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CPC
H05K1/114

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/114Pad being close to via, but not surrounding the via

Industries

Patents Grantslast 30 patents

Information Patent Grant
Breakout structure for an integrated circuit device
- Patent number 11,812,544
- Issue date Nov 7, 2023
- Xilinx, Inc.
- Shad Shepston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D-printed ceramics with conductor infusion for ultra-high-speed el...
- Patent number 11,770,906
- Issue date Sep 26, 2023
- Schlumberger Technology Corporation
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board layout
- Patent number 11,770,900
- Issue date Sep 26, 2023
- ABB Schweiz AG
- Alok K. Lohia
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device having substrate
- Patent number 11,756,865
- Issue date Sep 12, 2023
- Industrial Technology Research Institute
- Sheng-Che Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, chip, series circuit, circuit board and electron...
- Patent number 11,758,654
- Issue date Sep 12, 2023
- BITMAIN DEVELOPMENT PTE. LTD.
- Tong Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and electronic device comprising same
- Patent number 11,497,116
- Issue date Nov 8, 2022
- STEMCO CO., LTD.
- Jin Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed traceless interconnect
- Patent number 11,482,802
- Issue date Oct 25, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic device
- Patent number 11,229,115
- Issue date Jan 18, 2022
- Hitachi, Ltd.
- Norio Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and display device
- Patent number 11,204,659
- Issue date Dec 21, 2021
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Ning Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device comprising flexible printed circuit board having...
- Patent number 11,202,364
- Issue date Dec 14, 2021
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil component
- Patent number 11,107,620
- Issue date Aug 31, 2021
- Sumida Corporation
- Tomoyuki Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,083,086
- Issue date Aug 3, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-Package device ball map and layout optimization
- Patent number 11,032,910
- Issue date Jun 8, 2021
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space transformer and manufacturing method thereof
- Patent number 11,018,082
- Issue date May 25, 2021
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming circuit board stacked structure
- Patent number 11,013,103
- Issue date May 18, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,959,322
- Issue date Mar 23, 2021
- Tyco Electronics Japan G.K.
- Kenta Sato
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board
- Patent number 10,912,189
- Issue date Feb 2, 2021
- Pegatron Corporation
- Te-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage determination device
- Patent number 10,877,078
- Issue date Dec 29, 2020
- Keihin Corporation
- Yuzuru Takashima
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,813,214
- Issue date Oct 20, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board and manufacturing method thereof
- Patent number 10,779,407
- Issue date Sep 15, 2020
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Yi-Chun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,772,204
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer system and motherboard thereof
- Patent number 10,740,279
- Issue date Aug 11, 2020
- ASUSTeK COMPUTER Inc.
- Li-Chien Wan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array type discrete decoupling under BGA grid
- Patent number 10,743,408
- Issue date Aug 11, 2020
- ALCATEL LUCENT
- James M. Schriel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and integrated circuit package
- Patent number 10,716,207
- Issue date Jul 14, 2020
- Innovium, Inc.
- Yongming Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device for detecting pressure
- Patent number 10,648,873
- Issue date May 12, 2020
- LG Innotek Co., Ltd
- Yong Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,651,118
- Issue date May 12, 2020
- Denso Corporation
- Kosuke Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On board transceiver assembly having hold down member
- Patent number 10,638,629
- Issue date Apr 28, 2020
- FCI USA LLC
- John P. Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240251503
- Publication date Jul 25, 2024
- Shenzhen Jufei Optoelectronics Co., Ltd.
- Mingquan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240155776
- Publication date May 9, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-LEVEL PAD PATTERN FOR MULTI-ROW QFN PACKAGES
- Publication number 20230217591
- Publication date Jul 6, 2023
- MEDIATEK INC.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BREAKOUT STRUCTURE FOR AN INTEGRATED CIRCUIT DEVICE
- Publication number 20230199941
- Publication date Jun 22, 2023
- Xilinx, Inc.
- Shad SHEPSTON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Layout
- Publication number 20230189443
- Publication date Jun 15, 2023
- ABB Schweiz AG
- Alok K. Lohia
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20230141357
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Gidae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...
- Publication number 20230082556
- Publication date Mar 16, 2023
- Canon Kabushiki Kaisha
- Masayoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...
- Publication number 20230069147
- Publication date Mar 2, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND MANUFACTURING METHOD THEREOF
- Publication number 20220254708
- Publication date Aug 11, 2022
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
CONTROL CIRCUIT BOARD
- Publication number 20220225495
- Publication date Jul 14, 2022
- WACOM CO., LTD.
- Kohei HAYASHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH SPEED TRACELESS INTERCONNECT
- Publication number 20220181807
- Publication date Jun 9, 2022
- Cisco Technology, Inc.
- Jason Visneski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD HAVING...
- Publication number 20210274645
- Publication date Sep 2, 2021
- Samsung Electronics Co., LTD
- Eunseok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING SUBSTRATE
- Publication number 20210257279
- Publication date Aug 19, 2021
- Industrial Technology Research Institute
- Sheng-Che HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE, CHIP, SERIES CIRCUIT, CIRCUIT BOARD AND ELECTRON...
- Publication number 20210161011
- Publication date May 27, 2021
- BITMAIN TECHNOLOGIES LIMITED
- Tong ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20210105893
- Publication date Apr 8, 2021
- PEGATRON CORPORATION
- Te-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module With Single or Multiple Components Partially Surr...
- Publication number 20210084747
- Publication date Mar 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL ROUTING COMPONENT LAYOUT FOR CROSSTALK REDUCTION
- Publication number 20200083155
- Publication date Mar 12, 2020
- Intel Corporation
- Raul ENRIQUEZ SHIBAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES
- Publication number 20200068711
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas Wolter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20200045809
- Publication date Feb 6, 2020
- PEGATRON CORPORATION
- Te-Yu Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPACE TRANSFORMER AND MANUFACTURING METHOD THEREOF
- Publication number 20200033381
- Publication date Jan 30, 2020
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373713
- Publication date Dec 5, 2019
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190297727
- Publication date Sep 26, 2019
- Murata Manufacturing Co., Ltd.
- Takahiro BABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190244886
- Publication date Aug 8, 2019
- DENSO CORPORATION
- Kosuke SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190215958
- Publication date Jul 11, 2019
- IBIDEN CO., LTD.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pad being close to via, but not surrounding the via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Breakout structure for an integrated circuit device

