,795
- Issue date Jun 13, 2023
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Emitter package for a photoacoustic sensor
- Patent number 11,609,180
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical device having inclined optic...
- Patent number 11,584,640
- Issue date Feb 21, 2023
- Robert Bosch GmbH
- Benjamin Steuer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Miniaturized vacuum package and methods of making same
- Patent number 11,551,921
- Issue date Jan 10, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Hayden James Evans McGuinness
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS mirror arrangement for detecting a large angular range
- Patent number 11,531,196
- Issue date Dec 20, 2022
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production method for a micromechanical device having inclined opti...
- Patent number 11,479,461
- Issue date Oct 25, 2022
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulation of wafer level packaging
- Patent number 11,235,971
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system cavity packaging
- Patent number 11,203,524
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,201,096
- Issue date Dec 14, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method for a micromechanical window structure and cor...
- Patent number 11,124,412
- Issue date Sep 21, 2021
- Robert Bosch GmbH
- Joerg Muchow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective wafer including inclined optical windows and device
- Patent number 10,996,461
- Issue date May 4, 2021
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a thermoelectric-based infrared detector h...
- Patent number 10,937,824
- Issue date Mar 2, 2021
- MERIDIAN INNOVATION PTE LTD
- Piotr Kropelnicki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 10,894,712
- Issue date Jan 19, 2021
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,818,619
- Issue date Oct 27, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,770,417
- Issue date Sep 8, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for protecting a MEMS unit against infrared investigations a...
- Patent number 10,759,657
- Issue date Sep 1, 2020
- Robert Bosch GmbH
- Michael Curcic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing optical components using functional elements
- Patent number 10,752,500
- Issue date Aug 25, 2020
- FRAUNHOFER-GESELLSCAFT ZUR FÖRDERUNG ANGEWANDTEN FORSCHUNG E.V.
- Hans Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electro-optical device, manufacturing method of electro-optical dev...
- Patent number 10,739,554
- Issue date Aug 11, 2020
- Seiko Epson Corporation
- Manabu Kondo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
- Publication number 20240239648
- Publication date Jul 18, 2024
- STMicroelectronics S.r.l.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...
- Publication number 20240228265
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package and Method for Encapsulating an MEMS Structure
- Publication number 20230382722
- Publication date Nov 30, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Frank SENGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR
- Publication number 20230384164
- Publication date Nov 30, 2023
- MSG Lithoglas GmbH
- David Bunel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE
- Publication number 20230324678
- Publication date Oct 12, 2023
- STMicroelectronics S.r.l
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...
- Publication number 20230288695
- Publication date Sep 14, 2023
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-MIRROR DIE ATTACHED TO A PACKAGE SUBSTRATE THROUGH DIE ATTACH...
- Publication number 20230139299
- Publication date May 4, 2023
- Beijing Voyager Technology Co., Ltd.
- Sae Won LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOCURRENT NOISE SUPPRESSION FOR MIRROR ASSEMBLY
- Publication number 20220324698
- Publication date Oct 13, 2022
- Sergio Fabien Almeida Loya
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED GLASS PACKAGE
- Publication number 20220219972
- Publication date Jul 14, 2022
- SCHOTT AG
- Robert Hettler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETACHABLE MEMS PACKAGE TOP COVER
- Publication number 20220144626
- Publication date May 12, 2022
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20220077014
- Publication date Mar 10, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE WITH SHOCK AND VIBRATION PROTECTION
- Publication number 20220033253
- Publication date Feb 3, 2022
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IR Emitter with Glass Lid
- Publication number 20210246016
- Publication date Aug 12, 2021
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-HEIGHT OPTOELECTRONIC MODULES AND PACKAGES
- Publication number 20210214214
- Publication date Jul 15, 2021
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel SÀNCHEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL DEVICE HAVING INCLINED OPTI...
- Publication number 20210198102
- Publication date Jul 1, 2021
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Emitter Package for a Photoacoustic Sensor
- Publication number 20210172862
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20210139320
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...
- Publication number 20210028077
- Publication date Jan 28, 2021
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20210013116
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING INCLINED OPTIC...
- Publication number 20200391998
- Publication date Dec 17, 2020
- ROBERT BOSCH GmbH
- Benjamin Steuer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULANT BARRIER
- Publication number 20200339416
- Publication date Oct 29, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGULATION OF WAFER LEVEL PACKAGING
- Publication number 20200231434
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR A MICROMECHANICAL WINDOW STRUCTURE AND COR...
- Publication number 20200231433
- Publication date Jul 23, 2020
- ROBERT BOSCH GmbH
- Joerg Muchow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING
- Publication number 20200189910
- Publication date Jun 18, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A PROTECTIVE WAFER INCLUDING INCLINED OPTI...
- Publication number 20200166743
- Publication date May 28, 2020
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AN MEMS MIRROR ARRANGEMENT AND A METHOD FOR MANUFACTURING AN MEMS M...
- Publication number 20200159006
- Publication date May 21, 2020
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Packaging optical devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetically sealed MEMS mirror and method of manufacture

Low-height optoelectronic modules and packages

MEMS package with shock and vibration protection

IR emitter with glass lid

Packaged device with die wrapped by a substrate

Chip package and manufacturing method thereof

Encapsulant barrier

Hermetically sealed optically transparent wafer-level packages and...

Hermetically sealed MEMS mirror and method of manufacture

Detachable MEMS package top cover

Optical electronics device

Emitter package for a photoacoustic sensor

Method for producing a micromechanical device having inclined optic...

Miniaturized vacuum package and methods of making same

MEMS mirror arrangement for detecting a large angular range

Production method for a micromechanical device having inclined opti...

Singulation of wafer level packaging

Microelectromechanical system cavity packaging

Packaged device with die wrapped by a substrate

Manufacturing method for a micromechanical window structure and cor...

Protective wafer including inclined optical windows and device

Chip packages and methods for forming the same

Method for manufacturing a thermoelectric-based infrared detector h...

Optical electronics device

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Method for protecting a MEMS unit against infrared investigations a...

Method for producing optical components using functional elements

Electro-optical device, manufacturing method of electro-optical dev...

Patents Applicationslast 30 patents

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MEMS Package and Method for Encapsulating an MEMS Structure

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...

MICRO-MIRROR DIE ATTACHED TO A PACKAGE SUBSTRATE THROUGH DIE ATTACH...

PHOTOCURRENT NOISE SUPPRESSION FOR MIRROR ASSEMBLY

HERMETICALLY SEALED GLASS PACKAGE

DETACHABLE MEMS PACKAGE TOP COVER

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

MEMS PACKAGE WITH SHOCK AND VIBRATION PROTECTION

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

IR Emitter with Glass Lid

LOW-HEIGHT OPTOELECTRONIC MODULES AND PACKAGES

PRODUCTION METHOD FOR A MICROMECHANICAL DEVICE HAVING INCLINED OPTI...

Emitter Package for a Photoacoustic Sensor

OPTICAL ELECTRONICS DEVICE

HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING INCLINED OPTIC...

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

ENCAPSULANT BARRIER

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

SINGULATION OF WAFER LEVEL PACKAGING

MANUFACTURING METHOD FOR A MICROMECHANICAL WINDOW STRUCTURE AND COR...

MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING

METHOD FOR MANUFACTURING A PROTECTIVE WAFER INCLUDING INCLINED OPTI...

AN MEMS MIRROR ARRANGEMENT AND A METHOD FOR MANUFACTURING AN MEMS M...