Systems and methods for break out of interconnections for high-dens...

3D-printed ceramics with conductor infusion for ultra-high-speed el...

Printed circuit board layout

Electronic device having substrate

Circuit substrate, chip, series circuit, circuit board and electron...

Circuit board and method for manufacturing the same

Flexible circuit board and electronic device comprising same

High speed traceless interconnect

Electronic module with single or multiple components partially surr...

Wiring board and electronic device

Flexible circuit board and display device

Electronic device comprising flexible printed circuit board having...

Coil component

Printed wiring board and method for manufacturing printed wiring board

System-in-Package device ball map and layout optimization

Space transformer and manufacturing method thereof

Method for forming circuit board stacked structure

Printed circuit board

Circuit board

Voltage determination device

Cavities containing multi-wiring structures and devices

Multilayer circuit board and manufacturing method thereof

Electronic device

Computer system and motherboard thereof

Array type discrete decoupling under BGA grid

Printed circuit board and integrated circuit package

Sensor device for detecting pressure

Electronic device

On board transceiver assembly having hold down member

Patents Applicationslast 30 patents

ELECTRONIC SYSTEM

CIRCUIT BOARD AND ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

BOARD-LEVEL PAD PATTERN FOR MULTI-ROW QFN PACKAGES

BREAKOUT STRUCTURE FOR AN INTEGRATED CIRCUIT DEVICE

CIRCUIT BOARD

Printed Circuit Board Layout

ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...

DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...

3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER AND MANUFACTURING METHOD THEREOF

CONTROL CIRCUIT BOARD

HIGH SPEED TRACELESS INTERCONNECT

ELECTRONIC DEVICE COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD HAVING...

ELECTRONIC DEVICE HAVING SUBSTRATE

CIRCUIT SUBSTRATE, CHIP, SERIES CIRCUIT, CIRCUIT BOARD AND ELECTRON...

CIRCUIT BOARD

Electronic Module With Single or Multiple Components Partially Surr...

ELECTRICAL ROUTING COMPONENT LAYOUT FOR CROSSTALK REDUCTION

COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES

CIRCUIT BOARD

SPACE TRANSFORMER AND MANUFACTURING METHOD THEREOF

STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE

ELECTRONIC DEVICE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME